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    • 51. 发明授权
    • Topography simulation method
    • 地形模拟方法
    • US5889678A
    • 1999-03-30
    • US855814
    • 1997-05-12
    • Soichi InoueSatoshi TanakaShoji MimotogiYasunobu Onishi
    • Soichi InoueSatoshi TanakaShoji MimotogiYasunobu Onishi
    • G03F7/20G06F17/50H01L21/00H01L21/027
    • G06F17/5018
    • In a topography simulation method, the topography of a resist pattern after curing treatment can be precisely estimated without producing a complex physical model or performing parameter measurement. Specifically, in the method of estimating the topography of a resist pattern, which is formed by selectively removing a part of a resist provided on a substrate and contracts due to curing treatment, the resist pattern is divided into a plurality of cells and the cells are contracted in accordance with a volume shrinkage amount per unit volume of the resist in the curing treatment. Then, the cells located closer to an interface between the substrate and the resist pattern are flattened to a higher degree in parallel to the substrate, and the deformed cells are brought together toward a shrinkage reference line passing through a center of a line pattern and toward the substrate.
    • 在地形模拟方法中,可以精确地估计固化处理后的抗蚀剂图案的形貌,而不产生复杂的物理模型或进行参数测量。 具体地,在通过选择性地去除设置在基板上的抗蚀剂的一部分并且由于固化处理而收缩而形成的抗蚀剂图案的形貌的估计方法中,抗蚀剂图案被分成多个单元,并且单元是 根据固化处理中的抗蚀剂的单位体积的体积收缩量收缩。 然后,更靠近基板和抗蚀剂图案之间的界面的单元平行于基板平坦化,并且将变形的单元一起朝向通过线图案的中心的收缩参考线并朝向 底物。
    • 56. 发明申请
    • Lithography simulation method, mask pattern preparation method, semiconductor device manufacturing method and recording medium
    • 光刻模拟法,掩模图案制备方法,半导体器件制造方法和记录介质
    • US20090019418A1
    • 2009-01-15
    • US12222479
    • 2008-08-11
    • Toshiya KotaniShigeki NojimaShoji Mimotogi
    • Toshiya KotaniShigeki NojimaShoji Mimotogi
    • G06F17/50G06K9/00
    • G03F7/70433G03F7/705
    • A lithography simulation method includes: taking in design data of a pattern to be formed on a substrate and mask data to prepare a mask pattern used in forming a latent image of the pattern on the substrate by transmission of an energy ray; obtaining the latent image of the pattern by calculation of an intensity of the energy ray; locally changing, at least in a portion corresponding to a pattern to be interested, a relative position in a direction of the intensity of the energy ray between a latent image curve and a reference intensity line in accordance with a distance between the pattern to be interested and a pattern of a neighboring region, the latent image curve being an intensity distribution curve of the energy ray constituting the latent image, the reference intensity line being defined to specify a position of an edge of the pattern to be interested; and calculating a distance between intersections of a portion of the latent image curve corresponding to the pattern to be interested and the reference intensity line in the changed relative position to define an interested line width of the pattern to be interested.
    • 光刻模拟方法包括:获取要在基板上形成的图案的设计数据,并且掩模数据,以通过透射能量线来制备用于在基板上形成图案的潜像所使用的掩模图案; 通过计算能量射线的强度来获得图案的潜像; 至少在与感兴趣的图案对应的部分中,根据感兴趣的图案之间的距离,在潜像图像曲线和参考强度线之间的能量射线的强度的方向上的相对位置 以及相邻区域的图案,所述潜像曲线是构成所述潜像的能量射线的强度分布曲线,所述基准强度线被定义为指定所述图案的边缘的位置; 以及计算与感兴趣的图案对应的潜在图像曲线的一部分的交点与变化的相对位置中的基准强度线之间的距离,以定义感兴趣的图案的感兴趣的线宽。
    • 57. 发明授权
    • Projection exposure mask acceptance decision system, projection exposure mask acceptance decision method, method for manufacturing semiconductor device, and computer program project
    • 投影曝光掩模验收决策系统,投影曝光掩模验收决策方法,半导体器件制造方法和计算机程序项目
    • US07446852B2
    • 2008-11-04
    • US11653279
    • 2007-01-16
    • Yukiyasu ArisawaShoji MimotogiShigeru Hasebe
    • Yukiyasu ArisawaShoji MimotogiShigeru Hasebe
    • G03B27/68G03B27/52G03F1/00
    • G03F1/84G03F7/705G03F7/70525
    • A projection exposure mask acceptance decision system includes assurance object measuring unit to measure quality assurance objects relating to projection exposure mask, first exposure characteristic deterioration quantity calculating unit to calculate first exposure characteristic deterioration quantity caused by deviations in average values of the quality assurance objects measured by the measuring unit, second exposure characteristic deterioration quantity calculating unit to calculate second exposure characteristic deterioration quantity caused by dispersion in the quality assurance objects measured by the measuring unit, sum calculating unit to calculate simple sum of the first and second quantity, root sum square calculating unit to calculate root sum square of the first and second quantity, entire exposure characteristic deterioration quantity calculating unit to calculate entire exposure characteristic deterioration quantity as an interior division value of the simple sum and root sum square, and judgment unit to judge whether the entire exposure characteristic deterioration quantity is acceptable value.
    • 投影曝光掩模验收判定系统包括:保证对象测量单元,用于测量与投影曝光掩模相关的质量保证对象;第一曝光特性劣化量计算单元,用于计算由质量保证对象的平均值偏差引起的第一曝光特性劣化量, 测量单元,第二曝光特性劣化量计算单元,用于计算由测量单元测量的质量保证对象中由色散引起的第二曝光特性劣化量;和计算单元,计算第一和第二数量的简单和, 计算第一和第二数量的总和平均值的单位,全部曝光特性劣化量计算单元,计算作为简单和的r的内部分割值的整体曝光特性劣化量 总和平方和判断单元判断整个曝光特性劣化量是否为可接受值。