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51. 发明授权

US07449154B2 Chemical-containing formed material of type of heating of whole the material, container for holding chemical-containing formed material, device for heating and transpiring chemical and indicator for chemical to be heated and vaporized 有权
标题翻译：含化学成分的材料，整个材料的加热类型，用于保持含化学成分的材料的容器，用于加热和蒸发化学品的装置以及待加热和蒸发的化学品的指示剂
公开(公告)号：US07449154B2
公开(公告)日：2008-11-11
申请号：US10433519
申请日：2001-09-06
申请人： Satoshi Yamasaki , Kazunori Yamamoto , Tomoko Ishizuka
发明人： Satoshi Yamasaki , Kazunori Yamamoto , Tomoko Ishizuka
IPC分类号： A62B7/08
CPC分类号： A01M1/2077 , A01M1/2055 , A01N25/18 , A61L9/02 , A61L9/03
摘要： Disclosed are a chemical carrier body capable of volatilizing a chemical stably for an extended period of time, a receptacle for retaining the chemical carrier body, an indicator adapted for displaying a degree of consumption of a chemical contained in the chemical carrier body, and a chemical heating, volatilizing apparatus adapted for heating the chemical carrier body.The chemical carrier body retaining receptacle is provided with at least one vent hole and has its inner surface spaced from the carrier body by a distance of 1 to 10 mm.The indicator has a mark gradually disappearing and a mark gradually appearing with a lapse of time of heating.The chemical heating, volatilizing apparatus has a heater element that is lager in size than the bottom surface of the chemical carrier body retaining receptacle and whose heat releasing surface is inclined at an angle of 0 to 70 degrees with respect to the plane on which the apparatus is placed.
摘要翻译：公开了一种能够长时间稳定地挥发化学品的化学载体体，用于保持化学载体的容器，适于显示化学载体主体中所含化学物质的消耗程度的指示剂，以及化学载体用于加热化学载体的加热，挥发装置。化学载体体保持容器设置有至少一个通气孔，并且其内表面与载体本体隔开1至10mm的距离。指标逐渐消失，随着时间的推移逐渐出现标记。化学加热挥发装置具有加热器元件，该加热器元件的尺寸比化学载体本体保持容器的底表面大，并且其散热表面相对于该装置的平面以0至70度的角度倾斜被放置

52. 发明授权

US07239013B2 Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device 有权
标题翻译：多层布线板及其制造方法，半导体装置及无线电电子装置
公开(公告)号：US07239013B2
公开(公告)日：2007-07-03
申请号：US10521470
申请日：2003-05-30
申请人： Yasushi Shimada , Yoshitaka Hirata , Hiroyuki Kuriya , Kazuhisa Otsuka , Masanori Yamaguchi , Yuichi Shimayama , Ken Madarame , Etsuo Mizushima , Yuusuke Kondou , Kazunori Yamamoto
发明人： Yasushi Shimada , Yoshitaka Hirata , Hiroyuki Kuriya , Kazuhisa Otsuka , Masanori Yamaguchi , Yuichi Shimayama , Ken Madarame , Etsuo Mizushima , Yuusuke Kondou , Kazunori Yamamoto
IPC分类号： H01L23/52
CPC分类号： H05K1/162 , H05K3/4602 , H05K2201/0347 , H05K2201/09509 , H05K2201/0959
摘要： A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a radio electronic device mounting the semiconductor device.
摘要翻译：具有优异的成形性的多层布线基板和具有抑制电容变化的电容器，其制造方法，在多层布线板上安装半导体芯片的半导体器件，以及安装该半导体器件的无线电电子器件。

53. 发明申请

US20070108588A1 Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device 失效
标题翻译：多层布线基板，其制造方法，半导体装置以及无线电子装置
公开(公告)号：US20070108588A1
公开(公告)日：2007-05-17
申请号：US11653417
申请日：2007-01-16
申请人： Yasushi Shimada , Yoshitaka Hirata , Hiroyuki Kuriya , Kazuhisa Otsuka , Masanori Yamaguchi , Yuichi Shimayama , Ken Madarame , Etsuo Mizushima , Yuusuke Kondou , Kazunori Yamamoto
发明人： Yasushi Shimada , Yoshitaka Hirata , Hiroyuki Kuriya , Kazuhisa Otsuka , Masanori Yamaguchi , Yuichi Shimayama , Ken Madarame , Etsuo Mizushima , Yuusuke Kondou , Kazunori Yamamoto
IPC分类号： H01L23/52
CPC分类号： H05K1/162 , H05K3/4602 , H05K2201/0347 , H05K2201/09509 , H05K2201/0959
摘要： A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a wireless electronic device mounting the semiconductor device.
摘要翻译：具有优异成型性的多层布线基板和具有抑制电容变化的电容器，其制造方法，在多层布线板上安装半导体芯片的半导体器件以及安装半导体器件的无线电子器件。

54. 发明申请

US20070097162A1 Liquid ejection apparatus, liquid ejection method, and method for forming wiring pattern of circuit board 审中-公开
标题翻译：液体喷射装置，液体喷射方法以及用于形成电路板布线图案的方法
公开(公告)号：US20070097162A1
公开(公告)日：2007-05-03
申请号：US10567484
申请日：2004-07-29
申请人： Hironobu Iwashita , Kazunori Yamamoto , Shigeru Nishio , Kazuhiro Murata
发明人： Hironobu Iwashita , Kazunori Yamamoto , Shigeru Nishio , Kazuhiro Murata
IPC分类号： B41J29/38
CPC分类号： B41J2/06 , B41J2002/14395 , H05K3/1241
摘要： A liquid ejection apparatus includes: a liquid ejection head (56) having a nozzle (51) for ejecting a droplet of charged solution from the tip portion; an ejection electrode (58) provided on the liquid ejection head, to which a voltage is applied for generating an electric field to eject the droplet; a voltage applying unit (35) for applying the voltage to the ejection electrode; a substrate K including insulative material for receiving the ejected droplet; and an ejection atmosphere adjusting unit (70) for keeping an atmosphere subject to ejection from the liquid ejection head, to a dew point of 9 degrees centigrade or more and less than a water saturation temperature.
摘要翻译：液体喷射装置包括：具有喷嘴（51）的液体喷射头（56），用于从尖端部分喷射带电溶液液滴; 设置在液体喷射头上的喷射电极（58），施加电压以产生电场以喷射液滴; 用于向喷射电极施加电压的电压施加单元（35）; 衬底K，包括用于接收喷射液滴的绝缘材料; 以及用于将从液体喷射头喷射的气氛保持在露点为9摄氏度以上且小于水饱和温度的喷射气氛调节单元（70）。

55. 发明申请

US20070061478A1 Data relay apparatus and data relay method 审中-公开
标题翻译：数据中继装置和数据中继方法
公开(公告)号：US20070061478A1
公开(公告)日：2007-03-15
申请号：US11518997
申请日：2006-09-12
申请人： Kazunori Yamamoto , Hideharu Suzuki
发明人： Kazunori Yamamoto , Hideharu Suzuki
IPC分类号： G06F15/16
CPC分类号： H04L47/10 , H04L1/1607 , H04L1/1867 , H04L47/34 , H04L2001/0097 , H04W80/00
摘要： There is provided a data relay apparatus and a data relay method which prevent data units from being sent out to a communication network in a burst-like manner by the order assurance function, in consideration of the type of data unit. A type determination section 305 of a data relay apparatus 300 determines the type of a received data unit. An order determination section 304 determines whether or not the arrival order of the received data unit is correct. If it is determined that the arrival order of Ack is not correct, based on the determination results by the order determination section 304 and the type determination section 305, an order assurance function control section 303 disables the order assurance function for the Ack and immediately transmits it.
摘要翻译：提供了数据中继装置和数据中继方法，该数据中继装置和数据中继方法考虑到数据单元的类型，通过订单保证功能，防止数据单元以突发状态发送到通信网络。数据中继装置300的类型确定部分305确定接收数据单元的类型。订单确定部304判定接收数据单元的到达顺序是否正确。如果确定Ack的到达顺序不正确，则根据订单确定部分304和类型确定部分305的确定结果，订单保证功能控制部分303禁止Ack的订单保证功能并立即发送它。

56. 发明授权

US07118601B2 Parallel linkage and artificial joint device using the same 失效
公开(公告)号：US07118601B2
公开(公告)日：2006-10-10
申请号：US10376169
申请日：2003-02-28
申请人： Yuji Yasui , Hiroshi Kiyomoto , Isao Usukura , Youichi Nakahara , Haruyuki Iwasaki , Shungo Umeda , Kazunori Yamamoto , Masamitsu Shiono , Kazuo Okada , Manabu Nakayama , Atsushi Kubo
发明人： Yuji Yasui , Hiroshi Kiyomoto , Isao Usukura , Youichi Nakahara , Haruyuki Iwasaki , Shungo Umeda , Kazunori Yamamoto , Masamitsu Shiono , Kazuo Okada , Manabu Nakayama , Atsushi Kubo
IPC分类号： A61F2/48
CPC分类号： B25J17/0266 , A61F2/583 , A61F2/586 , A61F2/60 , A61F2/66 , A61F2/6607 , A61F2/72 , A61F2002/30517 , A61F2002/5001 , A61F2002/5003 , A61F2002/5059 , A61F2002/5066 , A61F2002/5072 , A61F2002/5075 , A61F2002/5084 , A61F2002/5098 , A61F2002/543 , A61F2002/587 , A61F2002/6621 , A61F2002/701 , A61F2002/704 , A61F2002/708 , A61F2002/747 , A61F2002/7625 , A61F2220/0025 , B25J9/0057 , B25J19/0091 , B62D57/02 , Y10T403/32008 , Y10T403/32032 , Y10T403/7077
摘要： There are provided an artificial joint device that can realize an artificial limb enabling twisting motion without a drive source, and when with the drive source, reduce the size and costs of the device, and a parallel linkage that can realize the device. The linkage connects a foot portion and a mounting plate spaced from each other. A fixed link has one end fixed to the plate, and the other end connected to the foot portion via a ball joint, making the angle of the fixed link relative to the foot portion changeable in any direction. Expansible links extend between the foot portion and the plate in an expansible/contractible manner and each have opposite ends connected to the plate and the foot portion via respective upper and lower ball joints, making respective angles thereof relative to the foot portion and the plate changeable in any direction.

57. 发明授权

US07110600B1 Document identifying device and method 有权
标题翻译：文件识别装置和方法
公开(公告)号：US07110600B1
公开(公告)日：2006-09-19
申请号：US10049635
申请日：1999-09-30
申请人： Takayuki Matsui , Yutaka Katsumata , Kazunori Yamamoto , Shinichi Eguchi
发明人： Takayuki Matsui , Yutaka Katsumata , Kazunori Yamamoto , Shinichi Eguchi
IPC分类号： G06K9/34 , G06K9/00
CPC分类号： G06K9/2054 , G06K2209/01
摘要： The invention relates to a document discriminating apparatus and a discriminating method for use in processing documents at financial institutions. A characteristic portion inherent in an optional format is cut out from image data read from a document in the optional format. Color constituents of the cut out image data are analyzed, and a color constituent exhibiting characteristics is selected from the constituents, and a color separation parameter is set for the selected color constituent. Data information is prepared which is related to the image data cut out based upon the color separation parameter. On the other hand, data information is prepared from image data obtained by reading a document to be discriminated based on the color separation parameter. Then, the data information is compared for determination with the data information stored in the document discriminating dictionary unit, whereby the document is discriminated.
摘要翻译：本发明涉及一种在金融机构处理文件的文件鉴别装置和鉴别方法。从可选格式的文档读取的图像数据中切出可选格式固有的特征部分。分析切出的图像数据的颜色成分，并从成分中选择显示特征的颜色成分，并为所选色成分设定色分离参数。准备与基于颜色分离参数切出的图像数据有关的数据信息。另一方面，从通过根据颜色分离参数读取待鉴别的文档获得的图像数据来准备数据信息。然后，将数据信息与存储在文档识别字典单元中的数据信息进行比较以确定文档，从而识别文档。

58. 发明授权

US06223429B1 Method of production of semiconductor device 失效
标题翻译：半导体器件的生产方法
公开(公告)号：US06223429B1
公开(公告)日：2001-05-01
申请号：US08981509
申请日：1998-07-30
申请人： Aizou Kaneda , Masaaki Yasuda , Itsuo Watanabe , Tomohisa Ohta , Fumio Inoue , Yoshiaki Tsubomatsu , Toshio Yamazaki , Hiroto Ohata , Kenzo Takemura , Akira Nagai , Osamu Watanabe , Naoyuki Shiozawa , Kazuyoshi Kojima , Toshiaki Tanaka , Kazunori Yamamoto
发明人： Aizou Kaneda , Masaaki Yasuda , Itsuo Watanabe , Tomohisa Ohta , Fumio Inoue , Yoshiaki Tsubomatsu , Toshio Yamazaki , Hiroto Ohata , Kenzo Takemura , Akira Nagai , Osamu Watanabe , Naoyuki Shiozawa , Kazuyoshi Kojima , Toshiaki Tanaka , Kazunori Yamamoto
IPC分类号： H05K330
CPC分类号： H01L24/83 , H01L23/3121 , H01L23/49816 , H01L23/49883 , H01L24/29 , H01L24/32 , H01L24/97 , H01L25/18 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29384 , H01L2224/29444 , H01L2224/29469 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/73253 , H01L2224/81192 , H01L2224/8319 , H01L2224/838 , H01L2224/83951 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H01L2924/19041 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2924/00 , H01L2224/13111 , H01L2924/00014
摘要： To provide a highly reliable semiconductor device structure that enables cost reduction in the production of packages, inclusive of the cost for chips, and may cause less changes in connection resistance even under conditions of a long-term environmental resistance test. In a semiconductor device comprising a semiconductor chip face-down bonded to a wiring board, it has a structure wherein projecting metal portions are provided at the opposing wiring board terminals without forming bumps on bonding pads of the chip, the whole chip surface is bonded with an organic, anisotropic conductive adhesive material, and the whole or at least an edge of the back of the chip is covered with a sealing material.
摘要翻译：为了提供高可靠性的半导体器件结构，其能够降低封装的生产成本，包括芯片的成本，并且即使在长期耐环境测试的条件下也可能导致连接电阻的变化较小。在包括面向下接合到布线板的半导体芯片，其结构是在相对的布线板端子处设置突出的金属部分，而不在芯片的焊盘上形成凸块，整个芯片表面用有机的各向异性导电粘合剂材料，并且芯片的背面的整个或至少一个边缘被密封材料覆盖。

59. 发明申请

US20140242362A1 COMPOSITION SET, CONDUCTIVE SUBSTRATE AND METHOD OF PRODUCING THE SAME, AND CONDUCTIVE ADHESIVE COMPOSITION 有权
标题翻译：组成物，导电性基材及其制造方法和导电性粘合剂组合物
公开(公告)号：US20140242362A1
公开(公告)日：2014-08-28
申请号：US14236343
申请日：2012-07-30
申请人： Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Shunya Yokosawa , Takaaki Noudou , Maki Inada , Kyoko Kuroda
发明人： Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Shunya Yokosawa , Takaaki Noudou , Maki Inada , Kyoko Kuroda
IPC分类号： C09J9/02 , H01B13/00 , C09J11/04
CPC分类号： C09J9/02 , B05D5/12 , C08K3/08 , C08K3/22 , C08K7/18 , C09J7/28 , C09J11/04 , C09J2201/602 , C09J2203/326 , C09J2205/102 , H01B1/22 , H01B13/00 , H05K1/0306 , H05K1/095 , H05K1/097 , H05K3/105 , H05K3/1208 , H05K3/1283 , H05K3/38 , H05K2203/1157 , Y10T428/24967 , Y10T428/25
摘要： The invention provides a composition set comprising: a conductor layer-forming composition comprising a dispersing medium and inorganic particles comprising a metallic oxide; and a conductive adhesive composition comprising a binder and conductive particles having a number average particle size of from 1 nm to 3000 nm.
摘要翻译：本发明提供一种组合物组合物，其包含：导体层形成组合物，其包含分散介质和包含金属氧化物的无机颗粒; 以及包含粘合剂和数均粒径为1nm〜3000nm的导电性粒子的导电性粘合剂组合物。

60. 发明授权

US08356734B2 Trigger type head cap for an aerosol sprayer 有权
标题翻译：触发式喷头头盖
公开(公告)号：US08356734B2
公开(公告)日：2013-01-22
申请号：US12523198
申请日：2007-12-12
申请人： Toshiaki Oshimo , Hideo Kawamori , Kazunori Yamamoto
发明人： Toshiaki Oshimo , Hideo Kawamori , Kazunori Yamamoto
IPC分类号： B65D83/00 , B67B1/00
CPC分类号： B65D83/24 , B65D83/206
摘要： A trigger type head cap for an aerosol sprayer allows residual gas inside of an aerosol container of the sprayer to be easily and reliably discharged and eliminated. The cap includes a cap cover to be placed on the aerosol container, which has a stem provided on a top thereof; a tubular member that has a stem mating part to mate with the stem and ends with a jet orifice to form a flow path continuous from the stem mating part to the jet orifice in the tubular member; and a trigger lever member capable of thrusting down the stem mating part. In addition, the cap has a rotatable rotary stopper (21) to hold the stem mating part in the state that it is thrust down, and a stopper operating lever for effecting rotation of the stopper.
摘要翻译：用于气溶胶喷雾器的触发式头盖允许容易且可靠地排出和消除喷雾器的气溶胶容器内部的残留气体。盖子包括一个盖子盖子，放置在气溶胶容器上，该盖子盖子设置在其顶部; 管状构件，其具有杆部匹配部分，以与杆部配合并且端部具有喷射孔，以形成从杆配合部分连接到管状构件中的喷射孔的流动路径; 以及能够向下推动杆配合部分的触发杆构件。此外，盖具有可旋转的旋转止动器（21），以在其被推下的状态下保持杆配合部分;以及止动器操作杆，用于实现止动件的旋转。

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