会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 54. 发明授权
    • Method for fabricating a semiconductor component having at least one transistor cell and an edge cell
    • 用于制造具有至少一个晶体管单元和边缘单元的半导体元件的方法
    • US06833298B2
    • 2004-12-21
    • US10384998
    • 2003-03-10
    • Hans Weber
    • Hans Weber
    • H01L218234
    • H01L29/7802H01L29/41766
    • The present invention relates to a method for fabricating a semiconductor component having at least one transistor cell and an edge cell. The method includes providing a semiconductor body having a channel zone in the region of a transistor cell, a first terminal zone in the region of an edge cell, an insulation layer applied to a front side of the semiconductor body, and an electrode layer applied to the insulation layer. The electrode layer and the insulation layer are patterned in the region of the edge cell and the transistor cell and serve for fabricating complementary doped regions in the channel zone and the first terminal zone. In the region of the edge cell, the patterned electrode layer serves for the subsequent removal of the complementary doped zone during the fabrication of a contact hole.
    • 本发明涉及一种制造具有至少一个晶体管单元和边缘单元的半导体元件的方法。 该方法包括提供在晶体管单元的区域中具有沟道区的半导体本体,在边缘单元的区域中的第一端子区,施加到半导体本体的前侧的绝缘层,以及施加到 绝缘层。 电极层和绝缘层在边缘电池和晶体管单元的区域中被图案化,并且用于在沟道区和第一端区中制造互补掺杂区。 在边缘单元的区域中,图案化的电极层用于随后在制造接触孔期间去除互补掺杂区。
    • 55. 发明授权
    • Mechanism for the removal of slag in incineration plants
    • 焚烧厂除渣机理
    • US4976206A
    • 1990-12-11
    • US422966
    • 1989-10-18
    • Hansruedi SteinerHans Weber
    • Hansruedi SteinerHans Weber
    • F23J1/02
    • F23J1/02F23J2900/01021
    • A mechanism for the removal of incombustible residues from an incineration plant includes a slag shaft, a slag tank positioned under a mouth of the slag shaft and filled with water extending up to the mouth of the shaft. The incombustible residues dropping from the incineration plant furnace grate through the slag shaft collect in the slag tank and are discharged therefrom by a pusher plate via an upwardly sloping discharge path. The pusher plate is in operative connection with two thrust piston drives via two thrust rods and two rocking levers. The joint connecting the thrust rod with the rocking lever is arranged in such a way that it is not immersed in the water bath either in the rear position of the pusher plate or in the discharge position of the pusher plate. Through the direct coupling to the joint, the thrust rod and the rocking lever can operate in the same vertical plane, so that no additional moments are exerted on the rocking shaft. This leads to a longer life for the lint and also to increased operational reliability and easier maintenance.
    • 用于从焚化厂除去不可燃残余物的机构包括炉渣杆,位于炉渣杆口下方的炉渣罐,并且填充有直到轴的口部延伸的水。 从焚烧炉炉排落下的不燃物残渣通过炉渣收集在渣槽中,并通过向上倾斜的排放路径由推动板排出。 推动板通过两个推力杆和两个摇杆与两个推力活塞驱动器操作连接。 将推杆与摆动杆连接的连接部配置成不会在推动板的后方位置或推动板的排出位置处浸入水浴中。 通过与接头的直接连接,推杆和摇杆可以在相同的垂直平面上运行,从而不会在摇摆轴上施加额外的力矩。 这样可以延长棉绒的使用寿命,同时提高操作的可靠性和更容易的维护。
    • 58. 发明授权
    • Semiconductor arrangement with active drift zone
    • 具有主动漂移区的半导体装置
    • US08866253B2
    • 2014-10-21
    • US13362038
    • 2012-01-31
    • Rolf WeisGerald DeboyMichael TreuArmin WillmerothHans Weber
    • Rolf WeisGerald DeboyMichael TreuArmin WillmerothHans Weber
    • H01L27/00
    • H01L27/0207H01L21/84H01L21/845H01L27/06H01L27/0629H01L27/088H01L27/0886H01L27/1211H01L29/4236H01L29/78H03K17/063H03K17/102
    • A semiconductor device arrangement includes a first semiconductor device having a load path and a plurality of second semiconductor devices, each having a load path between a first and a second load terminal and a control terminal. The second semiconductor devices have their load paths connected in series and connected in series to the load path of the first semiconductor device. Each of the second semiconductor devices has its control terminal connected to the load terminal of one of the other second semiconductor devices, and one of the second semiconductor devices has its control terminal connected to one of the load terminals of the first semiconductor device. Each of the second semiconductor devices has at least one device characteristic. At least one device characteristic of at least one of the second semiconductor devices is different from the corresponding device characteristic of others of the second semiconductor devices.
    • 半导体器件布置包括具有负载路径的第一半导体器件和多个第二半导体器件,每个第二半导体器件具有在第一和第二负载端子与控制端子之间的负载路径。 第二半导体器件的负载路径串联连接并与第一半导体器件的负载路径串联连接。 每个第二半导体器件的控制端子连接到其它第二半导体器件之一的负载端子,并且其中一个第二半导体器件的控制端子连接到第一半导体器件的负载端子之一。 每个第二半导体器件具有至少一个器件特性。 第二半导体器件中的至少一个的至少一个器件特征与第二半导体器件中的其它器件的相应器件特性不同。