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    • 51. 发明授权
    • Charged particle system
    • 带电粒子系统
    • US07772554B2
    • 2010-08-10
    • US12098127
    • 2008-04-04
    • Akiyuki SugiyamaHidetoshi MorokumaYutaka HojoYukio Yoshizawa
    • Akiyuki SugiyamaHidetoshi MorokumaYutaka HojoYukio Yoshizawa
    • G01N23/00
    • H01J37/3056B82Y10/00B82Y40/00H01J37/265H01J37/28H01J37/3045H01J37/3174H01J2237/22H01J2237/2817H01J2237/31745
    • To provide a charged particle system capable of facilitating comparison between an actual pattern and an ideal pattern using not only two-dimensional CAD data but also three-dimensional CAD data. According to the present invention, using information about the angle of irradiation of a sample with a charged particle beam, a two-dimensional display of an ideal pattern (design data, such as CAD data, for example) is converted into a three-dimensional display, and the three-dimensional ideal pattern is displayed with an observation image. If the three-dimensional ideal pattern is superimposed on the observation image, comparison thereof can be easily carried out. Examples of the ideal pattern include a circuit pattern (CAD data) based on semiconductor design information, an exposure mask pattern based on an exposure mask used for exposure of a semiconductor wafer, and an exposure simulation pattern based on exposure simulation based on the exposure mask and an exposure condition can be used, and at least one of these patterns is displayed three-dimensionally.
    • 为了提供一种带电粒子系统,其能够利用不仅二维CAD数据而且还可以利用三维CAD数据来实现实际图案与理想图案之间的比较。 根据本发明,使用带有带电粒子束的样本的照射角度的信息,将理想图案(例如,CAD数据等设计数据)的二维显示转换成三维 显示,并且用观察图像显示三维理想图案。 如果将三维理想图案叠加在观察图像上,则可以容易地进行比较。 理想图案的实例包括基于半导体设计信息的电路图案(CAD数据),基于用于半导体晶片曝光的曝光掩模的曝光掩模图案和基于曝光掩模的曝光模拟的曝光模拟图案 并且可以使用曝光条件,并且这些图案中的至少一个被三维地显示。
    • 53. 发明申请
    • System and Method for Detecting a Defect
    • 检测缺陷的系统和方法
    • US20100138801A1
    • 2010-06-03
    • US12698201
    • 2010-02-02
    • Ryoichi MATSUOKAHidetoshi MorokumaTakumichi Sutani
    • Ryoichi MATSUOKAHidetoshi MorokumaTakumichi Sutani
    • G06F17/50
    • G06F17/5081G01R31/303
    • A system and a method for detecting a defect, capable of extracting a defect occurring depending on finishing accuracy required for circuit operation are provided. The system includes a timing analyzer for extracting a critical path in which a high accuracy is required for a signal transmission operation as compared with other portions based on circuit design data, a critical path extractor for comparing the circuit design data with layout design data on a pattern and for extracting graphical data including the critical path extracted by the timing analyzer, an inspection recipe creator for deciding a portion to be inspected, based on coordinate information on the graphical data including the critical path extracted by the critical path extractor, and an SEM defect review apparatus for acquiring an image of the decided portion to be inspected on a wafer according to an inspection recipe created by the inspection recipe creator.
    • 提供一种用于检测缺陷的系统和方法,其能够提取根据电路操作所需的精加工精度而发生的缺陷。 该系统包括用于提取与其他部分相比基于电路设计数据而与信号传输操作相比需要高精度的关键路径的定时分析器,用于将电路设计数据与布局设计数据进行比较的关键路径提取器 基于关于包括由关键路径提取器提取的关键路径的图形数据的坐标信息,以及扫描电子显微镜(SEM)来提取包括由定时分析器提取的关键路径的图形数据,用于决定待检查部分的检查配方生成器 缺陷检查装置,用于根据由检查配方创建者创建的检查配方在晶片上获取所确定的待检查部分的图像。
    • 57. 发明申请
    • Method and apparatus for observing a specimen
    • 用于观察试样的方法和装置
    • US20070114398A1
    • 2007-05-24
    • US11651031
    • 2007-01-09
    • Atsushi MiyamotoMaki TanakaHidetoshi Morokuma
    • Atsushi MiyamotoMaki TanakaHidetoshi Morokuma
    • G01N23/00
    • H01J37/28G01B15/04G01N23/2251H01J2237/226H01J2237/2814
    • A method and device for observing a specimen in which an electron beam is irradiated and scanned from an oblique direction, onto a surface of a calibration substrate on which a pattern with a known shape is formed, and an SEM image of the surface of the calibration substrate is obtained. An angle in an oblique direction of the electron beam irradiated is obtained and is adjusted to a desired angle. The electron beam is irradiated from the adjusted desired angle in the oblique direction, onto a specimen substrate on which a pattern is formed, and an SEM image of the specimen substrate is obtained. The SEM image of the specimen substrate is processed by use of the information of the desired angle, and a 3D image of the pattern on the specimen substrate or a shape of a cross section of the pattern is obtained.
    • 一种用于观察其中电子束从倾斜方向照射和扫描的样本到其上形成有已知形状的图案的校准基板的表面上的方法和装置以及校准表面的SEM图像 得到底物。 获得照射的电子束的倾斜方向的角度并将其调节到期望的角度。 将电子束从倾斜方向的调整好的所需角度照射到形成图案的试样基板上,得到试样基板的SEM图像。 通过使用期望角度的信息来处理样本基板的SEM图像,并且获得样本基板上的图案的3D图像或图案的横截面的形状。