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    • 58. 发明授权
    • Wafer cleaning system
    • 晶圆清洗系统
    • US06308369B1
    • 2001-10-30
    • US09511775
    • 2000-02-24
    • Alejandro GarciaBrent KrickAnthony NichtawitzDaniel NordeenJosh OenKenneth SmithVincent SuroDaniel Wolf
    • Alejandro GarciaBrent KrickAnthony NichtawitzDaniel NordeenJosh OenKenneth SmithVincent SuroDaniel Wolf
    • B08B104
    • H01L21/67057H01L21/67046
    • A wafer cleaning apparatus provides two opposed brushes for brushing a vertically disposed wafer in a tank which can contain a process liquid. A pressure controller adaptively controls the pressure exerted by the brushes on the wafer to compensate for brush wear. Rim driving wheels engage the wafer periphery with a porous jacket coupled to a fluid delivery system, thereby simultaneously rotating and cleaning the periphery of the wafer. The apparatus includes a fluid delivery system for separately and independently delivering a plurality of constituents of a cleaning solution to the brushes, thereby ensuring that a freshly mixed cleaning solution reaches the wafer. The tank can be filled with a process liquid through which megasonic waves provided by a transducer can propagate and impinge upon the wafer thereby enhancing the cleaning of the wafer or the brushes.
    • 晶片清洁装置提供两个相对的刷子,用于刷洗可容纳处理液体的罐中的垂直设置的晶片。 压力控制器自适应地控制由电刷施加在晶片上的压力以补偿刷磨损。 轮缘驱动轮通过与流体输送系统连接的多孔套接合晶片周边,从而同时旋转和清洁晶片的周边。 该装置包括一个流体输送系统,用于将清洁溶液的多个组分分别独立地输送到刷子,从而确保新鲜混合的清洁溶液到达晶片。 罐可以填充处理液体,由换能器提供的超声波可以传播并撞击在晶片上,从而增强了晶片或刷子的清洁。