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41. 发明申请

US20140027431A1 Warpage Control in the Packaging of Integrated Circuits 有权
标题翻译：集成电路封装中的翘曲控制
公开(公告)号：US20140027431A1
公开(公告)日：2014-01-30
申请号：US13559318
申请日：2012-07-26
申请人： Ming-Da Cheng , Hsiu-Jen Lin , Cheng-Ting Chen , Wei-Yu Chen , Chien-Wei Lee , Chung-Shi Liu
发明人： Ming-Da Cheng , Hsiu-Jen Lin , Cheng-Ting Chen , Wei-Yu Chen , Chien-Wei Lee , Chung-Shi Liu
IPC分类号： B23K31/02 , H05B1/00 , B25B11/00
CPC分类号： H05B3/02 , B23K3/087 , B23K2101/40 , H01L21/67721 , H01L21/6838 , H01L24/75 , H01L24/81 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/75744 , H01L2224/7598 , H01L2224/81191 , H01L2224/81815 , H01L2224/97 , H01L2924/3511 , H01L2924/37001 , Y10T29/41 , H01L2924/00014 , H01L2224/81 , H01L2924/014
摘要： A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component.
摘要翻译：一种方法包括将第一包装部件放置在真空舟皿上，其中真空舟皿包括孔，并且其中第一包装部件覆盖该孔。第二包装部件放置在第一包装部件上，其中焊料区域设置在第一和第二包装部件之间。该孔被抽真空，其中第一包装部件被压靠在真空舟皿上的压力，并且其中压力由孔中的真空产生。当保持孔中的真空时，回流焊接区域以将第二包装部件结合到第一包装部件。

42. 发明申请

US20130320606A1 WAVE SOLDERING CARRIER 审中-公开
标题翻译：波形焊工
公开(公告)号：US20130320606A1
公开(公告)日：2013-12-05
申请号：US13873115
申请日：2013-04-29
申请人： Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd. , HON HAI PRECISION INDUSTRY CO., LTD.
发明人： TAO ZHAO , XIAO-CONG WEI , WEI-HSIEN TSENG
IPC分类号： B23K3/08
CPC分类号： B23K3/087 , B23K3/00
摘要： A wave soldering carrier includes a base plate and a fixing member positioned on the base plate. The base plate defines a receiving recess and a number of through holes communicating with the receiving recess. The receiving recess receives a circuit board. The through holes are arranged and shaped corresponding to a number of electronic components on the circuit board. The fixing member includes a shaft including a fixing shaft fixed to the base plate and a restricting shaft extending from an end of the fixing shaft. A diameter of the restricting shaft is greater than that of the fixing shaft, thereby forming a step. The fixing member further includes a rotatable member rotatably connected to the fixing shaft and sandwiched between the shoulder and the base plate. The rotation member is rotatable to a preset position, where a distal end of the rotatable member firmly contacts the circuit board.
摘要翻译：波峰焊接载体包括基板和定位在基板上的固定部件。基板限定了容纳凹部和与容纳凹部连通的多个通孔。接收凹部接收电路板。通孔根据电路板上的多个电子部件布置和成形。所述固定构件包括轴，所述轴包括固定到所述基板的固定轴和从所述固定轴的端部延伸的限制轴。限制轴的直径大于固定轴的直径，从而形成一个台阶。固定构件还包括可旋转地连接到固定轴并被夹在肩部和基板之间的可旋转构件。旋转构件可旋转到预定位置，其中可旋转构件的远端牢固地接触电路板。

43. 发明申请

US20130277361A1 APPARATUS AND METHOD OF INTERCONNECTING A PLURALITY OF SOLAR CELLS 审中-公开
标题翻译：互连多个太阳能电池的装置和方法
公开(公告)号：US20130277361A1
公开(公告)日：2013-10-24
申请号：US13450636
申请日：2012-04-19
申请人： Lian Hok TAN , Wen Ge TU , Pan YANG
发明人： Lian Hok TAN , Wen Ge TU , Pan YANG
IPC分类号： B23K1/002 , B23K3/08 , B23K26/20 , B23K3/047 , B23K1/20 , B23K31/02 , B23K3/04
CPC分类号： H01L31/188 , B23K1/0016 , B23K1/002 , B23K1/0056 , B23K3/0475 , B23K3/087 , Y02E10/50
摘要： Disclosed is an apparatus for electrically interconnecting a plurality of solar cells. The apparatus comprises: i) a roller operative to roll along a solar cell to press an electrical conductor against an electrical contact of the solar cell, the electrical conductor being for electrically interconnecting the solar cell with one or more other solar cells; and ii) a heat-generating device arranged and configured to provide heat for soldering the electrical conductor to the electrical contact of the solar cell while the roller is pressing the electrical conductor against the electrical contact of the solar cell. A method of electrically interconnecting a plurality of solar cells, and a mechanism for laying and soldering an electrical conductor onto a solar cell, are also disclosed.
摘要翻译：公开了一种用于电连接多个太阳能电池的装置。该设备包括：i）可操作地沿着太阳能电池滚动以将电导体压靠在太阳能电池的电接触件上的辊子，该电导体用于将太阳能电池与一个或多个其它太阳能电池电互连; 以及ii）发热装置，其布置和构造成在所述辊将所述电导体压靠所述太阳能电池的电接触部处提供用于将所述导电体焊接到所述太阳能电池的电接触点的热量。还公开了一种将多个太阳能电池电互连的方法，以及用于将电导体放置和焊接到太阳能电池上的机构。

44. 发明申请

US20130270758A1 Wire Holding Device 审中-公开
标题翻译：电线保持装置
公开(公告)号：US20130270758A1
公开(公告)日：2013-10-17
申请号：US13444971
申请日：2012-04-12
申请人： William W. Wittliff, III , Larry Betcher , Robert Kochie
发明人： William W. Wittliff, III , Larry Betcher , Robert Kochie
IPC分类号： B25B11/00 , B25B5/16
CPC分类号： B25B5/003 , B23K1/0016 , B23K3/087 , B23K37/0452 , B23K2101/006 , B23K2101/32 , B23K2101/38 , B25B5/006 , Y10T29/49998
摘要： A wire holding device configured to hold two wires together to establishing a connection. The connection may be made through soldering the two wires together. The wire holding device is also configured to be adjustable so that the wires can be held at different angles. The wire holding device can also be used to isolate a wire from a wire loom.
摘要翻译：电线保持装置，其被配置为将两个电线保持在一起以建立连接。可以通过将两根电线焊接在一起来进行连接。电线保持装置还被构造成可调节，使得电线可以以不同的角度保持。电线保持装置也可用于将电线与电线织机隔离开。

45. 发明申请

US20130134209A1 CARRIER FOR CIRCUIT BOARD 审中-公开
标题翻译：电路板载体
公开(公告)号：US20130134209A1
公开(公告)日：2013-05-30
申请号：US13306974
申请日：2011-11-29
申请人： LI-HSUAN LU
发明人： LI-HSUAN LU
IPC分类号： B23K3/08
CPC分类号： B23K1/0016 , B23K3/087
摘要： A circuit board carrier comprises an upper and a lower covers that construct a space for accommodating a circuit board. The upper cover has a recess, and an inner portion of the recess has two positioning elements symmetrically arranged. The positioning elements are movable in a push-and-pull motion. An inner wall of the recess has position limiting elements arranged at four corners thereof. The limiting elements are located between the inner wall of the recess and the positioning elements for confining the motion of the limiting elements and eliminating an effect of product tolerance on manufacturing the board. The carrier implements Y-axis and Z-axis confinement, avoids vibration occurred when the board passes an oven, and avoids a sliding error occurred due to human operations, by springs and pressing bulks fastened to bottom surfaces of the positioning elements and down pressing spring structure disposed below the upper cover.
摘要翻译：电路板载体包括构成用于容纳电路板的空间的上盖和下盖。上盖具有凹部，凹部的内部具有对称设置的两个定位元件。定位元件可以在推拉动作中移动。凹部的内壁具有排列在其四个角部的位置限制元件。限制元件位于凹部的内壁和定位元件之间，用于限制限制元件的运动，并消除了在制造板上的产品公差的影响。载体实现Y轴和Z轴限制，避免板通过烤箱时发生振动，避免由于人为操作而发生的滑动错误，弹簧和紧固在定位元件底面的按压块和向下按压弹簧结构设置在上盖下方。

46. 发明申请

US20130082042A1 WELDING JIG AND WELDING PROCESS FOR PLANAR MAGNETIC COMPONENTS 有权
标题翻译：平面磁性元件的焊接焊接和焊接工艺
公开(公告)号：US20130082042A1
公开(公告)日：2013-04-04
申请号：US13417336
申请日：2012-03-12
申请人： Chung-Kuang HSIEH , Lan GUO , Kao-Kuan FAN , Hui-Hua TENG
发明人： Chung-Kuang HSIEH , Lan GUO , Kao-Kuan FAN , Hui-Hua TENG
IPC分类号： B21J13/08 , C21D1/40
CPC分类号： B23K1/0016 , B23K3/087 , B23K37/0408 , B23K2101/38
摘要： A welding jig and welding process for planar magnetic components are provided. The welding jig includes a fixed piece and an elastic piece. The fixed piece includes a base and a carrier. The base has an opening, bumps at the bottom of the opening and a pair of operation ends extending from the opening. The carrier is fixed on the base and located in the opening, and has multiple through holes. When the bumps are located respectively in the through holes, an accommodation interval is formed between adjacent pairs of the bumps for the placement of the planar magnetic components. The elastic piece is secured to the fixed piece, and when the planar magnetic components are placed in the accommodation intervals of the fixed piece, the elastic piece covers the planar magnetic components and the planar magnetic components abut against two side edges of the elastic piece.
摘要翻译：提供了用于平面磁性部件的焊接夹具和焊接工艺。焊接夹具包括固定件和弹性件。固定件包括底座和托架。基座具有开口，在开口的底部具有凸起，以及从开口延伸的一对操作端。载体固定在基座上并位于开口中，并具有多个通孔。当凸块分别位于通孔中时，在相邻的凸块对之间形成一个放置平面磁性部件的调节间隔。弹性件被固定在固定件上，当平面磁性部件被放置在固定件的容纳间隔中时，弹性件覆盖平面磁性部件，并且平面磁性部件抵靠弹性片的两个侧边缘。

47. 发明申请

US20120214016A1 CONSTRAINED METAL FLANGES AND METHODS FOR MAKING THE SAME 审中-公开
标题翻译：约束金属法兰及其制造方法
公开(公告)号：US20120214016A1
公开(公告)日：2012-08-23
申请号：US13032315
申请日：2011-02-22
申请人： Jeremy Daniel Van Dam , Karen Kettler Denike , Kiruba Sivasubramaniam Haran , Don Mark Lipkin , Myles Standish Peterson, II
发明人： Jeremy Daniel Van Dam , Karen Kettler Denike , Kiruba Sivasubramaniam Haran , Don Mark Lipkin , Myles Standish Peterson, II
IPC分类号： B32B15/04 , B32B15/02 , B23K31/02 , B23K35/02
CPC分类号： B21D41/02 , B23K1/19 , B23K3/087 , B23K35/02 , B23K35/30 , C04B37/026 , C04B2237/122 , C04B2237/123 , C04B2237/124 , C04B2237/125 , C04B2237/343 , C04B2237/402 , C04B2237/403 , C04B2237/405 , C04B2237/406 , C04B2237/407 , C04B2237/408 , C04B2237/55 , C04B2237/564 , C04B2237/567 , C04B2237/568 , C04B2237/704 , C04B2237/706 , C04B2237/72 , C04B2237/76 , C04B2237/765 , C04B2237/80 , C04B2237/88 , C21D9/50 , Y10T428/12264 , Y10T428/12333
摘要： The present invention provides a method of making a flanged metal article. The method comprises (a) applying a first braze compound to a first portion of a metal article; (b) winding the first portion of a metal article with a length of a constraining metal member; and (c) heating an assembly of the metal article, the constraining metal member, and the first braze compound to a temperature above the solidus temperature of the first braze compound, typically a temperature in a range from about 300° C. to about 2500° C., to provide a flanged metal article, wherein the metal article has a coefficient of thermal expansion CTE 1, the constraining metal member has a coefficient of thermal expansion CTE 2, and CTE 1 is greater than CTE 2. The invention further provides a metal flange, which minimizes thermal expansion mismatch between a high expansion metal and a low expansion brittle material.
摘要翻译：本发明提供一种制造法兰金属制品的方法。该方法包括（a）将第一钎焊化合物施加到金属制品的第一部分; （b）卷绕具有约束金属构件长度的金属制品的第一部分; 和（c）将金属制品，约束金属构件和第一钎焊化合物的组件加热到高于第一钎焊化合物的固相线温度的温度，通常为约300℃至约2500℃的温度 °C，以提供一种带凸缘的金属制品，其中金属制品具有热膨胀系数CTE 1，约束金属构件具有热膨胀系数CTE 2，CTE 1大于CTE 2.本发明还提供金属凸缘，其最小化高膨胀金属和低膨胀脆性材料之间的热膨胀失配。

48. 发明申请

US20120104077A1 AUTOMATIC SOLDERING APPARATUS AND SOLDERING METHOD THEREOF 审中-公开
标题翻译：自动焊接设备及其焊接方法
公开(公告)号：US20120104077A1
公开(公告)日：2012-05-03
申请号：US12916529
申请日：2010-10-30
申请人： JI-DONG TIAN , Xiao-Iin Wu , Sung-Iin Chen , Shao-bo Zhang
发明人： JI-DONG TIAN , Xiao-Iin Wu , Sung-Iin Chen , Shao-bo Zhang
IPC分类号： B23K31/02 , B23K37/04
CPC分类号： B23K1/0016 , B23K3/047 , B23K3/087 , B23K2101/42
摘要： An automatic soldering apparatus and a soldering method thereof are provided. The soldering method has steps of: (S1) positioning a to-be-soldered part and an electronic component having a solder material; (S2) driving a hot press to firstly move, until the hot press is in contact with the part; (S3) heating the solder material by the hot press; and (S4) driving the hot press to secondly move to press the solder material after the solder material on the electronic component is melted, so as to connect the part to the melted solder material on the electronic component by soldering. When the automatic soldering apparatus and the soldering method of the present invention are used to execute a soldering process, a route of the hot press can be controlled to firstly melt the solder material and then deform it, so as to avoid the hot press from impacting and damaging the part.
摘要翻译：提供了一种自动焊接装置及其焊接方法。焊接方法具有以下步骤：（S1）定位待焊接部件和具有焊料材料的电子部件; （S2）驱动热压机首先移动，直到热压机与部件接触; （S3）通过热压加热焊料材料; 和（S4）驱动热压器以在电子部件上的焊料材料熔化之后第二次移动以压焊焊料材料，以便通过焊接将部件连接到电子部件上的熔融焊料材料。当使用本发明的自动焊接装置和焊接方法执行焊接工艺时，可以控制热压机的路线，首先熔化焊料材料，然后使其变形，以避免热压机冲击并损坏部件。

49. 发明申请

US20120061451A1 QUICK-LOADING SOLDERING APPARATUS 有权
标题翻译：快装焊接设备
公开(公告)号：US20120061451A1
公开(公告)日：2012-03-15
申请号：US13301288
申请日：2011-11-21
申请人： Alexander James Ciniglio
发明人： Alexander James Ciniglio
IPC分类号： B23K37/04
CPC分类号： B23K1/0016 , B23K3/087 , B23K2101/42
摘要： A quick-loading soldering apparatus for soldering PCBs comprises a rotatable deck which has a plurality of angularly spaced PCB work sites. While a first PCB work site is angularly positioned for pre-loading and pre-heating PCB components at a pre-loading station, a second PCB work site is angularly positioned for soldering pre-loaded PCB components at a soldering station. Correct rotation of the deck is ensured by a sensor mounted on the deck. If the rotation angle is correct, locator pins provided externally of the deck become actionable by an operator to register the deck prior to the PCB being soldered.
摘要翻译：用于焊接PCB的快速加载焊接装置包括具有多个成角度间隔的PCB工作位置的可旋转的甲板。虽然第一个PCB工作站角度定位，用于在预加载站预加载和预热PCB组件，但是第二个PCB工作位置是角度定位的，用于在焊接站焊接预加载的PCB组件。通过安装在甲板上的传感器确保甲板的正确旋转。如果旋转角度正确，在甲板外部设置的定位销可以由操作者在PCB被焊接之前对甲板进行注册。

50. 发明申请

US20120055975A1 AUTOMATIC SOLDERING SYSTEM 失效
标题翻译：自动焊接系统
公开(公告)号：US20120055975A1
公开(公告)日：2012-03-08
申请号：US12876217
申请日：2010-09-06
申请人： Tsung-han Wei , Hung-yuan Fang , Yu-feng Lin , Mu-cun Chen , Jyun-lin Huang
发明人： Tsung-han Wei , Hung-yuan Fang , Yu-feng Lin , Mu-cun Chen , Jyun-lin Huang
IPC分类号： B23K37/047 , B23K3/00
CPC分类号： B23K1/0016 , B23K3/087 , B23K37/047 , Y10T29/49144 , Y10T29/5196 , Y10T29/5313
摘要： An automatic soldering system includes a conveyance mechanism, a vehicle, a first part assembling mechanism, a first soldering mechanism, a turn-over mechanism, a second part assembling mechanism, a second soldering mechanism, and a control system. The vehicle is conveyed by the conveyor mechanism for carrying a workpiece. The first part assembling mechanism and the first soldering mechanism assemble and solder a first part to the primary workpiece carried by the vehicle. The turn-over mechanism turns the vehicle that is conveyed by the conveyor mechanism and carries the primary workpiece having the first part assembled thereto by a predetermined angle. The second part assembling mechanism and the second soldering mechanism assemble and solder and position a second part to the primary workpiece. The control system is electrically connected to and thus controls the first part and second part assembling mechanisms, the first and second soldering mechanisms, and the turn-over mechanism.
摘要翻译：自动焊接系统包括输送机构，车辆，第一部件组装机构，第一焊接机构，翻转机构，第二部分组装机构，第二焊接机构和控制系统。车辆由用于承载工件的输送机构输送。第一部件组装机构和第一焊接机构将第一部件组装并焊接到由车辆承载的主工件。翻转机构转动由输送机构输送的车辆，并将具有组装在其上的第一部件的主工件承载预定角度。第二部分组装机构和第二焊接机构组装并焊接并将第二部分定位到主工件。控制系统电连接到控制系统，从而控制第一和第二部件组装机构，第一和第二焊接机构以及翻转机构。

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