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1. 发明申请

US20120104077A1 AUTOMATIC SOLDERING APPARATUS AND SOLDERING METHOD THEREOF 审中-公开
标题翻译：自动焊接设备及其焊接方法
公开(公告)号：US20120104077A1
公开(公告)日：2012-05-03
申请号：US12916529
申请日：2010-10-30
申请人： JI-DONG TIAN , Xiao-Iin Wu , Sung-Iin Chen , Shao-bo Zhang
发明人： JI-DONG TIAN , Xiao-Iin Wu , Sung-Iin Chen , Shao-bo Zhang
IPC分类号： B23K31/02 , B23K37/04
CPC分类号： B23K1/0016 , B23K3/047 , B23K3/087 , B23K2101/42
摘要： An automatic soldering apparatus and a soldering method thereof are provided. The soldering method has steps of: (S1) positioning a to-be-soldered part and an electronic component having a solder material; (S2) driving a hot press to firstly move, until the hot press is in contact with the part; (S3) heating the solder material by the hot press; and (S4) driving the hot press to secondly move to press the solder material after the solder material on the electronic component is melted, so as to connect the part to the melted solder material on the electronic component by soldering. When the automatic soldering apparatus and the soldering method of the present invention are used to execute a soldering process, a route of the hot press can be controlled to firstly melt the solder material and then deform it, so as to avoid the hot press from impacting and damaging the part.
摘要翻译：提供了一种自动焊接装置及其焊接方法。焊接方法具有以下步骤：（S1）定位待焊接部件和具有焊料材料的电子部件; （S2）驱动热压机首先移动，直到热压机与部件接触; （S3）通过热压加热焊料材料; 和（S4）驱动热压器以在电子部件上的焊料材料熔化之后第二次移动以压焊焊料材料，以便通过焊接将部件连接到电子部件上的熔融焊料材料。当使用本发明的自动焊接装置和焊接方法执行焊接工艺时，可以控制热压机的路线，首先熔化焊料材料，然后使其变形，以避免热压机冲击并损坏部件。

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