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1. 发明授权

US11975398B2 Induction-based systems and methods for joining substrates 有权
公开(公告)号：US11975398B2
公开(公告)日：2024-05-07
申请号：US17415522
申请日：2019-12-19
申请人： OQAB DIETRICH INDUCTION INC.
发明人： Haroon B. Oqab , George B. Dietrich
IPC分类号： B23K1/002 , B23K3/047
CPC分类号： B23K1/002 , B23K3/0475
摘要： An example method of joining a first substrate with a second substrate includes applying a filler material between respective portions of the first substrate and the second substrate, the filler material including an electrically conducting and/or magnetic material, wherein the filler material and the respective portions define a joint; applying an alternating magnetic field to the joint to heat the electrically conducting material to a reaction temperature; in response to heating the electrically conducting material to the reaction temperature, energizing the joint using energy released from the electrically conducting material; cooling the joint to join the first substrate with the second substrate.

2. 发明申请

US20170274465A1 METHOD OF CREATING A BONDED STRUCTURE AND APPARATUSES FOR SAME 审中-公开
公开(公告)号：US20170274465A1
公开(公告)日：2017-09-28
申请号：US15508967
申请日：2015-09-08
申请人： CELLTECH METALS INC.
发明人： Jerry E. GOULD , William J. KAPPER
IPC分类号： B23K1/19 , C22C21/10 , B23K3/08 , C22C18/04 , B23K1/00 , B23K3/047
CPC分类号： B23K1/19 , B23K1/0014 , B23K1/002 , B23K3/0475 , B23K3/085 , B23K20/04 , B23K2101/34 , B23K2101/35 , B23K2103/166 , C22C18/04 , C22C21/10
摘要： A method for creating a bonded zinc-coated structure is provided. In another aspect, a sheet metal joining system includes a heated roller contacting a sheet metal workpiece to braze together zinc-based coatings. A further aspect employs a zinc coated metal sandwich including a core having peaks and valleys.

3. 发明申请

US20170135161A1 INDUCTIVE HEATER FOR AREA ARRAY REWORK SYSTEM AND SOLDERING HANDPIECES 审中-公开
公开(公告)号：US20170135161A1
公开(公告)日：2017-05-11
申请号：US15080724
申请日：2016-03-25
申请人： PACE, INC.
发明人： Thomas Wayne Miller , Ramgopal Nair
IPC分类号： H05B6/10 , B23K1/012
CPC分类号： H05B6/108 , B23K1/0016 , B23K1/012 , B23K1/018 , B23K3/0475 , B23K2101/36
摘要： An induction heater having inner and outer chamber cylinders connected in an air tight manner to a base and cover with an inner chamber being formed within the inner chamber cylinder and an outer chamber being formed between the inner and outer chamber cylinders, a heat exchange core disposed in the inner chamber, and an induction heater coil disposed in the outer chamber extending around the inner chamber cylinder. A flow path is provided from a cool air inlet in the base, along the outer chamber, into the inner chamber and through the inner chamber and core to a heated air outlet in the base in a counterflow direction relative to the flow along the outer chamber. The heater is especially well suited for use in convective soldering and rework apparatus.

4. 发明申请

US20160268754A1 METHOD AND APPARATUS FOR FORMING INTERFACE BETWEEN COAXIAL CABLE AND CONNECTOR 审中-公开
标题翻译：用于形成同轴电缆和连接器之间接口的方法和装置
公开(公告)号：US20160268754A1
公开(公告)日：2016-09-15
申请号：US15065468
申请日：2016-03-09
申请人： CommScope Technologies LLC
发明人： Frank A. Harwath , Jeffrey D. Paynter , James P. Fleming , David J. Smentek
IPC分类号： H01R43/02
CPC分类号： H01R43/0263 , B23K3/0475 , B23K3/087 , H01R9/05 , H01R43/0235 , Y10T29/49169 , Y10T29/49179 , Y10T29/53213
摘要： A method of forming a solder joint between a coaxial cable and a coaxial connector includes the steps of: positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector, wherein the solder element is positioned within a vacuum chamber; melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with a mounting structure; and applying suction to the melting solder element to reduce the formation of bubbles within the solder joint.
摘要翻译：在同轴电缆和同轴连接器之间形成焊接接头的方法包括以下步骤：将焊料元件定位在同轴电缆的外部导体的端部和连接器的连接器主体之间，其中焊料元件位于真空室; 熔化所述焊料元件以在所述外导体和所述连接器本体之间形成焊接接头，所述焊接接头包括通过与安装结构接触而形成的下表面; 并且向熔化的焊料元件施加吸力以减少焊接接头内的气泡的形成。

5. 发明授权

US09188158B1 Apparatus for brazing radial bearings and related methods 有权
公开(公告)号：US09188158B1
公开(公告)日：2015-11-17
申请号：US14592644
申请日：2015-01-08
申请人： US Synthetic Corporation
发明人： Timothy N. Sexton , John Corradini
IPC分类号： B23K31/02 , F16C33/00 , B23K1/00 , B23K37/04 , B23K1/002
CPC分类号： B23K1/0008 , B23K1/002 , B23K1/19 , B23K3/0475 , B23K3/087 , B23K37/0443 , B23K2103/18 , B23K2103/52 , E21B4/003 , F16C33/00 , F16C33/043 , F16C33/26 , F16C2206/04 , F16C2226/34 , F16C2352/00
摘要： Apparatuses and methods are provided for manufacturing bearing assemblies. In accordance with one embodiment, a fixture is provided for use in brazing bearing elements to a bearing ring. The fixture comprises a substantially annular body and at least one or more force-applying mechanism associated with the annular body. The force applying mechanisms include a push rod disposed within a channel that is formed in the annular body, the push rod being displaceable within the channel. A biasing member is configured to bias the push rod in a radial direction relative to the annular body. In one embodiment, a plurality of force-applying mechanisms are circumferentially spaced about the substantially annular body. In one embodiment, the push rods extend radially inwardly from a peripheral surface of the body, while in another embodiment the push rods extend radially outwardly from peripheral surface of the body.

6. 发明申请

US20150083707A1 Process For Fabricating Inductive Heated Solder Cartridge 审中-公开
标题翻译：制造感性加热焊剂的方法
公开(公告)号：US20150083707A1
公开(公告)日：2015-03-26
申请号：US14032616
申请日：2013-09-20
申请人： Mitsuhiko Miyazaki , Hisao Nemoto
发明人： Mitsuhiko Miyazaki , Hisao Nemoto
IPC分类号： B23K3/03 , B23P19/00 , F27D7/06 , B23K3/047 , H01F41/00
CPC分类号： B23K3/0353 , B23K3/03 , B23K3/0369 , B23K3/0475 , F27D7/06 , Y10T29/4902 , Y10T29/49885
摘要： A method or process of fabricating a solder cartridge and solder cartridge made according to the process is disclosed. The solder cartridge made according to the process provides a self-temperature regulating solder tip for an inductive current soldering station having improved heater quality and stability with reduced manufacturing costs.
摘要翻译：公开了制造根据该方法制造的焊料盒和焊料盒的方法或工艺。根据该方法制造的焊料盒提供用于感应电流焊接站的自温度调节焊嘴，其具有改善的加热器质量和稳定性，并降低制造成本。

7. 发明授权

US08950649B2 Apparatus for brazing radial bearings and related methods 有权
标题翻译：用于钎焊径向轴承的装置及相关方法
公开(公告)号：US08950649B2
公开(公告)日：2015-02-10
申请号：US13827529
申请日：2013-03-14
申请人： US Synthetic Corporation
发明人： Timothy N. Sexton , John Corradini
IPC分类号： B23K37/04 , F16C33/00
CPC分类号： B23K1/0008 , B23K1/002 , B23K1/19 , B23K3/0475 , B23K3/087 , B23K37/0443 , B23K2103/18 , B23K2103/52 , E21B4/003 , F16C33/00 , F16C33/043 , F16C33/26 , F16C2206/04 , F16C2226/34 , F16C2352/00
摘要： Apparatuses and methods are provided for manufacturing bearing assemblies. In accordance with one embodiment, a fixture is provided for use in brazing bearing elements to a bearing ring. The fixture comprises a substantially annular body and at least one or more force-applying mechanism associated with the annular body. The force applying mechanisms include a push rod disposed within a channel that is formed in the annular body, the push rod being displaceable within the channel. A biasing member is configured to bias the push rod in a radial direction relative to the annular body. In one embodiment, a plurality of force-applying mechanisms are circumferentially spaced about the substantially annular body. In one embodiment, the push rods extend radially inwardly from a peripheral surface of the body, while in another embodiment the push rods extend radially outwardly from peripheral surface of the body.
摘要翻译：提供了用于制造轴承组件的装置和方法。根据一个实施例，提供一种用于将支承元件钎焊到轴承环上的固定装置。夹具包括基本上环形的主体和与环形体相关联的至少一个或多个施力机构。施力机构包括设置在形成在环形体中的通道内的推杆，该推杆可在通道内移动。偏置构件构造成相对于环形体在径向上偏置推杆。在一个实施例中，多个施力机构围绕基本环形体周向隔开。在一个实施例中，推杆从主体的外周表面径向向内延伸，而在另一实施例中，推杆从主体的外周表面径向向外延伸。

8. 发明授权

US08324522B2 Reflow apparatus, reflow method, and package apparatus 有权
标题翻译：回流装置，回流方法和包装装置
公开(公告)号：US08324522B2
公开(公告)日：2012-12-04
申请号：US12591821
申请日：2009-12-02
申请人： Minill Kim , Kwang Yong Lee , Jonggi Lee , Ji-Seok Hong
发明人： Minill Kim , Kwang Yong Lee , Jonggi Lee , Ji-Seok Hong
IPC分类号： B23K3/00 , B23K26/00
CPC分类号： B23K1/00 , B23K1/0016 , B23K1/002 , B23K1/008 , B23K3/0475 , B23K3/087 , B23K2101/42 , H01L24/75 , H01L24/81 , H05K3/3494 , H05K2203/101 , H05K2203/1509
摘要： Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.
摘要翻译：提供了一种用于进行设置到半导体芯片的焊球的回流处理的装置。回流装置可以包括线圈，支撑构件和移动构件。线圈可以从电源接收电流，以使用感应加热方法加热焊球。支撑构件可以设置在线圈的前部或后部，并且可以支撑安装有半导体芯片的印刷电路板。移动构件可以移动印刷电路板，使得印刷电路对象通过由线圈包围的内部空间。

9. 发明申请

US20100181293A1 Reflow apparatus, Reflow method, and package apparatus 有权
标题翻译：回流装置，回流法和包装装置
公开(公告)号：US20100181293A1
公开(公告)日：2010-07-22
申请号：US12591821
申请日：2009-12-02
申请人： Minill Kim , Kwang Yong Lee , Jonggi Lee , Ji-Seok Hong
发明人： Minill Kim , Kwang Yong Lee , Jonggi Lee , Ji-Seok Hong
IPC分类号： B23K1/00
CPC分类号： B23K1/00 , B23K1/0016 , B23K1/002 , B23K1/008 , B23K3/0475 , B23K3/087 , B23K2101/42 , H01L24/75 , H01L24/81 , H05K3/3494 , H05K2203/101 , H05K2203/1509
摘要： Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.
摘要翻译：提供了一种用于进行设置到半导体芯片的焊球的回流处理的装置。回流装置可以包括线圈，支撑构件和移动构件。线圈可以从电源接收电流，以使用感应加热方法加热焊球。支撑构件可以设置在线圈的前部或后部，并且可以支撑安装有半导体芯片的印刷电路板。移动构件可以移动印刷电路板，使得印刷电路对象通过由线圈包围的内部空间。

10. 发明申请

US20090179064A1 System and method for restoring metal components 审中-公开
标题翻译：恢复金属部件的系统和方法
公开(公告)号：US20090179064A1
公开(公告)日：2009-07-16
申请号：US12079022
申请日：2008-03-24
申请人： Glenn Hong Guan Lee , Wee Kwong Na , Kin Keong Jek , Garimella Balaji Rao
发明人： Glenn Hong Guan Lee , Wee Kwong Na , Kin Keong Jek , Garimella Balaji Rao
IPC分类号： B23K1/002 , B23K31/02 , B23K35/24
CPC分类号： B23K1/0018 , B23K1/002 , B23K1/008 , B23K3/0475 , B23K3/085 , B23K3/087 , B23K2101/001
摘要： A system for restoring a metal component with a brazing alloy, the system comprising an induction coil configured to extend around a portion of the metal component and at least a portion of the brazing alloy, a motion assembly configured to cause relative movement between the metal component and the induction coil along a first axis, and a heat exchanger assembly supported by the motion assembly and configured to form a thermal gradient along the metal component in a direction along the first axis.
摘要翻译：一种用钎焊合金还原金属部件的系统，该系统包括一个感应线圈，该感应线圈构造成围绕金属部件的一部分和该钎焊合金的至少一部分延伸;运动组件，其构造成使金属部件以及沿着第一轴线的感应线圈，以及热交换器组件，其由所述运动组件支撑并且被配置成沿着所述第一轴线沿所述金属部件形成热梯度。

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