专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20230053414A1 LED TUBE LAMP 有权
公开(公告)号：US20230053414A1
公开(公告)日：2023-02-23
申请号：US17982882
申请日：2022-11-08
申请人： JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD
发明人： TAO JIANG , AIMING XIONG
IPC分类号： F21K9/278 , F21V3/06 , F21V3/10 , F21V29/83 , F21K9/23 , H05B45/37 , H05B45/50 , F21K9/27 , F21V7/28 , F21V7/22 , F21V23/00 , F21V15/015 , F21V17/10 , F21V23/02 , F21K9/272 , B23K3/047 , F21K9/235 , B23K1/00 , H05B6/10 , F21K9/275 , F21V25/02
摘要： An LED tube lamp comprises a glass lamp tube having a main body, two end caps coupled to a respective end of the tube, an LED light strip adhered to inner circumferential surface of the tube by first adhesive, a plurality of LED light sources mounted on a mounting region, a power supply module having a circuit board and a plurality of electronic components mounted on the circuit board, a diffusion layer covering on outer surface or inner surface of the tube, and a protective layer being disposed on surface of the strip and having a plurality of first openings for disposing the plurality of LED light sources. The strip comprises the mounting region and connecting region at an end of the strip. The circuit board is substantially parallel with axial direction of the tube, electrically connects to the connecting region, and stacks with a portion of the connecting region.

2. 发明授权

US11548087B2 Resistance welding of unweldable metals with thermal sprayed interlayers 有权
公开(公告)号：US11548087B2
公开(公告)日：2023-01-10
申请号：US16487930
申请日：2018-02-16
申请人： OUTOKUMPU OYJ
发明人： Christian Dömkes , Thomas Hündgen , Stefan Lindner
IPC分类号： B23K3/047 , B23K26/323 , B23K11/06 , B23K11/16 , B32B15/01 , C23C4/02 , C23C4/08 , C23C4/10 , B23K11/11 , B23K11/20 , C23C4/06 , C23C4/18 , B23K11/10 , B23K11/14 , B23K103/20 , B23K103/04
摘要： A method for joining of at least two materials, non-weldable directly to each other with thermal joining processes in a lap joint configuration includes a two step sequence including a first step to apply a thermomechanical or mechanical surface protection layer on the surface of a (stainless) steel substrate and a second step where, a thermal joining process is used to weld the sprayed layer with an applied aluminum sheet without having brittle intermetallic phases in the whole material configuration.

3. 发明授权

US11440117B2 Multiple module chip manufacturing arrangement 有权
公开(公告)号：US11440117B2
公开(公告)日：2022-09-13
申请号：US16602396
申请日：2019-09-27
申请人： Jian Zhang
发明人： Jian Zhang
IPC分类号： B23K3/00 , B23K3/047 , H01L23/00 , H01L21/68 , H01L21/687 , B23K3/06
摘要： A unitary wafer assembly arrangement for the application of solder balls onto a substrate for subsequent use in the electronics industry. This wafer tool assembly comprises a number of modules connected to one another and all serviced by a robotic arm to transfer processed wafers from one module to another. The tool assembly comprises a load port and pre-aligner module, a binder module, a solder ball mount module and a reflow module. A wafer inspection and repair module arrangement is also part of the tool assembly.

4. 发明申请

US20220155805A1 METHOD FOR ADJUSTING FURNACE TEMPERATURE OF A REFLOW OVEN, AND ELECTRONIC DEVICE USING THE SAME 有权
公开(公告)号：US20220155805A1
公开(公告)日：2022-05-19
申请号：US17522081
申请日：2021-11-09
申请人： HONGFUJIN PRECISION ELECTRONICS (CHENGDU) CO., Ltd. , HON HAI PRECISION INDUSTRY CO., LTD.
发明人： ZI-QING XIA , OU-YANG LI , MIN CHEN , YI-KUN WANG , SU-RU CHEN , YI-CHING CHEN
IPC分类号： G05D23/19 , G05B13/02 , F27D19/00 , B23K3/047
摘要： A method for adjusting furnace temperature of a reflow oven by AI, through obtaining product data of the reflow oven, obtaining initial characteristic data of a preceding work station and calculating mean values of temperatures of an upper furnace and a lower furnace, and taking the mean values as initial reflow characteristic data. Data as to first reflow characteristics of each reflow temperature zone and second reflow characteristics data of each zone are obtained, and data of the first and second reflow characteristics data are obtained. The electronic device further combines the characteristic data of the preceding work station with the combined reflow characteristics and combines results into a trained neural network model to output a temperature prediction, the oven temperature being adjusted according to the temperature prediction.

5. 发明授权

US11172549B2 High-productivity hybrid induction heating/welding assembly 有权
公开(公告)号：US11172549B2
公开(公告)日：2021-11-09
申请号：US14879727
申请日：2015-10-09
申请人： ILLINOIS TOOL WORKS INC.
发明人： Jerald Edward Jones , Valerie Lisa Rhoades , Todd Earl Holverson , Adam Nathan Cuneo , Mark Dietrich Mann
IPC分类号： H05B11/00 , B23K13/01 , B23K9/02 , B23K28/00 , B23K28/02 , B23K31/00 , B23K9/095 , B23K9/235 , B23K10/00 , B23K9/173 , B23K3/047 , B23K9/12 , B23K9/16 , B23K9/32 , B23K37/00 , B23K37/02 , B23K13/02
摘要： In certain embodiments, inductive heating is added to a metal working process, such as a welding process, by an induction heating head. The induction heating head may be adapted specifically for this purpose, and may include one or more coils to direct and place the inductive energy, protective structures, and so forth. Productivity of a welding process may be improved by the application of heat from the induction heating head. The heating is in addition to heat from a welding arc, and may facilitate application of welding wire electrode materials into narrow grooves and gaps, as well as make the processes more amenable to the use of certain compositions of welding wire, shielding gasses, flux materials, and so forth. In addition, distortion and stresses are reduced by the application of the induction heating energy in addition to the welding arc source.

6. 发明申请

US20210176867A1 REFLOW OVEN 有权
公开(公告)号：US20210176867A1
公开(公告)日：2021-06-10
申请号：US17115426
申请日：2020-12-08
申请人： ILLINOIS TOOL WORKS INC.
发明人： Yuexin CHEN , Dong ZHANG
IPC分类号： H05K3/34 , F27B9/40 , B23K1/008 , B23K3/047
摘要： The present disclosure discloses a reflow oven for processing a circuit board, the reflow oven comprising a heating zone, a plurality of heating devices and a start-stop device. The heating zone comprises a plurality of heating sub-zones, the plurality of heating devices are arranged in corresponding heating sub-zones of the plurality of heating sub-zones, and each of the plurality of heating devices is configured such that a working temperature of the corresponding heating sub-zone is in a predetermined temperature interval. The start-stop device is configured to activate or deactivate the plurality of heating devices, and the start-stop device is configured in such a way that the start-stop device activates or deactivates the plurality of heating devices according to predetermined time intervals in a process during which the circuit board sequentially passes through the plurality of heating sub-zones, such that a working temperature of each of the plurality of heating sub-zones is in a corresponding predetermined temperature interval. The reflow oven according to the present disclosure can perform soldering and processing of large-sized circuit boards and prevent the occurrence of overheating in a hearth of the reflow oven.

7. 发明授权

US10716220B2 Variable temperature controlled soldering iron 有权
公开(公告)号：US10716220B2
公开(公告)日：2020-07-14
申请号：US16532320
申请日：2019-08-05
申请人： OK International, Inc.
发明人： Hoa Nguyen
IPC分类号： B23K3/00 , H05K3/34 , B23K3/03 , B23K3/047 , B23K3/02 , B23K3/06 , B23K31/12 , B23K1/00 , B23K3/08 , H05K1/02 , H05K3/30 , B23K101/42 , G01B21/08
摘要： A soldering iron system with automatic variable temperature control comprising a hand piece or robot arm including a soldering cartridge having a soldering tip, a coil that generates a magnetic field, and a temperature sensor for sensing a temperature of the soldering tip; a variable power supply for delivering variable power to the coil to heat the soldering tip; a processor including associated circuits for accepting a set temperature input and the sensed temperature of the soldering tip, and providing a control signal to control the variable power supply to deliver a suitable power to the coil to keep the temperature of the soldering tip at a substantially constant level of the set temperature input.

8. 发明申请

US20200149690A1 LED TUBE LAMP FIT FOR BEING SUPPLIED BY A BALLAST ACCORDING TO THE VOLTAGE LEVEL OF AN EXTERNAL DRIVING SIGNAL 审中-公开
公开(公告)号：US20200149690A1
公开(公告)日：2020-05-14
申请号：US16740400
申请日：2020-01-11
申请人： JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD
发明人： Aiming XIONG , Xintong Liu , Xiaojia Wu
IPC分类号： F21K9/278 , F21V3/10 , F21V3/06 , F21V15/015 , F21V23/00 , B23K1/00 , B23K3/047 , F21K9/275 , F21V29/83 , F21V23/02 , F21V17/10 , H05B45/50 , H05B45/37
摘要： An LED tube lamp comprises an LED module for emitting light; a rectifying circuit for rectifying an input external driving signal to produce a rectified signal; and a ballast interface circuit coupled to the LED module and comprising a detection circuit configured to determine that the external driving signal is a high frequency or high voltage signal when the voltage level of the rectified signal is higher than a predefined first threshold level. The ballast interface circuit causes an open circuit for the LED module when the voltage level of the rectified signal is higher than a predefined second threshold level but lower than the predefined first threshold level. And the ballast interface circuit causes current conduction in the LED module when the voltage level of the rectified signal, as based on an external driving signal from an inductive ballast, is lower than the predefined second threshold level.

9. 发明申请

US20200061730A1 HEATING DEVICE 审中-公开
公开(公告)号：US20200061730A1
公开(公告)日：2020-02-27
申请号：US16489749
申请日：2018-05-25
申请人： Continental Automotive France , Continental Automotive GmbH
发明人： Cédric Benaben , Stéphane Vitali
IPC分类号： B23K1/018 , B23K3/047 , H05K13/04 , H01L23/00
摘要： A heating device suitable for heating at least one soldered joint between an electronic component including at least a first contact mound and a printed circuit board. The soldered joint on the one hand securing the electronic component to the printed circuit board and on the other hand, while providing electrical continuity, the electronic component also having an electronic-component width, and an electronic-component thickness, wherein it includes an electrical-connection suitable for being coupled to an electrical power supply and a heater suitable for reaching a temperature at least equal to the melting point of the solder.

10. 发明申请

US20190383448A1 MODE SWITCHING CIRCUIT FOR CHANGING A SIGNAL PATH IN AN LED TUBE LAMP 审中-公开
公开(公告)号：US20190383448A1
公开(公告)日：2019-12-19
申请号：US16554649
申请日：2019-08-29
申请人： JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD
发明人： Aiming Xiong , Xintong Liu
IPC分类号： F21K9/278 , F21V3/10 , F21V3/06 , F21V15/015 , F21V23/00 , H05B33/08 , B23K1/00 , B23K3/047 , F21K9/275 , F21V29/83 , F21V23/02 , F21V17/10
摘要： A mode switching circuit is configured to change a signal path in a light-emitting diode (LED) tube lamp and comprises: at least one switch, configured to receive a filtered signal as a driving signal to drive an LED module in the LED tube lamp to emit light, and when a frequency of an external driving signal received by the LED tube lamp is higher than a mode switching frequency, output the driving signal to the LED module. The LED tube lamp comprises an auxiliary power module coupled to provide auxiliary power for the LED module to emit light; and the mode switching circuit is on a printed circuit board and is electrically connected to the LED module on a bendable circuit sheet in the LED tube lamp, wherein the bendable circuit sheet is disposed below the printed circuit board to be electrically connected to the printed circuit board by soldering.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式