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    • 45. 发明授权
    • Method of manufacturing flash memory device
    • 制造闪存设备的方法
    • US07138314B2
    • 2006-11-21
    • US11014570
    • 2004-12-16
    • Pil Geun SongSang Wook Park
    • Pil Geun SongSang Wook Park
    • H01L21/336
    • H01L21/28273H01L27/105H01L27/1052H01L27/115H01L27/11526H01L27/11546
    • Disclosed is a method of manufacturing a flash memory device using a STI process. Isolation films of a projection structure becomes isolation films of a nipple structure by means of a slant ion implant process and a wet etching process. A polysilicon layer is removed until the tops of the isolation films through two step processes of a CMP process and an etch-back process, thus forming floating gates and gates of high voltage and low voltage transistors of a cell. As such, as the isolation films of the nipple structure and the floating gates are formed at the same time, it is possible secure the overlay margin between an active region and the floating gates regardless of the shrinkage of the flash memory device. Also, moats can be prevented from being generated at the boundary between the active regions when the isolation films of the nipple structure are formed. Further, when the floating gates and the gates of the high voltage and low voltage transistors are formed, a dishing phenomenon and an erosion phenomenon can be prevented.
    • 公开了使用STI工艺制造闪速存储器件的方法。 突起结构的隔离膜通过倾斜离子注入工艺和湿蚀刻工艺成为乳头结构的隔离膜。 通过CMP工艺和回蚀工艺的两个步骤,去除多晶硅层直到隔离膜的顶部,从而形成电池的高压和低压晶体管的浮动栅极和栅极。 因此,由于乳头结构和浮动栅极的隔离膜同时形成,所以可以确保有源区域和浮动栅极之间的覆盖边界,而与闪存器件的收缩无关。 此外,当形成乳头结构的隔离膜时,可以防止在有源区域之间的边界处产生护壁。 此外,当形成高压和低压晶体管的浮置栅极和栅极时,可以防止凹陷现象和侵蚀现象。
    • 46. 发明授权
    • Method of manufacturing flash memory device
    • 制造闪存设备的方法
    • US07015097B2
    • 2006-03-21
    • US10887260
    • 2004-07-08
    • Seung Cheol LeeSang Wook ParkPil Geun Song
    • Seung Cheol LeeSang Wook ParkPil Geun Song
    • H01L21/336
    • H01L27/11539H01L27/11526H01L27/11536H01L27/11541H01L27/11543
    • Provided relates to a method of a flash memory device, which performs a first rapid thermal oxidation process at a H2 rich atmosphere for recovering an etched damage during a gate forming process, and performs a second rapid thermal oxidation process at the H2 rich atmosphere for ion-activating after performing an ion implantation process for forming a cell transistor junction and a peripheral circuit transistor junction. As a result of those processes, a Si-dangling bond cut off during a gate etching process has a Si—H combination structure and the whole processing time is reduced, and thus an abnormal oxidation caused at an edge of an ONO layer and a tunnel oxide film, which can make it possible to prevent a smiling phenomena of the ONO layer and a bird's beak phenomena of the tunnel oxide film.
    • 本发明涉及一种闪存器件的方法,其在H 2富含气氛下进行第一快速热氧化处理,以在栅极形成工艺期间回收蚀刻损伤,并执行第二快速热氧化 在进行用于形成单元晶体管结的离子注入工艺和外围电路晶体管结的离子激活之后,在富H 2气氛下进行离子激活。 作为这些工艺的结果,在栅极蚀刻工艺期间切断的Si-悬挂键具有Si-H组合结构,并且整个处理时间减少,因此在ONO层和隧道的边缘处引起异常氧化 氧化膜,能够防止ONO层的微笑现象和隧道状氧化膜的鸟喙现象。