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41. 发明授权

US06987794B1 Receiver and received channel estimation method for the same 失效
标题翻译：接收机和接收信道估计方法相同
公开(公告)号：US06987794B1
公开(公告)日：2006-01-17
申请号：US09589170
申请日：2000-06-08
申请人： Ryuji Kohno , Satoru Ishii , Atsushi Hoshikuki
发明人： Ryuji Kohno , Satoru Ishii , Atsushi Hoshikuki
IPC分类号： H04B1/69 , H04B1/707 , H04B1/713
CPC分类号： H04B1/7156 , H04L2027/0065 , H04L2027/0081
摘要： A receiver is provided that can shorten the time during which initial synchronization is established. When the frequency of an output signal from the PLL 12 is set to the receiving channel corresponding to the transmission channel for a transmission signal, the time-constant switching circuit 17 changes the time constant of the loop filter 14 to a low rate mode. Meanwhile, the output signal frequency from the PLL is swept between the highest frequency and the lowest frequency signal of a frequency channel. Thus, a receiving channel corresponding to the transmission channel is estimated by signals received during the sweeping period so that the initial synchronization is established based on the estimation result. Receiving-channel estimation, to which adverse effects due to multi-path fading are reduced, can be reliably performed by selecting each of plural receiving antennas in time-divisional mode and synthesizing envelopes of received signals from respective antennas.
摘要翻译：提供了可以缩短建立初始同步的时间的接收机。当来自PLL12的输出信号的频率被设置为与传输信号的传输信道相对应的接收信道时，时间常数切换电路17将环路滤波器14的时间常数改变为低速率模式。同时，来自PLL的输出信号频率在频率信道的最高频率和最低频率信号之间扫描。因此，通过在扫描周期期间接收到的信号来估计对应于传输信道的接收信道，从而基于估计结果建立初始同步。通过在时分模式中选择多个接收天线中的每一个并且合成来自各个天线的接收信号的包络，可以可靠地执行通过减少由于多径衰落引起的不利影响的接收信道估计。

42. 发明申请

US20050146480A1 Ultra wideband bow-tie printed antenna 有权
标题翻译：超宽带蝴蝶结印花天线
公开(公告)号：US20050146480A1
公开(公告)日：2005-07-07
申请号：US10925926
申请日：2004-08-26
申请人： Kamya Yazdandoost , Ryuji Kohno
发明人： Kamya Yazdandoost , Ryuji Kohno
IPC分类号： H01Q1/38 , H01Q9/28
CPC分类号： H01Q9/285
摘要： A printed antenna includes a dielectric substrate having a pair of printed antenna elements to form a dipole antenna. On an antenna plane, an xy axis system is defined so that an origin is defined at a center of location of the antenna elements, and an x axis is set in a direction that the antenna elements are arranged, a y axis is set in the direction perpendicular to the x axis, and a size of the antenna elements in the direction of the y axis become gradually larger according to the x axis changing in an outer direction. Each of the antenna elements has an impedance matching part at a feeding side of the antenna elements. The printed antenna can be used in an ultra wide-band frequency, and is small profile, is light weight and low in cost.
摘要翻译：印刷天线包括具有一对印刷天线元件以形成偶极子天线的电介质基片。在天线平面上，定义xy轴系，使得原点被定义在天线元件的位置的中心，并且x轴被设置在天线元件布置的方向上，ay轴被设置在方向垂直于x轴的方向，并且沿着y轴方向的天线元件的尺寸根据x轴在外侧方向上的变化而逐渐变大。每个天线元件在天线元件的馈电侧具有阻抗匹配部分。印刷天线可用于超宽带频率，体积小，重量轻，成本低。

43. 发明授权

US06885208B2 Semiconductor device and test device for same 失效
标题翻译：半导体器件和测试装置相同
公开(公告)号：US06885208B2
公开(公告)日：2005-04-26
申请号：US10218596
申请日：2002-08-15
申请人： Toshio Miyatake , Tatsuya Nagata , Hiroya Shimizu , Ryuji Kohno , Hideyuki Aoki
发明人： Toshio Miyatake , Tatsuya Nagata , Hiroya Shimizu , Ryuji Kohno , Hideyuki Aoki
IPC分类号： G01R31/28 , G01R31/26 , G11C11/419 , G11C29/04 , H01L21/66 , H01L21/822 , H01L23/544 , H01L23/58 , H01L27/04
CPC分类号： H01L22/32 , G11C29/04 , G11C29/1201 , G11C2029/1206 , H01L22/34 , H01L2224/05554
摘要： A semiconductor device includes a quadrangular semiconductor substrate and a self test circuit formed on the semiconductor substrate. A plurality of pads are formed on the semiconductor substrate, which pads are coupled at least to the self test circuit. The semiconductor substrate includes four rectangular or square regions which each include a respective corner of the quadrangle, and at least two of the pads are respectively located on diagonally opposite ones of the regions from one another.
摘要翻译：半导体器件包括四边形半导体衬底和形成在半导体衬底上的自测电路。多个焊盘形成在半导体衬底上，这些焊盘至少耦合到自测电路。半导体衬底包括四个矩形或正方形区域，每个区域包括四边形的相应角部，并且至少两个衬垫分别位于彼此相对的一个区域上。

44. 发明申请

US20050032252A1 Testing apparatus for carrying out inspection of a semiconductor device 有权
标题翻译：用于对半导体器件进行检查的测试装置
公开(公告)号：US20050032252A1
公开(公告)日：2005-02-10
申请号：US10934046
申请日：2004-09-03
申请人： Ryuji Kohno , Hideo Miura , Masatoshi Kanamaru , Hiroya Shimizu , Hideyuki Aoki
发明人： Ryuji Kohno , Hideo Miura , Masatoshi Kanamaru , Hiroya Shimizu , Hideyuki Aoki
IPC分类号： G01R1/06 , G01R1/073 , G01R31/28 , H01L21/66 , G01R31/02 , G01R31/26
CPC分类号： G01R1/07314
摘要： A method of manufacturing a semiconductor device has forming process for forming a semiconductor device on a major surface of a wafer, and testing process for testing defect of the semiconductor device formed on the wafer. The testing process includes a step bringing a testing apparatus into contact with test electrodes of the semiconductor device. The testing apparatus has a contactor including a plurality of probes that come into contact with the test electrodes of the semiconductor device to be tested, and secondary electrodes electrically connected to the probes and disposed on a surface opposite to the probes; a substrate on which electrodes electrically communicated to the contactor by a conducting device. The conducting device is so formed that stress applied to the conducting device in the state where the probes are in contact with the test electrodes is larger than stress applied to the conducting device in the state where the probes are not in contact with the test electrodes.
摘要翻译：制造半导体器件的方法具有在晶片的主表面上形成半导体器件的形成工艺和用于测试形成在晶片上的半导体器件的缺陷的测试过程。测试过程包括使测试设备与半导体器件的测试电极接触的步骤。测试装置具有接触器，该接触器包括与待测半导体器件的测试电极接触的多个探针，以及与探针电连接并设置在与探针相对的表面上的二次电极; 电极通过导电装置与接触器电连通的基板。导电装置形成为在探针与测试电极接触的状态下施加到导电装置的应力大于在探针不与测试电极接触的状态下施加到导电装置的应力。

45. 发明授权

US06611859B1 Address setting method, client apparatus, server apparatus and client-server system 失效
标题翻译：地址设置方法，客户端设备，服务器设备和客户端 - 服务器系统
公开(公告)号：US06611859B1
公开(公告)日：2003-08-26
申请号：US09513794
申请日：2000-02-25
申请人： Ryuji Kohno
发明人： Ryuji Kohno
IPC分类号： G06F1516
CPC分类号： H04W8/26 , H04L29/06 , H04L29/12283 , H04L29/12311 , H04L61/2061 , H04L61/2084 , H04L67/42 , H04W76/10 , H04W88/08
摘要： A network comprises an IEEE 1394 sub-network serving as a wire-communication system at the high-level layer, and a plurality of radio-communication terminals (radio-communication nodes) which form DHCP clients. The IEEE 1394 sub-network constitutes an in-home LAN (Local Network Area). The IEEE 1394 sub-network includes antenna base stations each serving as a DHCP server. The antenna base stations have a pool comprising a predetermined number of addresses which are assigned automatically to radio-communication terminals (or DHCP clients) in a cell under control by each of the antenna base stations. In this case, the addresses in the pool controlled by the antenna base stations (DHCP servers) are varied among the servers according to a dynamic mobility distribution of radio-communication terminals. In this way, addresses can be utilized efficiently and, at the same time, it is possible to avoid a bus reset caused by a movement of a radio-communication terminal.
摘要翻译：网络包括用作高层的有线通信系统的IEEE 1394子网和形成DHCP客户端的多个无线电通信终端（无线电通信节点）。 IEEE 1394子网构成家庭内局域网（Local Network Area）。 IEEE 1394子网络包括各自用作DHCP服务器的天线基站。天线基站具有包括由每个天线基站控制的小区中的无线电通信终端（或DHCP客户端）自动分配的预定数量的地址的池。在这种情况下，由天线基站（DHCP服务器）控制的池中的地址根据无线电通信终端的动态移动性分配而在服务器之间变化。以这种方式，可以有效地利用地址，并且同时可以避免由无线电通信终端的移动引起的总线复位。

46. 发明授权

US06531327B2 Method for manufacturing semiconductor device utilizing semiconductor testing equipment 失效
公开(公告)号：US06531327B2
公开(公告)日：2003-03-11
申请号：US10073343
申请日：2002-02-13
申请人： Masatoshi Kanamaru , Yoshishige Endo , Atsushi Hosogane , Tatsuya Nagata , Ryuji Kohno , Hideyuki Aoki , Akihiko Ariga
发明人： Masatoshi Kanamaru , Yoshishige Endo , Atsushi Hosogane , Tatsuya Nagata , Ryuji Kohno , Hideyuki Aoki , Akihiko Ariga
IPC分类号： H01L2166
CPC分类号： G01R1/06733 , G01R1/06727 , G01R1/06738 , G01R1/06761 , G01R1/06772 , G01R1/07342 , G01R3/00
摘要： A method for manufacturing a semiconductor device includes forming an integrated circuit on a surface of a wafer and testing electric characteristic of the integrated circuit. The testing includes positioning each of probes of a semiconductor testing equipment and each of electrodes of a tested semiconductor element with each other, and allowing each of the probes to come into contact with each of the electrodes. The semiconductor testing equipment includes a first substrate having a cantilever, the probes being formed on the cantilever of the first substrate, and wires for electrically connecting the probes to electrode pads which are formed on an opposite side of the first substrate to a side on which the probes are formed. Each of the wires has a region arranged on an insulating layer, which is formed on the cantilever, on the opposite side.

47. 发明授权

US6049128A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US6049128A
公开(公告)日：2000-04-11
申请号：US820631
申请日：1997-03-19
申请人： Makoto Kitano , Ryuji Kohno , Naotaka Tanaka , Akihiro Yaguchi , Tetsuo Kumazawa , Ichiro Anjoh , Hideki Tanaka , Asao Nishimura , Shuji Eguchi , Akira Nagai , Mamoru Mita
发明人： Makoto Kitano , Ryuji Kohno , Naotaka Tanaka , Akihiro Yaguchi , Tetsuo Kumazawa , Ichiro Anjoh , Hideki Tanaka , Asao Nishimura , Shuji Eguchi , Akira Nagai , Mamoru Mita
IPC分类号： H01L21/60 , H01L23/04 , H01L23/12 , H01L23/31 , H01L23/495 , H01L23/48 , H01L23/34 , H01L23/52 , H01L29/40
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/49572 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01052 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/15787
摘要： A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.
摘要翻译：提供一种半导体器件，具有多个用于外部连接的电极的半导体芯片，除弹性体树脂形成的弹性体树脂部分，其除了多个电极中的至少一些外部结合到半导体芯片，包括树脂的带层，包括表面上的带状布线图案，用于将印刷布线图案接合到带布线图案的多个焊料凸块，用于将半导体芯片的多个电极连接到带布线图案的引线，以及密封用于覆盖引线的树脂，由引线连接的多个电极。弹性体树脂的横向弹性模量不小于50MPa且不大于750MPa。

48. 发明授权

US5959571A Radar device 失效
标题翻译：雷达设备
公开(公告)号：US5959571A
公开(公告)日：1999-09-28
申请号：US981054
申请日：1997-12-11
申请人： Yasushi Aoyagi , Toshihide Fukuchi , Kiyoshi Inoue , Ryuji Kohno
发明人： Yasushi Aoyagi , Toshihide Fukuchi , Kiyoshi Inoue , Ryuji Kohno
IPC分类号： G01S7/02 , G01S13/32 , G01S13/42 , G01S13/93
CPC分类号： G01S13/325 , G01S13/42 , G01S2013/9375
摘要： A radar device transmits an electric wave whose band is spread by a PN code, receives a reflected wave of the electric wave from an object 10, detects correlation between a received signal and a PN code which is delayed, and thereby detects the object. A receiving part 18 connects three receiving antennas 16a.about.16c sequentially one by one, thereby to receive a reflected wave from an object. The three receiving antennas are arranged having their directions so staggered that their antenna beam patterns partly overlap with each other. A correlation detection circuit 19 detects such a slide width that a value of correlation between a received signal received by each of the antennas and the PN code exceeds a predetermined threshold. An operation part 12 obtains an azimuth of an object based on the detected slide width and beam pattern characteristics of the antennas.
摘要翻译： PCT No.PCT / JP97 / 10372 Sec。 371 1997年12月11日第 102（e）日期1997年12月11日PCT 1997年4月22日提交PCT公布。公开号WO97 / 40400 PCT 日期1997年10月30日雷达装置发送带宽由PN码扩展的电波，从对象10接收电波的反射波，检测接收信号与被延迟的PN码之间的相关性，从而检测物体。接收部分18依次连接三个接收天线16a差分16c，从而接收来自物体的反射波。三个接收天线被布置成具有如此交错的方向，使得它们的天线波束图案彼此部分重叠。相关检测电路19检测由每个天线接收的接收信号与PN码之间的相关值超过预定阈值的滑动宽度。操作部分12基于检测到的天线的滑动宽度和波束图案特性来获得对象的方位角。

49. 发明授权

US5724041A Spread spectrum radar device using pseudorandom noise signal for detection of an object 失效
标题翻译：扩频雷达装置使用伪随机噪声信号检测物体
公开(公告)号：US5724041A
公开(公告)日：1998-03-03
申请号：US561985
申请日：1995-11-22
申请人： Kiyoshi Inoue , Haruhiko Ishizu , Ryuji Kohno
发明人： Kiyoshi Inoue , Haruhiko Ishizu , Ryuji Kohno
IPC分类号： G01S7/02 , G01S7/285 , G01S13/28 , G01S13/34 , G01S13/58 , G01S13/93
CPC分类号： G01S13/931 , G01S13/346 , G01S13/584 , G01S7/285 , G01S13/284 , G01S2013/9375
摘要： A radar device transmits by a transmitting part a wave whose band is spread by a PN code from a PN generator, receives at a receiving part a reflected wave from an object based on the wave and detects the object by detecting correlation between the received signal and the PN code. In this radar device, the received signal which is spread to a wide range is converted to a low-frequency band which is easy to be measured by a down converter so that a signal is generated when correlation is made by a delay of the PN code from a delay circuit, and generates a pulse signal through waveform shaping of the signal to detect the object and to measure its relative speed and distance at a processing part according to the pulse signal and the delay time.
摘要翻译：雷达装置由发射部分发送波段，其波段由PN发生器通过PN码扩展，在接收部分接收基于波的对象的反射波，并通过检测接收信号和 PN码。在该雷达装置中，扩展到宽范围的接收信号被转换为易于由下变频器测量的低频带，使得当通过PN码的延迟进行相关时产生信号并且通过信号的波形整形产生脉冲信号，以检测物体，并根据脉冲信号和延迟时间测量处理部分的相对速度和距离。

50. 发明授权

US5539250A Plastic-molded-type semiconductor device 失效
标题翻译：塑料成型型半导体器件
公开(公告)号：US5539250A
公开(公告)日：1996-07-23
申请号：US713100
申请日：1991-06-11
申请人： Makoto Kitano , Asao Nishimura , Akihiro Yaguchi , Ryuji Kohno , Nae Yoneda
发明人： Makoto Kitano , Asao Nishimura , Akihiro Yaguchi , Ryuji Kohno , Nae Yoneda
IPC分类号： H01L25/18 , H01L23/31 , H01L23/495 , H01L25/065 , H01L25/07 , H01L23/34
CPC分类号： H01L24/32 , H01L23/3135 , H01L23/4951 , H01L23/49555 , H01L23/49575 , H01L2224/29339 , H01L2224/32014 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/49171 , H01L2224/73215 , H01L2224/83191 , H01L2224/85201 , H01L2224/85205 , H01L2224/8592 , H01L2224/92 , H01L2224/92147 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/181
摘要： A plastic-molded-type semiconductor device is provided wherein two semiconductor chips, having main surfaces on which electrodes and circuits are formed, are arranged to face each other. A lead frame is placed between these two semiconductor chips and electrically connected to their electrodes, and a plastic package is formed by plastic-sealing the above components. To provide for secure and convenient electrical connections between the electrodes on the semiconductor chips and the lead frame, wiring patterns are provided on the main surfaces of the semiconductor chips through the intermediation of insulating films. With this structure, it is possible for two large-sized semiconductor chips having electrodes in their middle sections to be encased in a single, relatively thin package.
摘要翻译：提供了一种塑料模制型半导体器件，其中具有形成有电极和电路的主表面的两个半导体芯片被布置成彼此面对。引线框架放置在这两个半导体芯片之间并电连接到它们的电极，并且通过塑性密封上述部件形成塑料封装。为了提供半导体芯片上的电极和引线框架之间的牢固和方便的电连接，布线图案通过绝缘膜设置在半导体芯片的主表面上。利用这种结构，在其中间部分中具有电极的两个大尺寸半导体芯片可以被封装在单个相对薄的封装中。

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