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41. 发明授权

US07884935B2 Pattern transfer apparatus, imprint apparatus, and pattern transfer method 有权
标题翻译：图案转印装置，压印装置和图案转印方法
公开(公告)号：US07884935B2
公开(公告)日：2011-02-08
申请号：US11736696
申请日：2007-04-18
申请人： Nobuhito Suehira , Junichi Seki , Hideki Ina , Koichi Sentoku
发明人： Nobuhito Suehira , Junichi Seki , Hideki Ina , Koichi Sentoku
IPC分类号： G01B11/00 , G01B15/00 , G01N21/86 , G01V8/00 , B41F1/34 , B41F21/12 , B41F21/14 , B41L1/02 , B29C45/76 , B29C35/08 , B29C35/12 , B29C47/92 , B29C47/96 , B29B13/00 , B29B15/00 , B28B17/00
CPC分类号： G03F7/0002 , B41M3/00 , B41M2205/26 , B82Y10/00 , B82Y40/00 , G03F9/00 , G03F9/7015 , G03F9/7042 , G03F9/7088
摘要： A pattern transfer apparatus transfers an imprint pattern formed on a mold, provided with an alignment mark, to a resin material on a substrate, provided with an alignment mark. A first image pickup device obtains an image of an object positioned at a first object position. A second image pickup device obtains an image of an object positioned at a second object position. The second object position is more distant from the alignment mark of the mold than the first object position. An optical system forms an image of an object positioned at the first object position and an image of an object positioned at the second object position. Alignment is performed based on first and second information obtained about positions of images of an alignment mark of a reference substrate and an alignment mark of the substrate, to transfer the imprinting pattern to the resin material.
摘要翻译：图案转印装置将形成在具有对准标记的模具上的印模图案转印到具有对准标记的基板上的树脂材料上。第一图像拾取装置获取位于第一对象位置的对象的图像。第二图像拾取装置获取位于第二对象位置的对象的图像。第二物体位置比第一物体位置更远离模具的对准标记。光学系统形成位于第一物体位置的物体的图像和位于第二物体位置的物体的图像。基于获得的关于参考基板的对准标记的图像的位置和基板的对准标记获得的第一和第二信息进行对准，以将印刷图案转印到树脂材料上。

42. 发明申请

US20100209828A1 RETICLE MANUFACTURING METHOD, SURFACE SHAPE MEASURING APPARATUS AND SIGNAL PROCESSOR 有权
标题翻译：表面制造方法，表面形状测量装置和信号处理器
公开(公告)号：US20100209828A1
公开(公告)日：2010-08-19
申请号：US12707441
申请日：2010-02-17
申请人： Koichi Sentoku
发明人： Koichi Sentoku
IPC分类号： G03F1/00 , G01B11/24
CPC分类号： G03F1/78
摘要： A reticle manufacturing method of the present invention comprises the steps of holding a reference mask blank by a reference chuck to measure a surface shape of the reference mask blank as a first surface shape, holding the reference mask blank by a reticle chuck of the exposure apparatus to measure a surface shape of the reference mask blank as a second surface shape, holding the electron beam drawing mask blank by the reference chuck to measure a surface shape of the electron beam drawing mask blank as a third surface shape, calculating a difference between the measurement values of the first surface shape and the second surface shape as a first deference value, calculating, as a forth surface shape, a surface shape of the electron beam drawing mask blank held by the reticle chuck on the basis of the first deference value and the measurement value of the third surface shape, and drawing the pattern on the electron beam drawing mask blank on the basis of the forth surface shape.
摘要翻译：本发明的掩模版制造方法包括以下步骤：通过基准卡盘保持基准掩模坯料，以测量作为第一表面形状的基准掩模坯料的表面形状，通过曝光装置的光罩卡盘保持基准掩模坯料为了测量作为第二表面形状的基准掩模坯料的表面形状，用参考卡盘夹住电子束描绘掩模坯料，以测量作为第三表面形状的电子束描绘掩模坯料的表面形状，将第一表面形状和第二表面形状的测量值作为第一尊重值，基于第一尊重值计算由标线盘卡盘保持的电子束描绘掩模坯料的表面形状，作为第四表面形状;以及第三表面形状的测量值，并且基于第四表面形状在电子束绘制掩模坯料上绘制图案。

43. 发明授权

US07670729B2 Measurement method and apparatus, exposure apparatus, and device fabrication method 有权
标题翻译：测量方法和装置，曝光装置和装置制造方法
公开(公告)号：US07670729B2
公开(公告)日：2010-03-02
申请号：US11142964
申请日：2005-06-01
申请人： Atsushi Takagi , Hideki Ina , Koichi Sentoku , Hiroshi Morohoshi
发明人： Atsushi Takagi , Hideki Ina , Koichi Sentoku , Hiroshi Morohoshi
IPC分类号： G03F7/00
CPC分类号： G03F7/706
摘要： A measurement method for measuring a distortion of a projection optical system that projects a pattern, used by an exposure apparatus that exposes the reticle pattern onto an object to be exposed, the measurement method includes the steps of a first exposing step for exposing a mark pattern onto the object to be exposed, the mark pattern having a mark on or near an optical axis of the projection optical system and a mark beside the optical axis, and being arranged at a position of the reticle, a second exposing step for only exposing a mark on or near the optical axis of the projection optical system in the mark pattern, measuring step for measuring a shape of the mark formed on the object to be exposed via the first and second exposing steps, and calculating step for calculating the distortion of the projection optical system from the shape of the mark measured by the measuring step.
摘要翻译：一种测量方法，用于测量投影光学系统的变形，所述投影光学系统将曝光所述掩模版图案的曝光装置所使用的图案投影到待曝光的物体上，所述测量方法包括以下步骤：第一曝光步骤，用于曝光标记图案在待曝光的物体上，标记图案在投影光学系统的光轴上或其附近具有标记，并且在光轴旁边具有标记，并且被布置在光罩的位置，第二曝光步骤仅用于曝光在标记图案中的投影光学系统的光轴上或附近标记的测量步骤，用于测量经由第一和第二曝光步骤在待曝光的物体上形成的标记的形状的测量步骤，以及用于计算第投影光学系统从由测量步骤测量的标记的形状。

44. 发明授权

US07373213B2 Management system and apparatus, method therefor, and device manufacturing method 有权
标题翻译：管理系统及装置，方法及装置制造方法
公开(公告)号：US07373213B2
公开(公告)日：2008-05-13
申请号：US10901106
申请日：2004-07-29
申请人： Satoru Oishi , Hideki Ina , Takehiko Suzuki , Koichi Sentoku , Takahiro Matsumoto
发明人： Satoru Oishi , Hideki Ina , Takehiko Suzuki , Koichi Sentoku , Takahiro Matsumoto
IPC分类号： G06F19/00
CPC分类号： G03F7/70633 , G03F7/705 , G03F7/70525 , G03F9/7092 , G05B2219/32018 , Y02P90/22
摘要： A management apparatus which manages a parameter for an industrial device acquires AGA measurement results obtained by operating the industrial device with an operation job parameter value and non-operation job parameter value. An inspection apparatus acquires an “inspection result” obtained by inspecting the result of operating the industrial device in the operation job. A change in inspection result upon a change in parameter value is estimated on the basis of the AGA measurement result and inspection result. A variable which minimizes (extreme) both or at least one of the sensitivity (slope) of the inspection result upon a change in parameter value and variations (3σ) in inspection result between objects to be processed (e.g., wafers) is set as an optimal parameter.
摘要翻译：管理工业设备的参数的管理装置获取通过操作工作装置具有操作作业参数值和非操作作业参数值而获得的AGA测量结果。检查装置获取通过检查操作工作中的工业装置的操作结果而获得的“检查结果”。根据AGA测量结果和检查结果估计参数值变化时检查结果的变化。将待处理对象（例如，晶片）之间的参数值和检查结果中的变化（3sigma）的检查结果的灵敏度（斜率）两者或至少一个最小化（极端）的变量设置为最优参数。

45. 发明申请

US20080073604A1 IMPRINT APPARATUS AND IMPRINT METHOD 有权
标题翻译： IMPRINT设备和印刷方法
公开(公告)号：US20080073604A1
公开(公告)日：2008-03-27
申请号：US11851006
申请日：2007-09-06
申请人： Nobuhito Suehira , Junichi Seki , Hideki Ina , Koichi Sentoku
发明人： Nobuhito Suehira , Junichi Seki , Hideki Ina , Koichi Sentoku
IPC分类号： G06K9/00
CPC分类号： G03F9/7088 , B82Y10/00 , B82Y40/00 , G03F7/0002 , G03F9/7003 , G03F9/7042 , G06K9/325
摘要： An imprint apparatus, comprising a first holder for holding a mold having an imprint pattern; a second holder for holding a workpiece to which the imprint pattern is transferred; a first illumination system for irradiating a mark for determining a position of the mold and a mark for determining a position of the workpiece with light; a first and second optical systems for imaging the marks for the mold and workpiece at a first and second observation points respectively; an imaging optical system; a first and second image pick-up devices for observing the marks for the mold and workpiece respectively; and at least one of a first drive mechanism for moving the first image pick-up device while following movement of the first observation point and a second drive mechanism for moving the second image pick-up device while following movement of the second observation point.
摘要翻译：一种压印装置，包括用于保持具有印记图案的模具的第一保持器; 用于保持印刷图案被转印到的工件的第二保持器; 用于照射用于确定模具的位置的标记的第一照明系统和用于用光确定工件的位置的标记; 第一和第二光学系统，用于分别在第一和第二观察点成像用于模具和工件的标记; 成像光学系统; 分别用于观察模具和工件的标记的第一和第二图像拾取装置; 以及用于在跟随第一观察点的移动的同时移动第一图像拾取装置的第一驱动机构和用于在第二观察点的移动之前移动第二图像拾取装置的第二驱动机构中的至少一个。

46. 发明申请

US20070242272A1 PATTERN TRANSFER APPARATUS, IMPRINT APPARATUS, AND PATTERN TRANSFER METHOD 有权
标题翻译：图案转印装置，印刷装置和图案转印方法
公开(公告)号：US20070242272A1
公开(公告)日：2007-10-18
申请号：US11736696
申请日：2007-04-18
申请人： Nobuhito Suehira , Junichi Seki , Hideki Ina , Koichi Sentoku
发明人： Nobuhito Suehira , Junichi Seki , Hideki Ina , Koichi Sentoku
IPC分类号： G01B11/00
CPC分类号： G03F7/0002 , B41M3/00 , B41M2205/26 , B82Y10/00 , B82Y40/00 , G03F9/00 , G03F9/7015 , G03F9/7042 , G03F9/7088
摘要： A pattern transfer method for transferring an imprinting pattern formed on a mold provided with an alignment mark onto a substrate provided with an alignment mark or a resin material interposed between the substrate and the mold includes a first step for obtaining a first image by disposing the alignment mark provided to the mold and an alignment mark provided to a reference substrate at a first object position and observing the alignment marks through a first image pickup portion, a second step for obtaining a second image by disposing the alignment mark provided to the reference substrate at a second object position spaced apart from the first object position and observing the alignment mark through a second image pickup portion, and a third step for obtaining information about a difference in image position between the alignment marks by using the first and second images.
摘要翻译：用于将形成在具有对准标记的模具上形成的压印图案转印到设置有在基板和模具之间的对准标记或树脂材料的基板上的图案转印方法包括：第一步骤，通过设置对准来获得第一图像提供给模具的标记和在第一物体位置处提供给参考基板的对准标记，并且通过第一图像拾取部分观察对准标记;第二步骤，通过将设置在参考基板上的对准标记设置在第二图像与第一对象位置间隔开的第二对象位置，并通过第二图像拾取部分观察对准标记;以及第三步骤，通过使用第一和第二图像来获得关于对准标记之间的图像位置差异的信息。

47. 发明申请

US20070154824A1 METHOD AND PROGRAM FOR CALCULATING EXPOSURE DOSE AND FOCUS POSITION IN EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD 失效
标题翻译：用于计算曝光装置中曝光剂量和聚焦位置的方法和程序以及装置制造方法
公开(公告)号：US20070154824A1
公开(公告)日：2007-07-05
申请号：US11618137
申请日：2006-12-29
申请人： Koichi Sentoku , Hideki Ina , Koji Mikami , Yoshiaki Sugimura , Hiroto Yoshii , Tomoyuki Miyashita
发明人： Koichi Sentoku , Hideki Ina , Koji Mikami , Yoshiaki Sugimura , Hiroto Yoshii , Tomoyuki Miyashita
IPC分类号： G03F9/00 , G03C5/00
CPC分类号： G03F7/70641 , G03F7/70625
摘要： A method for calculating an offset of an exposure dose and a focus position in an exposure apparatus that exposes a substrate via an original includes the steps of obtaining information of a shape of a pattern formed on the substrate using the exposure apparatus, calculating a shift amount between a critical dimension contained in the information of the shape of the pattern and a reference value of the critical dimension, and calculating an offset of the focus position based on the information of the shape of the pattern, and calculating the offset of the exposure dose based on the shift amount and the offset of the focus position.
摘要翻译：用于计算经由原稿曝光基板的曝光装置中的曝光剂量和聚焦位置的偏移量的方法包括以下步骤：使用曝光装置获得在基板上形成的图案的形状的信息，计算偏移量在包含在图案形状的信息和临界尺寸的参考值之间的临界尺寸之间，基于图案形状的信息计算焦点位置的偏移量，以及计算曝光剂量的偏移量基于偏移量和焦点位置的偏移。

48. 发明申请

US20070007471A1 IMAGING OPTICAL SYSTEM AND EXPOSURE APPARATUS 有权
标题翻译：成像光学系统和曝光装置
公开(公告)号：US20070007471A1
公开(公告)日：2007-01-11
申请号：US11456115
申请日：2006-07-07
申请人： Koichi SENTOKU , Gaku Takahashi , Hideki Ina , Yoshinori Miwa
发明人： Koichi SENTOKU , Gaku Takahashi , Hideki Ina , Yoshinori Miwa
IPC分类号： G01N21/86
CPC分类号： G03F7/70883 , G02B13/143 , G02B17/0844 , G03F7/70275 , G03F9/7096
摘要： An imaging optical system for imaging a pattern of an object plane onto an image plane includes a first imaging optical system for imaging at a first imaging position, the first imaging optical system having a magnification α in a vacuum atmosphere, and a second imaging optical system for imaging at a second imaging position, the second imaging optical system having a magnification β in the vacuum atmosphere, wherein when an environment in which the imaging optical system is placed changes from the vacuum atmosphere to an air atmosphere or vise versa, a direction of the first imaging position that moves along an optical axis is opposite to a direction of the second imaging position that moves along the optical axis.
摘要翻译：用于将物平面图案成像到图像平面上的成像光学系统包括用于在第一成像位置成像的第一成像光学系统，具有在真空气氛中的α倍的第一成像光学系统和第二成像光学系统为了在第二成像位置进行成像，第二成像光学系统在真空气氛中具有放大率β，其中当放置成像光学系统的环境从真空气氛改变到空气气氛或反之亦然时，方向沿着光轴移动的第一成像位置与沿着光轴移动的第二成像位置的方向相反。

49. 发明授权

US07148973B2 Position detecting method and apparatus, exposure apparatus and device manufacturing method 有权
标题翻译：位置检测方法和装置，曝光装置和装置的制造方法
公开(公告)号：US07148973B2
公开(公告)日：2006-12-12
申请号：US11169789
申请日：2005-06-30
申请人： Koichi Sentoku , Hideki Ina , Takehiko Suzuki , Satoru Oishi
发明人： Koichi Sentoku , Hideki Ina , Takehiko Suzuki , Satoru Oishi
IPC分类号： G01B11/14 , G01N21/86 , G03B27/42
CPC分类号： G03F9/7015 , G03F7/70233 , G03F9/7011 , G03F9/7065 , G03F9/7088
摘要： A method of determining relative position between a reflective reticle and a substrate includes a detection step of detecting relative position between a transmissive reference mark on a reticle stage and a substrate alignment mark on a substrate stage through a reflective optical system which projects a pattern of the reflective reticle onto the substrate with extreme ultraviolet light, and a determination step of determining relative position between the reflective reticle and the substrate based on the detection result in the detection step.
摘要翻译：一种确定反射标线板和基板之间的相对位置的方法包括检测步骤，通过反射光学系统检测标线台上的透射基准标记与基板台上的基板对准标记之间的相对位置，基于检测步骤的检测结果，确定反射型掩模版与基板之间的相对位置的确定步骤。

50. 发明申请

US20060195215A1 Management system, management apparatus, management method, and device manufacturing method 审中-公开
公开(公告)号：US20060195215A1
公开(公告)日：2006-08-31
申请号：US11406331
申请日：2006-04-19
申请人： Takehiko Suzuki , Hideki Ina , Koichi Sentoku , Takahiro Matsumoto , Satoru Oishi
发明人： Takehiko Suzuki , Hideki Ina , Koichi Sentoku , Takahiro Matsumoto , Satoru Oishi
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32182 , G05B2219/32191 , Y02P90/22
摘要： A management system including an acquisition device for acquiring actual processing results obtained by operating an industrial device with a set parameter value and another parameter value, and an estimated processing result, an inspection device for inspecting the processing result obtained with the set parameter value, and acquiring and accumulating an inspection result value, a change device for changing the set parameter value on the basis of the processing results acquired by the acquisition device and the inspection result value obtained by the inspection device, an evaluation device for evaluating a variation state of the processing results on the basis of an inspection result value accumulated by the inspection device, and a decision device for deciding, on the basis of an evaluation result by the evaluation device, a frequency at which the acquisition device is executed.

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