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    • 31. 发明授权
    • Power semiconductor device
    • 功率半导体器件
    • US07816706B2
    • 2010-10-19
    • US12007890
    • 2008-01-16
    • Munaf RahimoPeter Streit
    • Munaf RahimoPeter Streit
    • H01L29/745H01L21/332
    • H01L29/102H01L29/744
    • The power semiconductor device with a four-layer npnp structure can be turned-off via a gate electrode. The first base layer comprises a cathode base region adjacent to the cathode region and a gate base region adjacent to the gate electrode, but disposed at a distance from the cathode region. The gate base region has the same nominal doping density as the cathode base region in at least one first depth, the first depth being given as a perpendicular distance from the side of the cathode region, which is opposite the cathode metallization. The gate base region has a higher doping density than the cathode base region and/or the gate base region has a greater depth than the cathode base region in order to modulate the field in blocking state and to defocus generated holes from the cathode when driven into dynamic avalanche.
    • 具有四层npnp结构的功率半导体器件可以通过栅电极截止。 第一基极层包括与阴极区域相邻的阴极基极区域和与栅极电极相邻但与阴极区域相距一定距离的栅极基极区域。 栅极基极区域在至少一个第一深度中具有与阴极基极区域相同的标称掺杂密度,第一深度被给定为与阴极金属化相对的阴极区域侧的垂直距离。 栅极基极区域具有比阴极基极区域更高的掺杂密度和/或栅极基极区域具有比阴极基极区域更大的深度,以便调制阻塞状态下的场并且当被驱动进入时将其从阴极散焦 动态雪崩
    • 32. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20090159926A1
    • 2009-06-25
    • US12277838
    • 2008-11-25
    • Tetsuya IKUTA
    • Tetsuya IKUTA
    • H01L29/745H01L21/332
    • H01L29/7455H01L29/66363
    • A semiconductor device includes a thyristor in which a first-conductivity-type first region, a second-conductivity-type second region having a conductivity type reverse to the first conductivity type, a first-conductivity-type third region, and a second-conductivity-type fourth region are sequentially arranged to form junctions. The third region is formed on a semiconductor substrate separated by an element isolation region. A gate electrode formed via a gate insulating film and side wall formed at wall side of both side of the gate electrode are provided on the third region, and the fourth region is formed so that one end thereof covers the joint portion between the other end of the third region and the element isolation regions, and so that the other end of the fourth region is joined with the sidewall on the other side.
    • 半导体器件包括晶闸管,其中第一导电型第一区,具有与第一导电类型相反的导电类型的第二导电型第二区,第一导电型第三区和第二导电型 依次排列形成接合点。 第三区域形成在由元件隔离区域分离的半导体衬底上。 通过栅极绝缘膜形成的栅电极和形成在栅极两侧的壁侧的侧壁设置在第三区域上,第四区域形成为使得其一端覆盖栅极电极的另一端的接合部分 第三区域和元件隔离区域,并且使得第四区域的另一端与另一侧的侧壁接合。