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    • 8. 发明授权
    • Integrated circuit having multiple memory types and method of formation
    • 具有多种存储器类型和形成方法的集成电路
    • US06831310B1
    • 2004-12-14
    • US10705504
    • 2003-11-10
    • Leo MathewRamachandran Muralidhar
    • Leo MathewRamachandran Muralidhar
    • H01L2980
    • H01L27/108B82Y10/00H01L27/115H01L27/11521H01L27/11568H01L29/42332H01L29/785H01L29/7881
    • A transistor (10) is formed having three separately controllable gates (44, 42, 18). The three gate regions may be electrically biased differently and the gate regions may have different conductivity properties. The dielectrics on the channel sidewall may be different than the dielectrics on the top of the channel. Electrical contacts to source, drain and the three gates is selectively made. By including charge storage layers, such as nanoclusters, adjacent the transistor channel and controlling the charge storage layers via the three gate regions, both volatile and non-volatile memory cells are realized using the same process to create a universal memory process. When implemented as a volatile cell, the height of the transistor and the characteristics of channel sidewall dielectrics control the memory retention characteristics. When implemented as a nonvolatile cell, the width of the transistor and the characteristics of the overlying channel dielectrics control the memory retention characteristics.
    • 晶体管(10)形成有三个可分别控制的栅极(44,42,18)。 三个栅极区域可以被不同地电偏置,并且栅极区域可以具有不同的导电性质。 通道侧壁上的电介质可以不同于通道顶部的电介质。 选择性地制造到源极,漏极和三个栅极的电接触。 通过包括与晶体管沟道相邻的电荷存储层,例如纳米团簇,并通过三个栅极区域控制电荷存储层,使用相同的过程实现易失性和非易失性存储单元,从而创建通用存储器处理。 当实现为易失性单元时,晶体管的高度和通道侧壁电介质的特性控制存储器保持特性。 当被实现为非易失性单元时,晶体管的宽度和上覆通道电介质的特性控制存储器保持特性。
    • 9. 发明授权
    • Transistor having three electrically isolated electrodes and method of formation
    • 具有三个电隔离电极的晶体管和形成方法
    • US07098502B2
    • 2006-08-29
    • US10705317
    • 2003-11-10
    • Leo MathewRamachandran Muralidhar
    • Leo MathewRamachandran Muralidhar
    • H01L27/108H01L27/12H01L21/00H01L21/336
    • H01L27/108B82Y10/00H01L21/28273H01L21/28282H01L27/10826H01L27/10879H01L27/10894H01L29/42332H01L29/66825H01L29/66833H01L29/785H01L29/7881
    • A transistor (10) is formed having three separately controllable gates (44, 42, 18). The three gate regions may be electrically biased differently and the gate regions may have different conductivity properties. The dielectrics on the channel sidewall may be different than the dielectrics on the top of the channel. Electrical contacts to source, drain and the three gates is selectively made. By including charge storage layers, such as nanoclusters, adjacent the transistor channel and controlling the charge storage layers via the three gate regions, both volatile and non-volatile memory cells are realized using the same process to create a universal memory process. When implemented as a volatile cell, the height of the transistor and the characteristics of channel sidewall dielectrics control the memory retention characteristics. When implemented as a nonvolatile cell, the width of the transistor and the characteristics of the overlying channel dielectrics control the memory retention characteristics.
    • 晶体管(10)形成有三个可分别控制的栅极(44,42,18)。 三个栅极区域可以被不同地电偏置,并且栅极区域可以具有不同的导电性质。 通道侧壁上的电介质可以不同于通道顶部的电介质。 选择性地制造到源极,漏极和三个栅极的电接触。 通过包括与晶体管沟道相邻的电荷存储层,例如纳米团簇,并通过三个栅极区域控制电荷存储层,使用相同的过程实现易失性和非易失性存储单元,从而创建通用存储器处理。 当实现为易失性单元时,晶体管的高度和通道侧壁电介质的特性控制存储器保持特性。 当被实现为非易失性单元时,晶体管的宽度和上覆通道电介质的特性控制存储器保持特性。
    • 10. 发明授权
    • Transistor with vertical dielectric structure
    • 具有垂直电介质结构的晶体管
    • US07018876B2
    • 2006-03-28
    • US10871772
    • 2004-06-18
    • Leo MathewRamachandran Muralidhar
    • Leo MathewRamachandran Muralidhar
    • H01L21/00H01L21/84H01L21/8238H01L21/336
    • H01L21/28273H01L29/42324H01L29/66795H01L29/66825H01L29/785H01L29/7887
    • A transistor (103) with a vertical structure (113) that includes a dielectric structure (201) below a semiconductor structure (109). The semiconductor structure includes a channel region (731) and source/drain regions (707, 709). The transistor includes a gate structure (705, 703) that has a portion laterally adjacent to the semiconductor structure and a portion laterally adjacent to the dielectric structure. In one embodiment, the gate structure is a floating gate structure wherein a control gate structure (719) also includes portion laterally adjacent to the dielectric structure and a portion laterally adjacent to the semiconductor structure. In some examples, having a portion of the floating gate and a portion of the control gate adjacent to the dielectric structure acts to increase the control gate to floating gate capacitance without significantly increasing the capacitance of the floating gate to channel region.
    • 一种具有垂直结构(113)的晶体管(103),其包括半导体结构(109)下面的电介质结构(201)。 半导体结构包括沟道区(731)和源极/漏极区(707,709)。 晶体管包括具有与半导体结构横向相邻的部分和与电介质结构横向相邻的部分的栅极结构(705,703)。 在一个实施例中,栅极结构是浮动栅极结构,其中控制栅极结构(719)还包括横向邻近电介质结构的部分和与半导体结构横向相邻的部分。 在一些示例中,具有浮置栅极的一部分和与电介质结构相邻的控制栅极的一部分用于将控制栅极增加到浮置栅极电容,而不显着增加浮置栅极到沟道区的电容。