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31. 发明申请

US20120222888A1 PCB WITH HEAT DISSIPATION STRUCTURE AND PROCESSING METHODS THEREOF 审中-公开
标题翻译： PCB散热结构及其处理方法
公开(公告)号：US20120222888A1
公开(公告)日：2012-09-06
申请号：US13141394
申请日：2011-05-09
申请人： Tian Zhang
发明人： Tian Zhang
IPC分类号： H05K7/20 , C04B35/64
CPC分类号： H05K1/0203 , C04B37/025 , C04B2237/062 , C04B2237/34 , C04B2237/343 , C04B2237/36 , C04B2237/365 , C04B2237/40 , H05K1/0306 , H05K2201/0116 , H05K2201/10106
摘要： The invention relates to a printed circuit board (PCB) with a heat dissipating structure. The PCB comprises a conducting layer and a PCB carrier layer, wherein the PCB carrier layer is a porous heat conducting layer; heat conducting liquid or a solid-liquid phase change heat conducting material is injected into holes of the porous heat conducting layer; the conducting layer is arranged on a first surface of the porous heat conducting layer; and a second surface of the porous heat conducting layer is a contact interface with external media. In the invention, the carrier layer of the PCB is a porous heat conducting layer which is made of a porous material with high thermal conductivity, heat conducting liquid such as heat conducting ink or the solid-liquid phase change heat conducting material permeates into the holes of the porous heat conducting layer; when the PCB is heated, the heat conducting ink is separated out of the porous material because the expansion coefficient of the porous material is inconsistent with that of the heat conducting ink, and the separated heat conducting ink fills air gaps between the contact interface and the external medium in the contact interface of the PCB via capillary phenomenon, so that heat resistance between a light-emitting diode (LED) and the contact interface is reduced greatly and the thermal conductivity of the PCB is enhanced; moreover, the PCB has low cost, simple structure and easy installation.
摘要翻译：本发明涉及一种具有散热结构的印刷电路板（PCB）。 PCB包括导电层和PCB载体层，其中PCB载体层是多孔导热层; 将导热液体或固液相变导热材料注入多孔导热层的孔中; 所述导电层设置在所述多孔导热层的第一表面上; 并且所述多孔导热层的第二表面是与外部介质的接触界面。在本发明中，PCB的载体层是由具有高导热性的多孔材料制成的多孔导热层，诸如导热油墨的导热液体或固 - 液相变导热材料渗入孔中的多孔导热层; 当PCB被加热时，由于多孔材料的膨胀系数与导热油墨的膨胀系数不一致，导热油墨从多孔材料中分离出来，并且分离的导热油墨填充接触界面和外部介质通过毛细管现象在PCB的接触界面中，使得发光二极管（LED）和接触界面之间的耐热性大大降低，并且PCB的导热性增强; 而且PCB成本低，结构简单，安装方便。

32. 发明申请

US20110255850A1 ELECTRONIC SUBASSEMBLIES FOR ELECTRONIC DEVICES 审中-公开
标题翻译：用于电子设备的电子底座
公开(公告)号：US20110255850A1
公开(公告)日：2011-10-20
申请号：US12794601
申请日：2010-06-04
申请人： Richard Hung Minh Dinh , Tang Yew Tan , Jason Sloey , Shayan Malek , Scott Myers , Dennis R. Pyper , Douglas P. Kidd , Ronald W. Dimpflmaier , Andrew B. Just , Trent Weber , Daniel W. Jarvis
发明人： Richard Hung Minh Dinh , Tang Yew Tan , Jason Sloey , Shayan Malek , Scott Myers , Dennis R. Pyper , Douglas P. Kidd , Ronald W. Dimpflmaier , Andrew B. Just , Trent Weber , Daniel W. Jarvis
IPC分类号： G03B15/03 , H01R13/648 , H05K9/00 , H01R13/516
CPC分类号： H05K9/0024 , B32B17/061 , B41F17/00 , G03B15/03 , G06F1/1626 , G06F1/1656 , H01L23/24 , H01L23/296 , H01L23/3737 , H01L23/552 , H01L23/66 , H01L2223/6644 , H01M2/026 , H01M2/0292 , H01M2220/30 , H03F3/195 , H03F3/213 , H03F2200/451 , H04M1/0277 , H05K1/0203 , H05K1/0215 , H05K1/181 , H05K1/189 , H05K3/341 , H05K3/3447 , H05K3/363 , H05K2201/0116 , H05K2201/0162 , H05K2201/056 , H05K2201/10106 , H05K2201/10121 , H05K2201/10371 , H05K2201/10409 , H05K2201/2009 , H05K2203/1316 , Y02P70/613 , Y10T29/4911
摘要： Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Heat sinks and other thermally conductive structures may be used to remove excess component heat. Structures may also be provided in an electronic device to detect moisture. Integrated circuits and other circuitry may be mounted on a printed circuit board under a radio-frequency shielding can.
摘要翻译：可以提供包括机械和电子部件的电子设备。连接器可用于连接安装到印刷电路的印刷电路和器件。印刷电路可以包括刚性印刷电路板和柔性印刷电路板。散热片和其他导热结构可用于去除多余的部件热量。也可以在电子设备中提供结构以检测湿气。集成电路和其他电路可以安装在射频屏蔽罐下的印刷电路板上。

33. 发明申请

US20110255250A1 PRINTED CIRCUIT BOARD COMPONENTS FOR ELECTRONIC DEVICES 审中-公开
标题翻译：电子设备印刷电路板组件
公开(公告)号：US20110255250A1
公开(公告)日：2011-10-20
申请号：US12794599
申请日：2010-06-04
申请人： Richard Hung Minh Dinh , Tang Yew Tan , Nicholaus Ian Lubinski , Jason Sloey , Shayan Malek , Scott Myers , Wyeman Chen , Dennis R. Pyper , Douglas P. Kidd , Joshua G. Wurzel , David A. Pakula
发明人： Richard Hung Minh Dinh , Tang Yew Tan , Nicholaus Ian Lubinski , Jason Sloey , Shayan Malek , Scott Myers , Wyeman Chen , Dennis R. Pyper , Douglas P. Kidd , Joshua G. Wurzel , David A. Pakula
IPC分类号： H05K1/14 , F16B37/00 , F16B39/02 , H05K1/00 , H05K1/11
CPC分类号： H05K9/0024 , B32B17/061 , B41F17/00 , G03B15/03 , G06F1/1626 , G06F1/1656 , H01L23/24 , H01L23/296 , H01L23/3737 , H01L23/552 , H01L23/66 , H01L2223/6644 , H01M2/026 , H01M2/0292 , H01M2220/30 , H03F3/195 , H03F3/213 , H03F2200/451 , H04M1/0277 , H05K1/0203 , H05K1/0215 , H05K1/181 , H05K1/189 , H05K3/341 , H05K3/3447 , H05K3/363 , H05K2201/0116 , H05K2201/0162 , H05K2201/056 , H05K2201/10106 , H05K2201/10121 , H05K2201/10371 , H05K2201/10409 , H05K2201/2009 , H05K2203/1316 , Y02P70/613 , Y10T29/4911
摘要： Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Cosmetic structures such as cowlings may be used to improve device aesthetics. Bumpers may be mounted over rough edges of printed circuit boards to protect flex circuits that are routed over the printed circuit boards. Fasteners may be soldered to solder pad structures on printed circuit boards.
摘要翻译：可以提供包括机械和电子部件的电子设备。连接器可用于连接安装到印刷电路的印刷电路和器件。印刷电路可以包括刚性印刷电路板和柔性印刷电路板。可以使用诸如整流罩的化妆结构来改善设备的美观性。缓冲器可以安装在印刷电路板的粗糙边缘上，以保护布线在印刷电路板上的柔性电路。紧固件可以焊接到印刷电路板上的焊盘结构上。

34. 发明申请

US20110229709A1 CIRCUIT LAMINATES, AND METHOD OF MANUFACTURE THEREOF 有权
标题翻译：电路层压板及其制造方法
公开(公告)号：US20110229709A1
公开(公告)日：2011-09-22
申请号：US13053417
申请日：2011-03-22
申请人： Michael S. Kuszaj
发明人： Michael S. Kuszaj
IPC分类号： H05K1/03 , H05K3/00 , H05K3/07 , H05K3/42 , B32B5/18 , B32B7/12
CPC分类号： H05K1/0313 , H05K2201/0116 , H05K2201/2018 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T428/249953 , Y10T428/249982
摘要： A method of making a supported foam circuit laminate comprises fitting a dielectric foam substrate having a shape defined by edges to a support frame having a thickness, an inner rim and an outer rim, wherein the edges of the dielectric foam substrate are flush with the inner rim of the support frame, and the dielectric foam substrate has a thickness that is greater than the thickness of the support frame; disposing an electrically conductive layer onto a side of the dielectric foam substrate and the support frame, wherein the edges of the electrically conductive layer overlap the inner rim of the support frame; and co-laminating the electrically conductive layer to the dielectric foam substrate and the overlapped support frame under heat and pressure to provide a supported foam circuit laminate.
摘要翻译：制造支撑泡沫电路层压体的方法包括将具有由边缘限定的形状的电介质泡沫基材装配到具有厚度，内缘和外缘的支撑框架，其中电介质泡沫基底的边缘与内部支撑框架的边缘，并且电介质泡沫基板具有大于支撑框架的厚度的厚度; 将导电层设置在电介质泡沫衬底和支撑框架的侧面上，其中导电层的边缘与支撑框架的内边缘重叠; 并且在热和压力下将导电层共同层叠到电介质泡沫衬底和重叠的支撑框架，以提供支撑的泡沫电路层压体。

35. 发明授权

US07910469B2 Electrical circuit, thin film transistor, method for manufacturing electric circuit and method for manufacturing thin film transistor 有权
标题翻译：电路，薄膜晶体管，制造电路的方法及制造薄膜晶体管的方法
公开(公告)号：US07910469B2
公开(公告)日：2011-03-22
申请号：US10528961
申请日：2003-09-24
申请人： Katsura Hirai
发明人： Katsura Hirai
IPC分类号： H01L21/44
CPC分类号： H01L51/0508 , H01L51/002 , H01L51/0021 , H01L51/0035 , H01L51/0036 , H01L51/0038 , H01L51/0512 , H05K3/125 , H05K3/4644 , H05K2201/0116 , H05K2201/0329
摘要： An electrical circuit containing a substrate having thereon a receptive layer, wherein the receptive layer has a conductive polymer impregnated in the receptive layer, and a method for forming the electrical circuit.
摘要翻译：一种包含其上具有接收层的基板的电路，其中所述接收层具有浸渍在所述接受层中的导电聚合物，以及形成所述电路的方法。

36. 发明授权

US07897027B2 Plating apparatus, plating method and multilayer printed circuit board 有权
标题翻译：电镀装置，电镀方法和多层印刷电路板
公开(公告)号：US07897027B2
公开(公告)日：2011-03-01
申请号：US12342866
申请日：2008-12-23
申请人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
发明人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
IPC分类号： C25D5/22 , C25D21/10 , C25D7/12
CPC分类号： C25D5/02 , H05K3/108 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4661 , H05K2201/0116 , H05K2201/09563 , H05K2203/025 , H05K2203/0257 , Y10T29/49124 , Y10T428/24917 , Y10T428/24926 , Y10T428/249955 , Y10T428/249958
摘要： A plating method includes providing an article in a plating bath, covering a surface of the article with an insulating member in the plating bath, and electrolytically plating the article while moving one of the insulating member and the article relative to each other.
摘要翻译：电镀方法包括在镀浴中提供物品，在电镀槽中用绝缘构件覆盖制品的表面，以及在使绝缘构件和制品相对于彼此移动中的同时对制品进行电解电镀。

37. 发明申请

US20110036914A1 ANTENNA CIRCUIT CONSTITUENT BODY FOR IC CARD/TAG AND IC CARD 有权
标题翻译： IC卡/标签和IC卡的天线电路体系
公开(公告)号：US20110036914A1
公开(公告)日：2011-02-17
申请号：US12988210
申请日：2009-04-28
申请人： Akira Shingu , Kiyoji Egashira
发明人： Akira Shingu , Kiyoji Egashira
IPC分类号： G06K19/077 , H01Q7/00
CPC分类号： H01Q7/00 , G06K19/07749 , H01Q1/38 , H05K1/162 , H05K1/165 , H05K3/4685 , H05K2201/0116 , H05K2201/0355 , H05K2201/0382
摘要： Provided are an antenna circuit constituent body for an IC card/tag, which is capable of enhancing a Q value by reducing a permittivity of a resin film of which a base material is made; and an IC card. The antenna circuit constituent body (10) for an IC card/tag comprises: the base material (11) made of the resin film; and circuit pattern layers (131 and 132) each formed on each of both sides of the base material (11) and made of aluminum foil. The circuit pattern layer (131) includes a coiled pattern layer. Parts of the circuit pattern layers (131 and 132), which mutually face each other; and a part of the base material (11), which is interposed between the parts of the circuit pattern layers (131 and 132), constitute a capacitor. The circuit pattern layers (131 and 132) are electrically connected by means of crimping parts (13a and 13b). The base material (11) includes a plurality of void-state-air layers. A relative density of the base material (11) with respect to a density of a resin is less than or equal to 0.9. An average volume of the void-state-air layers is greater than or equal to 2 μm3 and less than or equal to 90 μm3.
摘要翻译：提供一种用于IC卡/标签的天线电路构成体，其能够通过降低制成基材的树脂膜的介电常数来提高Q值; 和IC卡。用于IC卡/标签的天线电路构成体（10）包括：由树脂膜制成的基材（11）; 以及各自形成在基材（11）的两侧的每一侧上且由铝箔制成的电路图案层（131和132）。电路图案层（131）包括线圈图案层。电路图案层（131和132）的相互面对的部分; 并且介于电路图案层（131和132）的部分之间的基底材料（11）的一部分构成电容器。电路图案层（131和132）通过压接部件（13a和13b）电连接。基材（11）包括多个空隙状态空气层。基材（11）相对于树脂的密度的相对密度小于或等于0.9。空隙状态空气层的平均体积大于或等于2μm3且小于或等于90μm3。

38. 发明申请

US20100104839A1 HIGH-DIELECTRIC MATERIAL 有权
标题翻译：高介电材料
公开(公告)号：US20100104839A1
公开(公告)日：2010-04-29
申请号：US12594569
申请日：2008-04-04
申请人： Michael Dunleavy , Sajad Haq , Joseph Maurice Davies , Jason Karl Rew
发明人： Michael Dunleavy , Sajad Haq , Joseph Maurice Davies , Jason Karl Rew
IPC分类号： B32B7/02 , B32B5/00 , B29C39/02 , B29C65/70
CPC分类号： B29C39/10 , H01B3/006 , H01G4/206 , H05K1/024 , H05K1/0373 , H05K1/162 , H05K2201/0116 , H05K2201/0209 , H05K2201/0218 , H05K2201/0254 , Y10T428/24967
摘要： A bulk dielectric material can include a solid composite material having a solid matrix material and a plurality of filler elements distributed within the matrix material. The bulk dielectric material can have, at a frequency of greater than 1 MHz, (i) a permittivity with a real part of magnitude greater than 10 and an imaginary part of magnitude less than 3, and (ii) an electrical breakdown strength greater than 5 kV/mm and can have a minimum dimension greater than 2 mm.
摘要翻译：体电介质材料可以包括具有固体基质材料和分布在基质材料内的多个填料元素的固体复合材料。大体积电介质材料可以具有大于1MHz的频率，（i）具有大于10的实际部分幅度的电容率和小于3的虚数部分，以及（ii）电击穿强度大于 5 kV / mm，最小尺寸可以大于2 mm。

39. 发明申请

US20090315062A1 Light Emitting Diode Submount With High Thermal Conductivity For High Power Operation 有权
标题翻译：具有高导热性的发光二极管底座用于大功率操作
公开(公告)号：US20090315062A1
公开(公告)日：2009-12-24
申请号：US12145395
申请日：2008-06-24
申请人： Wen-Herng Su , Junying Lu , Ho-Shang Lee
发明人： Wen-Herng Su , Junying Lu , Ho-Shang Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/483 , H01L33/005 , H01L33/60 , H01L2224/13 , H01L2224/45144 , H01L2224/48091 , H01L2924/19107 , H05K1/053 , H05K1/162 , H05K1/183 , H05K2201/0116 , H05K2201/0179 , H05K2201/10106 , H05K2203/0315 , Y10S362/80 , Y10T29/4913 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/53113 , H01L2924/00014 , H01L2924/00
摘要： This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.
摘要翻译：本发明涉及发光二极管或LED电路的热管理，光提取和成本效益。描述了集成电路LED基座，用于大功率LED的封装。 LED基座提供高导热性，同时保持电气绝缘。特别地，描述了用于阳极氧化高导热性铝合金板以形成多孔氧化铝层和无孔氧化铝层的工艺。该阳极氧化铝合金板作为优异的电绝缘体，并且还提供用于制造高密度和大功率多电平电路的表面形态和机械性能。

40. 发明申请

US20090314528A1 WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD 有权
标题翻译：接线板和接线板制造方法
公开(公告)号：US20090314528A1
公开(公告)日：2009-12-24
申请号：US12486000
申请日：2009-06-17
申请人： Takayuki Hirose , Norihito Tsukahara , Manabu Gokan
发明人： Takayuki Hirose , Norihito Tsukahara , Manabu Gokan
IPC分类号： H05K1/09 , B05D5/12 , B32B38/14 , B05D3/10
CPC分类号： H05K3/4602 , H05K1/0265 , H05K1/0271 , H05K1/0272 , H05K1/0393 , H05K3/1208 , H05K3/125 , H05K3/205 , H05K3/386 , H05K3/4069 , H05K3/4664 , H05K3/4697 , H05K2201/0116 , H05K2201/0195 , H05K2201/0352 , H05K2201/0391 , H05K2201/068 , H05K2201/09036 , H05K2201/09136 , H05K2201/096 , H05K2201/09727 , H05K2203/013 , H05K2203/0769 , Y10S977/773
摘要： A wiring board is provided that suppresses spreading of liquid droplets when liquid droplets are discharged using an ink-jet method. The wiring board has a plurality of layers and includes an ink-jet wiring pattern that is formed in a soluble porous membrane member of any single layer and that includes electrically conductive nanoparticles as a principal material, and a transferred wiring pattern that does not include electrically conductive nanoparticles as a principal material. One layer among the plurality of layers is an electrically insulative substrate. Another layer among the plurality of layers is a porous membrane treated member layer including a porous membrane member at one part of a region of the other layer. The ink-jet wiring pattern is formed in the porous membrane treated member layer. The transferred wiring pattern is formed in the substrate.
摘要翻译：提供了一种布线板，其在使用喷墨方法排出液滴时抑制液滴的扩散。布线板具有多层，并且包括形成在任何单层的可溶性多孔膜构件中并且包括导电纳米颗粒作为主要材料的喷墨布线图案，以及不包括电性的转移布线图案导电纳米粒子为主要材料。多层中的一层是电绝缘性基板。多个层中的另一层是在另一层的一个区域的一部分处具有多孔膜构件的多孔膜处理构件层。在多孔膜处理构件层中形成喷墨布线图案。转移的布线图案形成在基板中。

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