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1. 发明申请

US20110255850A1 ELECTRONIC SUBASSEMBLIES FOR ELECTRONIC DEVICES 审中-公开
标题翻译：用于电子设备的电子底座
公开(公告)号：US20110255850A1
公开(公告)日：2011-10-20
申请号：US12794601
申请日：2010-06-04
申请人： Richard Hung Minh Dinh , Tang Yew Tan , Jason Sloey , Shayan Malek , Scott Myers , Dennis R. Pyper , Douglas P. Kidd , Ronald W. Dimpflmaier , Andrew B. Just , Trent Weber , Daniel W. Jarvis
发明人： Richard Hung Minh Dinh , Tang Yew Tan , Jason Sloey , Shayan Malek , Scott Myers , Dennis R. Pyper , Douglas P. Kidd , Ronald W. Dimpflmaier , Andrew B. Just , Trent Weber , Daniel W. Jarvis
IPC分类号： G03B15/03 , H01R13/648 , H05K9/00 , H01R13/516
CPC分类号： H05K9/0024 , B32B17/061 , B41F17/00 , G03B15/03 , G06F1/1626 , G06F1/1656 , H01L23/24 , H01L23/296 , H01L23/3737 , H01L23/552 , H01L23/66 , H01L2223/6644 , H01M2/026 , H01M2/0292 , H01M2220/30 , H03F3/195 , H03F3/213 , H03F2200/451 , H04M1/0277 , H05K1/0203 , H05K1/0215 , H05K1/181 , H05K1/189 , H05K3/341 , H05K3/3447 , H05K3/363 , H05K2201/0116 , H05K2201/0162 , H05K2201/056 , H05K2201/10106 , H05K2201/10121 , H05K2201/10371 , H05K2201/10409 , H05K2201/2009 , H05K2203/1316 , Y02P70/613 , Y10T29/4911
摘要： Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Heat sinks and other thermally conductive structures may be used to remove excess component heat. Structures may also be provided in an electronic device to detect moisture. Integrated circuits and other circuitry may be mounted on a printed circuit board under a radio-frequency shielding can.
摘要翻译：可以提供包括机械和电子部件的电子设备。连接器可用于连接安装到印刷电路的印刷电路和器件。印刷电路可以包括刚性印刷电路板和柔性印刷电路板。散热片和其他导热结构可用于去除多余的部件热量。也可以在电子设备中提供结构以检测湿气。集成电路和其他电路可以安装在射频屏蔽罐下的印刷电路板上。

2. 发明申请

US20110255250A1 PRINTED CIRCUIT BOARD COMPONENTS FOR ELECTRONIC DEVICES 审中-公开
标题翻译：电子设备印刷电路板组件
公开(公告)号：US20110255250A1
公开(公告)日：2011-10-20
申请号：US12794599
申请日：2010-06-04
申请人： Richard Hung Minh Dinh , Tang Yew Tan , Nicholaus Ian Lubinski , Jason Sloey , Shayan Malek , Scott Myers , Wyeman Chen , Dennis R. Pyper , Douglas P. Kidd , Joshua G. Wurzel , David A. Pakula
发明人： Richard Hung Minh Dinh , Tang Yew Tan , Nicholaus Ian Lubinski , Jason Sloey , Shayan Malek , Scott Myers , Wyeman Chen , Dennis R. Pyper , Douglas P. Kidd , Joshua G. Wurzel , David A. Pakula
IPC分类号： H05K1/14 , F16B37/00 , F16B39/02 , H05K1/00 , H05K1/11
CPC分类号： H05K9/0024 , B32B17/061 , B41F17/00 , G03B15/03 , G06F1/1626 , G06F1/1656 , H01L23/24 , H01L23/296 , H01L23/3737 , H01L23/552 , H01L23/66 , H01L2223/6644 , H01M2/026 , H01M2/0292 , H01M2220/30 , H03F3/195 , H03F3/213 , H03F2200/451 , H04M1/0277 , H05K1/0203 , H05K1/0215 , H05K1/181 , H05K1/189 , H05K3/341 , H05K3/3447 , H05K3/363 , H05K2201/0116 , H05K2201/0162 , H05K2201/056 , H05K2201/10106 , H05K2201/10121 , H05K2201/10371 , H05K2201/10409 , H05K2201/2009 , H05K2203/1316 , Y02P70/613 , Y10T29/4911
摘要： Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Cosmetic structures such as cowlings may be used to improve device aesthetics. Bumpers may be mounted over rough edges of printed circuit boards to protect flex circuits that are routed over the printed circuit boards. Fasteners may be soldered to solder pad structures on printed circuit boards.
摘要翻译：可以提供包括机械和电子部件的电子设备。连接器可用于连接安装到印刷电路的印刷电路和器件。印刷电路可以包括刚性印刷电路板和柔性印刷电路板。可以使用诸如整流罩的化妆结构来改善设备的美观性。缓冲器可以安装在印刷电路板的粗糙边缘上，以保护布线在印刷电路板上的柔性电路。紧固件可以焊接到印刷电路板上的焊盘结构上。

4. 发明授权

US08830662B2 Electronic devices with moisture resistant openings 有权
标题翻译：具有防潮开口的电子设备
公开(公告)号：US08830662B2
公开(公告)日：2014-09-09
申请号：US13037887
申请日：2011-03-01
申请人： Scott A. Myers , Douglas Weber , Tang Yew Tan , Richard Hung Minh Dinh , David A. Pakula , Jason Sloey
发明人： Scott A. Myers , Douglas Weber , Tang Yew Tan , Richard Hung Minh Dinh , David A. Pakula , Jason Sloey
IPC分类号： G06F1/16 , H05K5/02 , H05K5/00
CPC分类号： H05K5/0086 , H05K5/0213
摘要： Electronic devices may have openings that serve as potential pathways for moisture intrusion into interior portions of the devices. An electronic device may be provided with moisture repelling coatings in the vicinity of these openings to help prevent moisture from reaching the interior of the device. The openings may be associated with gaps between adjacent housing structures, openings for buttons, openings for audio and connector ports or other openings in device structures. The moisture repelling coatings may be applied to housing surfaces, button members, structures associated with audio and connector ports, and other device structures.
摘要翻译：电子设备可以具有用作水分侵入设备内部部分的潜在途径的开口。电子设备可以在这些开口附近设置防潮涂层，以帮助防止水分到达设备内部。这些开口可以与相邻的壳体结构之间的间隙，用于按钮的开口，用于音频和连接器端口的开口或装置结构中的其它开口相关联。防潮涂层可以施加到壳体表面，按钮构件，与音频和连接器端口相关联的结构以及其它装置结构。

5. 发明申请

US20120224299A1 Electronic Devices With Moisture Resistant Openings 有权
标题翻译：具有防潮开口的电子设备
公开(公告)号：US20120224299A1
公开(公告)日：2012-09-06
申请号：US13037887
申请日：2011-03-01
申请人： Scott A. Myers , Douglas Weber , Tang Yew Tan , Richard Hung Minh Dinh , David A. Pakula , Jason Sloey
发明人： Scott A. Myers , Douglas Weber , Tang Yew Tan , Richard Hung Minh Dinh , David A. Pakula , Jason Sloey
IPC分类号： H05K7/00
CPC分类号： H05K5/0086 , H05K5/0213
摘要： Electronic devices may have openings that serve as potential pathways for moisture intrusion into interior portions of the devices. An electronic device may be provided with moisture repelling coatings in the vicinity of these openings to help prevent moisture from reaching the interior of the device. The openings may be associated with gaps between adjacent housing structures, openings for buttons, openings for audio and connector ports or other openings in device structures. The moisture repelling coatings may be applied to housing surfaces, button members, structures associated with audio and connector ports, and other device structures.
摘要翻译：电子设备可以具有用作水分侵入设备内部部分的潜在途径的开口。电子设备可以在这些开口附近设置防潮涂层，以帮助防止水分到达设备内部。这些开口可以与相邻的壳体结构之间的间隙，用于按钮的开口，用于音频和连接器端口的开口或装置结构中的其它开口相关联。防潮涂层可以施加到壳体表面，按钮构件，与音频和连接器端口相关联的结构以及其它装置结构。

6. 发明授权

US08912480B2 Light sensor systems for electronic devices 有权
标题翻译：用于电子设备的光传感器系统
公开(公告)号：US08912480B2
公开(公告)日：2014-12-16
申请号：US13222387
申请日：2011-08-31
申请人： Benjamin J. Pope , Kelvin Kwong , Richard P. Howarth , Richard Hung Minh Dinh , Tang Yew Tan , Richard Ruh , Matt Waldon , Daniel W. Jarvis , Brian R. Land , Steven P. Hotelling
发明人： Benjamin J. Pope , Kelvin Kwong , Richard P. Howarth , Richard Hung Minh Dinh , Tang Yew Tan , Richard Ruh , Matt Waldon , Daniel W. Jarvis , Brian R. Land , Steven P. Hotelling
IPC分类号： G01J1/02 , H04M1/02 , G01J1/42 , G01J1/04
CPC分类号： G01J1/0233 , G01J1/0407 , G01J1/0422 , G01J1/0425 , G01J1/0474 , G01J1/0488 , G01J1/4204 , H04M1/026 , H04M2250/12
摘要： The underside of an inactive portion of a display cover layer in an electronic device may be covered with an opaque masking material. Openings in the opaque masking material may be form ambient light sensor and proximity sensor windows. An ambient light sensor window may be filled with a material that transmits at least some visible light. A proximity sensor window may be filled with a material that transmits more infrared light relative to visible light than the material in the ambient light sensor window. The materials in the ambient light sensor window and proximity sensor window may include one or more layers of ink, patterns of holes, layers of material that are shared with the opaque masking layer, and materials that are black, white, or other colors. A light guide structure may be used to route light received from a sensor window to an associated sensor.
摘要翻译：电子设备中的显示覆盖层的不活动部分的下侧可以用不透明的掩模材料覆盖。不透明掩模材料中的开口可以形成环境光传感器和接近传感器窗口。环境光传感器窗口可以填充有透射至少一些可见光的材料。接近传感器窗口可以填充相对于可见光透射比环境光传感器窗口中的材料更多的红外光的材料。环境光传感器窗口和接近传感器窗口中的材料可以包括与不透明掩模层共享的一层或多层墨水，孔图案，材料层，以及黑色，白色或其它颜色的材料。光导结构可以用于将从传感器窗口接收的光路由到相关传感器。

8. 发明授权

US08551283B2 Offset control for assembling an electronic device housing 有权
标题翻译：用于组装电子设备外壳的偏移控制
公开(公告)号：US08551283B2
公开(公告)日：2013-10-08
申请号：US12794563
申请日：2010-06-04
申请人： David Pakula , Richard Hung Minh Dinh , Scott Myers , Tang Yew Tan
发明人： David Pakula , Richard Hung Minh Dinh , Scott Myers , Tang Yew Tan
IPC分类号： B29C65/00 , C09J5/00
CPC分类号： H05K7/14 , B29L2031/3481 , G02B7/02 , G02B13/001 , G06F1/1626 , G06F1/1637 , G06F1/1656 , G06F1/1658 , H04M1/0202 , H04M1/0266 , H04N5/2252 , H04N5/2254 , H05K5/0086 , H05K5/03 , Y10T29/49002 , Y10T156/10
摘要： Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.
摘要翻译：公开了用于电子设备的外壳。根据一个方面，电子设备外壳的邻接表面可以安装或布置成使得邻接的表面以高精度齐平。电子设备可以是便携式的，并且在某些情况下是手持的。

9. 发明授权

US08610822B2 Camera alignment and mounting structures 有权
标题翻译：相机对准和安装结构
公开(公告)号：US08610822B2
公开(公告)日：2013-12-17
申请号：US12794664
申请日：2010-06-04
申请人： Trent Weber , Scott Myers , David A. Pakula , Matthew Hill , Erik L. Wang , Richard Hung Minh Dinh
发明人： Trent Weber , Scott Myers , David A. Pakula , Matthew Hill , Erik L. Wang , Richard Hung Minh Dinh
IPC分类号： H04N5/225
CPC分类号： G03B17/02 , B23K26/351 , H04N5/2251
摘要： An electronic device may be provided with a housing. A camera module may be mounted within the housing. The housing may have a camera window with which a lens in the camera module is aligned. To rotationally and laterally align the camera module with respect to the camera window and the electronic device housing, an alignment structure may be mounted to the housing in alignment with the camera window and housing. The alignment structure may be formed form a ring-shaped structure with an opening. The alignment structures may have sidewalls that form an alignment groove for the camera module. The camera window may be formed from a circular opening in a layer of opaque material deposited on a transparent housing member such as a planar layer of glass. During the process, a laser tool may be used to trim the opening in the opaque material.
摘要翻译：电子设备可以设置有壳体。相机模块可以安装在壳体内。外壳可以具有相机窗口，照相机模块中的透镜与其对准。为了相对于照相机窗口和电子设备外壳旋转和横向对准照相机模块，对准结构可以安装到壳体上，与摄像机窗口和外壳对准。对准结构可以形成为具有开口的环形结构。对准结构可以具有形成相机模块的对准凹槽的侧壁。相机窗口可以由沉积在诸如平面玻璃层的透明外壳构件上的不透明材料层中的圆形开口形成。在该过程中，可以使用激光工具来修整不透明材料中的开口。

10. 发明申请

US20110255000A1 CAMERA ALIGNMENT AND MOUNTING STRUCTURES 有权
标题翻译：相机对准和安装结构
公开(公告)号：US20110255000A1
公开(公告)日：2011-10-20
申请号：US12794664
申请日：2010-06-04
申请人： Trent Weber , Scott Myers , David A. Pakula , Matthew Hill , Erik L. Wang , Richard Hung Minh Dinh
发明人： Trent Weber , Scott Myers , David A. Pakula , Matthew Hill , Erik L. Wang , Richard Hung Minh Dinh
IPC分类号： H04N5/225 , B23K26/38 , G03B17/02
CPC分类号： G03B17/02 , B23K26/351 , H04N5/2251
摘要： An electronic device may be provided with a housing. A camera module may be mounted within the housing. The housing may have a camera window with which a lens in the camera module is aligned. To rotationally and laterally align the camera module with respect to the camera window and the electronic device housing, an alignment structure may be mounted to the housing in alignment with the camera window and housing. The alignment structure may be formed form a ring-shaped structure with an opening. The alignment structures may have sidewalls that form an alignment groove for the camera module. The camera window may be formed from a circular opening in a layer of opaque material deposited on a transparent housing member such as a planar layer of glass. During the process, a laser tool may be used to trim the opening in the opaque material.
摘要翻译：电子设备可以设置有壳体。相机模块可以安装在壳体内。外壳可以具有相机窗口，照相机模块中的透镜与其对准。为了相对于照相机窗口和电子设备外壳旋转和横向对准照相机模块，对准结构可以安装到壳体上，与摄像机窗口和外壳对准。对准结构可以形成为具有开口的环形结构。对准结构可以具有形成相机模块的对准凹槽的侧壁。相机窗口可以由沉积在诸如平面玻璃层的透明外壳构件上的不透明材料层中的圆形开口形成。在该过程中，可以使用激光工具来修整不透明材料中的开口。

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