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1. 发明申请

US20110255250A1 PRINTED CIRCUIT BOARD COMPONENTS FOR ELECTRONIC DEVICES 审中-公开
标题翻译：电子设备印刷电路板组件
公开(公告)号：US20110255250A1
公开(公告)日：2011-10-20
申请号：US12794599
申请日：2010-06-04
申请人： Richard Hung Minh Dinh , Tang Yew Tan , Nicholaus Ian Lubinski , Jason Sloey , Shayan Malek , Scott Myers , Wyeman Chen , Dennis R. Pyper , Douglas P. Kidd , Joshua G. Wurzel , David A. Pakula
发明人： Richard Hung Minh Dinh , Tang Yew Tan , Nicholaus Ian Lubinski , Jason Sloey , Shayan Malek , Scott Myers , Wyeman Chen , Dennis R. Pyper , Douglas P. Kidd , Joshua G. Wurzel , David A. Pakula
IPC分类号： H05K1/14 , F16B37/00 , F16B39/02 , H05K1/00 , H05K1/11
CPC分类号： H05K9/0024 , B32B17/061 , B41F17/00 , G03B15/03 , G06F1/1626 , G06F1/1656 , H01L23/24 , H01L23/296 , H01L23/3737 , H01L23/552 , H01L23/66 , H01L2223/6644 , H01M2/026 , H01M2/0292 , H01M2220/30 , H03F3/195 , H03F3/213 , H03F2200/451 , H04M1/0277 , H05K1/0203 , H05K1/0215 , H05K1/181 , H05K1/189 , H05K3/341 , H05K3/3447 , H05K3/363 , H05K2201/0116 , H05K2201/0162 , H05K2201/056 , H05K2201/10106 , H05K2201/10121 , H05K2201/10371 , H05K2201/10409 , H05K2201/2009 , H05K2203/1316 , Y02P70/613 , Y10T29/4911
摘要： Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Cosmetic structures such as cowlings may be used to improve device aesthetics. Bumpers may be mounted over rough edges of printed circuit boards to protect flex circuits that are routed over the printed circuit boards. Fasteners may be soldered to solder pad structures on printed circuit boards.
摘要翻译：可以提供包括机械和电子部件的电子设备。连接器可用于连接安装到印刷电路的印刷电路和器件。印刷电路可以包括刚性印刷电路板和柔性印刷电路板。可以使用诸如整流罩的化妆结构来改善设备的美观性。缓冲器可以安装在印刷电路板的粗糙边缘上，以保护布线在印刷电路板上的柔性电路。紧固件可以焊接到印刷电路板上的焊盘结构上。

2. 发明申请

US20110255850A1 ELECTRONIC SUBASSEMBLIES FOR ELECTRONIC DEVICES 审中-公开
标题翻译：用于电子设备的电子底座
公开(公告)号：US20110255850A1
公开(公告)日：2011-10-20
申请号：US12794601
申请日：2010-06-04
申请人： Richard Hung Minh Dinh , Tang Yew Tan , Jason Sloey , Shayan Malek , Scott Myers , Dennis R. Pyper , Douglas P. Kidd , Ronald W. Dimpflmaier , Andrew B. Just , Trent Weber , Daniel W. Jarvis
发明人： Richard Hung Minh Dinh , Tang Yew Tan , Jason Sloey , Shayan Malek , Scott Myers , Dennis R. Pyper , Douglas P. Kidd , Ronald W. Dimpflmaier , Andrew B. Just , Trent Weber , Daniel W. Jarvis
IPC分类号： G03B15/03 , H01R13/648 , H05K9/00 , H01R13/516
CPC分类号： H05K9/0024 , B32B17/061 , B41F17/00 , G03B15/03 , G06F1/1626 , G06F1/1656 , H01L23/24 , H01L23/296 , H01L23/3737 , H01L23/552 , H01L23/66 , H01L2223/6644 , H01M2/026 , H01M2/0292 , H01M2220/30 , H03F3/195 , H03F3/213 , H03F2200/451 , H04M1/0277 , H05K1/0203 , H05K1/0215 , H05K1/181 , H05K1/189 , H05K3/341 , H05K3/3447 , H05K3/363 , H05K2201/0116 , H05K2201/0162 , H05K2201/056 , H05K2201/10106 , H05K2201/10121 , H05K2201/10371 , H05K2201/10409 , H05K2201/2009 , H05K2203/1316 , Y02P70/613 , Y10T29/4911
摘要： Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Heat sinks and other thermally conductive structures may be used to remove excess component heat. Structures may also be provided in an electronic device to detect moisture. Integrated circuits and other circuitry may be mounted on a printed circuit board under a radio-frequency shielding can.
摘要翻译：可以提供包括机械和电子部件的电子设备。连接器可用于连接安装到印刷电路的印刷电路和器件。印刷电路可以包括刚性印刷电路板和柔性印刷电路板。散热片和其他导热结构可用于去除多余的部件热量。也可以在电子设备中提供结构以检测湿气。集成电路和其他电路可以安装在射频屏蔽罐下的印刷电路板上。

3. 发明授权

US08830662B2 Electronic devices with moisture resistant openings 有权
标题翻译：具有防潮开口的电子设备
公开(公告)号：US08830662B2
公开(公告)日：2014-09-09
申请号：US13037887
申请日：2011-03-01
申请人： Scott A. Myers , Douglas Weber , Tang Yew Tan , Richard Hung Minh Dinh , David A. Pakula , Jason Sloey
发明人： Scott A. Myers , Douglas Weber , Tang Yew Tan , Richard Hung Minh Dinh , David A. Pakula , Jason Sloey
IPC分类号： G06F1/16 , H05K5/02 , H05K5/00
CPC分类号： H05K5/0086 , H05K5/0213
摘要： Electronic devices may have openings that serve as potential pathways for moisture intrusion into interior portions of the devices. An electronic device may be provided with moisture repelling coatings in the vicinity of these openings to help prevent moisture from reaching the interior of the device. The openings may be associated with gaps between adjacent housing structures, openings for buttons, openings for audio and connector ports or other openings in device structures. The moisture repelling coatings may be applied to housing surfaces, button members, structures associated with audio and connector ports, and other device structures.
摘要翻译：电子设备可以具有用作水分侵入设备内部部分的潜在途径的开口。电子设备可以在这些开口附近设置防潮涂层，以帮助防止水分到达设备内部。这些开口可以与相邻的壳体结构之间的间隙，用于按钮的开口，用于音频和连接器端口的开口或装置结构中的其它开口相关联。防潮涂层可以施加到壳体表面，按钮构件，与音频和连接器端口相关联的结构以及其它装置结构。

4. 发明申请

US20120224299A1 Electronic Devices With Moisture Resistant Openings 有权
标题翻译：具有防潮开口的电子设备
公开(公告)号：US20120224299A1
公开(公告)日：2012-09-06
申请号：US13037887
申请日：2011-03-01
申请人： Scott A. Myers , Douglas Weber , Tang Yew Tan , Richard Hung Minh Dinh , David A. Pakula , Jason Sloey
发明人： Scott A. Myers , Douglas Weber , Tang Yew Tan , Richard Hung Minh Dinh , David A. Pakula , Jason Sloey
IPC分类号： H05K7/00
CPC分类号： H05K5/0086 , H05K5/0213
摘要： Electronic devices may have openings that serve as potential pathways for moisture intrusion into interior portions of the devices. An electronic device may be provided with moisture repelling coatings in the vicinity of these openings to help prevent moisture from reaching the interior of the device. The openings may be associated with gaps between adjacent housing structures, openings for buttons, openings for audio and connector ports or other openings in device structures. The moisture repelling coatings may be applied to housing surfaces, button members, structures associated with audio and connector ports, and other device structures.
摘要翻译：电子设备可以具有用作水分侵入设备内部部分的潜在途径的开口。电子设备可以在这些开口附近设置防潮涂层，以帮助防止水分到达设备内部。这些开口可以与相邻的壳体结构之间的间隙，用于按钮的开口，用于音频和连接器端口的开口或装置结构中的其它开口相关联。防潮涂层可以施加到壳体表面，按钮构件，与音频和连接器端口相关联的结构以及其它装置结构。

7. 发明授权

US08620271B2 Compact form factor integrated circuit card and methods 有权
标题翻译：紧凑型外形尺寸集成电路卡及方法
公开(公告)号：US08620271B2
公开(公告)日：2013-12-31
申请号：US13440911
申请日：2012-04-05
申请人： Tang Yew Tan , Jason Sloey , Jared Kole , Naushad Zaveri
发明人： Tang Yew Tan , Jason Sloey , Jared Kole , Naushad Zaveri
IPC分类号： H04M1/66
CPC分类号： G06K19/07739 , G06K19/07741 , G06K19/07743 , G06K19/07747 , H04L63/0853 , H04W12/06 , H04W88/04
摘要： A compact form factor integrated circuit card. In one embodiment, a Subscriber Identity Module (SIM) card is disclosed. In one embodiment, the SIM card has overall dimensions optimized for a particular application; e.g., 12.30 mm (±0.10 mm)×8.80 mm (±0.10 mm)×0.67 mm (+0.03/−0.07). In another embodiment, the SIM card has overall dimensions of 11.90 mm (±0.10 mm)×8.80 mm (±0.10 mm)×0.70 mm (maximum). Multiple complementary SIM card adapters and methods of use are also disclosed.
摘要翻译：紧凑型外形尺寸集成电路卡。在一个实施例中，公开了用户识别模块（SIM）卡。在一个实施例中，SIM卡具有针对特定应用而优化的整体尺寸; 例如12.30mm（±0.10mm）×8.80mm（±0.10mm）×0.67mm（+ 0.03 / -0.07）。在另一实施例中，SIM卡具有11.90mm（±0.10mm）×8.80mm（±0.10mm）×0.70mm（最大）的总体尺寸。还公开了多种互补的SIM卡适配器和使用方法。

8. 发明申请

US20120289196A1 COMPACT FORM FACTOR INTEGRATED CIRCUIT CARD AND METHODS 有权
标题翻译：紧凑形式因子集成电路卡和方法
公开(公告)号：US20120289196A1
公开(公告)日：2012-11-15
申请号：US13440911
申请日：2012-04-05
申请人： TANG YEW TAN , Jason Sloey , Jared Kole , Naushad Zaveri
发明人： TANG YEW TAN , Jason Sloey , Jared Kole , Naushad Zaveri
IPC分类号： G06K19/077 , H04W12/06 , H04W88/02 , G06K7/01
CPC分类号： G06K19/07739 , G06K19/07741 , G06K19/07743 , G06K19/07747 , H04L63/0853 , H04W12/06 , H04W88/04
摘要： A compact form factor integrated circuit card. In one embodiment, a Subscriber Identity Module (SIM) card is disclosed. In one embodiment, the SIM card has overall dimensions optimized for a particular application; e.g., 12.30 mm (±0.10 mm)×8.80 mm (±0.10 mm)×0.67 mm (+0.03/−0.07). In another embodiment, the SIM card has overall dimensions of 11.90 mm (±0.10 mm)×8.80mm (±0.10mm)×0.70 mm (maximum). Multiple complementary SIM card adapters and methods of use are also disclosed.
摘要翻译：紧凑型外形尺寸集成电路卡。在一个实施例中，公开了用户识别模块（SIM）卡。在一个实施例中，SIM卡具有针对特定应用而优化的整体尺寸; 例如12.30mm（±0.10mm）×8.80mm（±0.10mm）×0.67mm（+ 0.03 / -0.07）。在另一个实施例中，SIM卡具有11.90mm（±0.10mm）×8.80mm（±0.10mm）×0.70mm（最大）的总体尺寸。还公开了多种互补的SIM卡适配器和使用方法。

9. 发明授权

US07871720B2 Battery assembly for use in an electronic device 有权
标题翻译：用于电子设备的电池组件
公开(公告)号：US07871720B2
公开(公告)日：2011-01-18
申请号：US12112764
申请日：2008-04-30
申请人： Scott Myers , Erik Wang , Trent Weber , Jason Sloey
发明人： Scott Myers , Erik Wang , Trent Weber , Jason Sloey
IPC分类号： H01M2/00 , H01M2/10 , H01M2/20 , H01M6/46
CPC分类号： H01M2/1066 , B23P19/04 , H01M2/02 , H01M2220/30
摘要： A battery assembly for use in an electronic device is provided. The battery assembly may include a battery cell (e.g., a rechargeable battery cell), a battery connector for providing power from the battery cell to the electronic device, and a flex circuit electrically coupling the battery cell to the electronic device. The battery connector may be located adjacent the battery cell, and may include one or more alignment mechanisms for ensuring that conductive pads of the battery connector align properly with corresponding conductive elements of the electronic device. The battery cell may be fixed to the electronic device using an adhesive layer (e.g., double sided tape) placed between the cell and the electronic device. A tab may extend beyond the periphery of the battery cell to allow a user to pull or peal the battery cell from the electronic device for replacement or repair. In some embodiments, a tool may be used to grasp the tab.
摘要翻译：提供了一种用于电子设备的电池组件。电池组件可以包括电池单元（例如，可再充电电池单元），用于从电池单元向电子设备提供电力的电池连接器以及将电池单元电耦合到电子设备的柔性电路。电池连接器可以位于电池单元附近，并且可以包括一个或多个对准机构，用于确保电池连接器的导电焊盘与电子设备的相应导电元件正确对准。可以使用放置在电池单元和电子设备之间的粘合剂层（例如，双面胶带）将电池单元固定到电子设备。突片可以延伸超过电池单元的周边，以允许用户从电子设备拉动或剥离电池单元以进行更换或修理。在一些实施例中，可以使用工具来抓住翼片。

10. 发明申请

US20090267677A1 COMPACT EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES 有权
标题翻译：电子设备中的紧凑可组件组件组件
公开(公告)号：US20090267677A1
公开(公告)日：2009-10-29
申请号：US12236676
申请日：2008-09-24
申请人： Scott Myers , Erik Wang , Jason Sloey
发明人： Scott Myers , Erik Wang , Jason Sloey
IPC分类号： H05K7/16 , G06F7/44
CPC分类号： H04B1/3818 , G06K13/08 , G06K13/0831 , H04B1/3816 , H04M1/0235 , H04M1/026 , H04M1/0274 , H04M1/0283 , H04M2250/14 , H05K5/0295
摘要： Electronic devices are provided with ejectable component assemblies. The ejectable component assembly may include a tray that can be loaded with one or more removable modules, wafers coupled to circuit boards, cages and retaining plates to assist in retaining the tray within the assembly. The ejectable component assembly may include springs operative to engage detents in the tray to retain the tray in the assembly. The ejectable component assembly may include a tray ejector mechanism for ejecting the tray from the assembly.
摘要翻译：电子设备设置有可喷射部件组件。可喷射部件组件可以包括可以装载一个或多个可移除模块的托盘，联接到电路板，保持架和保持板的晶片，以帮助将托盘保持在组件内。可弹出部件组件可以包括弹簧，其可操作地接合托盘中的棘爪以将托盘保持在组件中。可喷射部件组件可以包括用于从组件弹出托盘的托盘顶出机构。

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