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    • 32. 发明授权
    • Integrated RF front end
    • 集成RF前端
    • US07088971B2
    • 2006-08-08
    • US11158597
    • 2005-06-22
    • Mark L. BurgenerJames S. Cable
    • Mark L. BurgenerJames S. Cable
    • H04B1/04
    • H03F3/189H01Q23/00H03F1/223H03F1/565H03F3/2171H03F3/68H03F2200/294H03F2200/372H03F2200/61H03G3/3042H03G11/00H04B1/0475H04B1/48
    • A monolithic integrated circuit (IC), and method of manufacturing same, that includes all RF front end or transceiver elements for a portable communication device, including a power amplifier (PA), a matching, coupling and filtering network, and an antenna switch to couple the conditioned PA signal to an antenna. An output signal sensor senses at least a voltage amplitude of the signal switched by the antenna switch, and signals a PA control circuit to limit PA output power in response to excessive values of sensed output. Preferred fabrication techniques include stacking multiple FETs to form switching devices. An iClass PA architecture is described that dissipatively terminates unwanted harmonics of the PA output signal. A preferred embodiment of the RF transceiver IC includes two distinct PA circuits, two distinct receive signal amplifier circuits, and a four-way antenna switch to selectably couple a single antenna connection to any one of the four circuits.
    • 一种单片集成电路(IC)及其制造方法,其包括用于便携式通信设备的所有RF前端或收发器元件,包括功率放大器(PA),匹配,耦合和滤波网络以及天线开关 将调节的PA信号耦合到天线。 输出信号传感器至少感测由天线开关切换的信号的电压幅度,并且响应于感测输出的过大值,向PA控制电路发信号以限制PA输出功率。 优选的制造技术包括堆叠多个FET以形成开关器件。 描述了一种消耗性地终止PA输出信号的不需要的谐波的iClass PA架构。 RF收发器IC的优选实施例包括两个不同的PA电路,两个不同的接收信号放大器电路和四路天线开关,以将单个天线连接可选择地耦合到四个电路中的任一个。