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    • 36. 发明授权
    • Semiconductor device fabrication using a photomask with assist features
    • 使用具有辅助功能的光掩模的半导体器件制造
    • US06421820B1
    • 2002-07-16
    • US09460034
    • 1999-12-13
    • Scott M. MansfieldLars W. LiebmannShahid ButtHenning Haffner
    • Scott M. MansfieldLars W. LiebmannShahid ButtHenning Haffner
    • G06F1750
    • G03F1/36G03F7/70441
    • A semiconductor device can be fabricated using a photomask that has been modified using an assist feature design method (see e.g., FIG. 4A) based on normalized feature spacing. Before the device can be fabricated, a layout of original shapes is designed (402). For at least some of the original shapes, the width of the shape and a distance to at least one neighboring shape are measured (404). A modified shape can then be generated by moving edges of the original shape based on the width and distance measurements (406). This modification can be performed on some or all of the original shapes (408). For each of the modified shapes, a normalized space and correct number of assist features can be computed (410). The layout is then modified by adding the correct number of assist features in a space between the modified shape and the neighboring shape (412). This modified layout can then be used in producing a photomask, which can in turn be used to produce a semiconductor device.
    • 可以使用已经基于归一化特征间隔使用辅助特征设计方法(参见例如图4A)修改的光掩模来制造半导体器件。 在可以制造设备之前,设计原始形状的布局(402)。 对于至少一些原始形状,测量形状的宽度和至少一个相邻形状的距离(404)。 然后可以通过基于宽度和距离测量来移动原始形状的边缘来生成修改的形状(406)。 可以对部分或全部原始形状执行该修改(408)。 对于每个修改的形状,可以计算归一化空间和正确数量的辅助特征(410)。 然后通过在修改的形状和相邻形状之间的空间中添加正确数量的辅助特征来修改布局(412)。 然后,该修改后的布局可用于制造光掩模,光掩模又可用于制造半导体器件。
    • 37. 发明授权
    • Optimized decoupling capacitor using lithographic dummy filler
    • 使用光刻虚拟填料的优化去耦电容器
    • US06353248B1
    • 2002-03-05
    • US09562220
    • 2000-04-28
    • Armin M ReithLouis HsuHenning HaffnerGunther Lehmann
    • Armin M ReithLouis HsuHenning HaffnerGunther Lehmann
    • H01L2976
    • H01L28/40H01L27/10861H01L27/10894H01L27/10897
    • A method to optimize the size and filling of decoupling capacitors for very large scale integrated circuits (VLSI) using existing lithographic fillers. The method combines the automatic or manual generation of lithographic fill patterns with the forming of the capacitors. According to the method, when the chip layout is about to be finished, all remaining empty space on the chip gets identified by a layout tool. Then, the closest power-supply nets get extracted. All power supplies and their combinations are sorted in a connection table which determines the appropriate types of capacitances once the power-supply nets closest to the empty spaces extracted from the layout. The empty spaces are then assigned appropriate decoupling capacitances. Decoupling capacitors generated by the method are suitable for VLSI power supplies for noise reduction.
    • 使用现有的平版印刷填料,优化大型集成电路(VLSI)的去耦电容的尺寸和填充的方法。 该方法将自动或手动生成光刻填充图案与电容器的形成相结合。 根据该方法,当芯片布局即将完成时,芯片上的所有剩余空间都由布局工具识别。 然后,最近的电源网络被提取。 所有电源及其组合在连接表中排序,一旦电源网最接近从布局提取的空白空间中,则确定适当类型的电容。 然后空的空间被分配适当的去耦电容。 通过该方法产生的去耦电容适用于降低噪声的VLSI电源。
    • 38. 发明授权
    • Optimized decoupling capacitor using lithographic dummy filler
    • 使用光刻虚拟填料的优化去耦电容器
    • US06232154B1
    • 2001-05-15
    • US09442890
    • 1999-11-18
    • Armin M. ReithLouis HsuHenning HaffnerGunther Lehmann
    • Armin M. ReithLouis HsuHenning HaffnerGunther Lehmann
    • H01L2182
    • H01L28/40H01L27/10861H01L27/10894H01L27/10897
    • A method to optimize the size and filling of decoupling capacitors for very large scale integrated circuits (VLSI) using existing lithographic fillers. The method combines the automatic or manual generation of lithographic fill patterns with the forming of the capacitors. According to the method, when the chip layout is about to be finished, all remaining empty space on the chip gets identified by a layout tool. Then, the closest power-supply nets get extracted. All power supplies and their combinations are sorted in a connection table which determines the appropriate types of capacitances once the power-supply nets closest to the empty spaces extracted from the layout. The empty spaces are then assigned appropriate decoupling capacitances. Decoupling capacitors generated by the method are suitable for VLSI power supplies for noise reduction.
    • 使用现有的平版印刷填料,优化大型集成电路(VLSI)的去耦电容的尺寸和填充的方法。 该方法将自动或手动生成光刻填充图案与电容器的形成相结合。 根据该方法,当芯片布局即将完成时,芯片上剩余的空余空间由布局工具识别。 然后,最近的电源网络被提取。 所有电源及其组合在连接表中排序,一旦电源网最接近从布局提取的空白空间中,则确定适当类型的电容。 然后空的空间被分配适当的去耦电容。 通过该方法产生的去耦电容适用于降低噪声的VLSI电源。
    • 40. 发明授权
    • Methodology of placing printing assist feature for random mask layout
    • 放置随机蒙版布局的打印辅助功能的方法
    • US08099684B2
    • 2012-01-17
    • US12350251
    • 2009-01-08
    • Jason E MeiringHenning Haffner
    • Jason E MeiringHenning Haffner
    • G06F17/50
    • G03F1/36
    • Embodiments of the present invention provide a method of placing printing assist features in a mask layout. The method includes providing a design layout having one or more designed features; generating a set of parameters, the set of parameters being associated with one or more printing assist features (PrAFs); adding the one or more PrAFs of the set of parameters to the design layout to produce a modified design layout; performing simulation of the one or more PrAFs and the one or more designed features on the modified design layout; verifying whether the one or more PrAFs are removable based on results of the simulation; and creating a set of PrAF placement rules based on the set of parameters, if the one or more PrAFs are verified as removable. The set of PrAF placement rules may be used in creating a final set of PrAF features to be used for creating the mask layout.
    • 本发明的实施例提供了一种将打印辅助特征放置在掩模布局中的方法。 该方法包括提供具有一个或多个设计特征的设计布局; 产生一组参数,该组参数与一个或多个打印辅助特征(PrAF)相关联; 将该组参数中的一个或多个PrAF添加到设计布局以产生修改的设计布局; 在修改的设计布局上执行一个或多个PrAF的模拟和一个或多个设计的特征; 基于模拟结果验证一个或多个PrAF是否可移除; 以及如果一个或多个PrAF被验证为可移除的,则基于该参数集创建一组PrAF放置规则。 PrAF放置规则的集合可以用于创建用于创建掩模布局的最后一组PrAF特征。