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31. 发明申请

US20110110629A1 PLANAR OPTICAL WAVEGUIDE 有权
标题翻译：平面光波导
公开(公告)号：US20110110629A1
公开(公告)日：2011-05-12
申请号：US13002860
申请日：2009-07-29
申请人： Mitsuru Nagano , Akira Himeno , Masayuki Okuno , Masahiko Naito , Akihito Doi , Daisuke Ogawa , Akira Nagai
发明人： Mitsuru Nagano , Akira Himeno , Masayuki Okuno , Masahiko Naito , Akihito Doi , Daisuke Ogawa , Akira Nagai
IPC分类号： G02B6/26 , G02B6/122
CPC分类号： G02B6/12007 , G02B2006/12104
摘要： A planar optical waveguide including a clad layer, an optical waveguide having a core embedded in the clad layer; and a groove formed in the clad layer and having a reflection interface for totally reflecting a leaked light leaked from the optical waveguide to the clad layer. Since the reflection interface for totally reflecting the leaked light is formed in the clad layer, the leaked light is prevented from entering into the tap coupler, and the variation of the branching ratio can be reduced.
摘要翻译：一种平面光波导，包括包覆层，具有嵌入包层的芯的光波导; 以及形成在包覆层中并具有用于将从光波导泄漏的泄漏光全反射到包覆层的反射界面的凹槽。由于在包层中形成用于全反射泄漏光的反射界面，所以防止泄漏的光进入分接耦合器，并且可以减小分支比的变化。

32. 发明授权

US07879445B2 Adhesive for bonding circuit members, circuit board and process for its production 有权
标题翻译：用于接合电路元件，电路板及其生产工艺的粘合剂
公开(公告)号：US07879445B2
公开(公告)日：2011-02-01
申请号：US11702552
申请日：2007-02-06
申请人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
发明人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
IPC分类号： B32B27/38
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.
摘要翻译：一种用于将半导体芯片接合并固定到电路板并电连接两个电极的粘合剂，并且包含粘合剂树脂组合物和无机填料，其含量为10至200重量份，100重量份的100重量份粘合剂树脂组合物。

33. 发明授权

US07847466B2 Laminated core and method for manufacturing the same 有权
标题翻译：层压芯及其制造方法
公开(公告)号：US07847466B2
公开(公告)日：2010-12-07
申请号：US12095570
申请日：2007-09-04
申请人： Akira Nagai , Iwao Myojin
发明人： Akira Nagai , Iwao Myojin
IPC分类号： H02K1/06
CPC分类号： H02K1/148 , Y10T29/49009
摘要： A laminated core (10) and a method for manufacturing the same, the laminated core (10) formed with a plurality of continuous segment core sheets (13) wound and laminated in a spiral form while connecting portions (12) mutually connecting the adjacent segment core sheets (13) are bent and side edges of the adjacent segment core sheets (13) are fitted with each other, the connecting portions (12) being located in an outer peripheral portion (11) of the laminated core (10), the laminated core (10) comprising:a concave cutout (19) provided at a radially outward side of the connecting portion (12), the concave cutout (19) allowing a radial bulge (18) to be accommodated within an outer circle of the laminated core (19), the radial bulge (18) formed at a radially outward side of the connecting portion (12) by bending the connecting portion (12); andan inward cutout (20) provided at a radially inward side of the connecting portion (12), the inward cutout (20) defining a bending position of the connecting portion (12), wherein the connecting portion (12) has a narrow radial width and, before being bent, has a radial width in the range of 0.5 to 5 times a thickness of the segment core sheet (13).The laminated core (10) and the method for manufacturing the same are capable of producing a highly-efficient and high-quality product that is free from effects of the swell in the thickness direction of the connecting portion (12).
摘要翻译：叠层铁心（10）及其制造方法是将形成有螺旋形卷绕并层叠的多个连续分段铁芯片（13）的叠层铁心（10）连接在一起的相邻部分芯片（13）弯曲并且相邻的分段芯片（13）的侧边缘彼此配合，连接部分（12）位于层叠铁心（10）的外周部分（11）中，层叠铁芯（10）包括：设置在所述连接部分（12）的径向向外侧的凹形切口（19），所述凹形切口（19）允许径向凸起（18）容纳在所述层压（19），通过弯曲连接部分（12）形成在连接部分（12）的径向外侧的径向凸起（18）; 以及设置在所述连接部分（12）的径向内侧的向内切口（20），所述向内切口（20）限定所述连接部分（12）的弯曲位置，其中所述连接部分（12）具有窄径向宽度，并且在弯曲之前具有在分段芯片（13）的厚度的0.5至5倍的范围内的径向宽度。层叠铁心（10）及其制造方法能够制造无连接部（12）的厚度方向膨胀的效果的高效高品质的产品。

34. 发明申请

US20100270888A1 LAMINATED CORE AND METHOD FOR MANUFACTURING THE SAME 有权
公开(公告)号：US20100270888A1
公开(公告)日：2010-10-28
申请号：US12830820
申请日：2010-07-06
申请人： Akira Nagai , Iwao Myojin , Akinori Hoshino , Masafumi Sakuma , Hiroyuki Yamamoto , Haruji Suzuki
发明人： Akira Nagai , Iwao Myojin , Akinori Hoshino , Masafumi Sakuma , Hiroyuki Yamamoto , Haruji Suzuki
IPC分类号： H02K1/16 , H02K15/02
CPC分类号： H02K15/022 , H02K15/026 , Y10T29/49009
摘要： A laminated core (10) and a method for manufacturing the same formed with multiple continuous segment core pieces (13) wound in a spiral form by bending connecting portions (12) mutually connecting the segment core pieces (13), the connecting portions (12) being formed in an outer peripheral area (11), while the connecting portions (12) of vertically adjacent layers being displaced in a circumferential direction with inner edges or outer edges of the segment core pieces (13) fitted, the laminated core comprising: a concave cutout (21) provided in a radial exterior of each connecting portion (12) to dispose a radially expanded portion (20) within an outer circle of the laminated core (10), the radially expanded portion (20) being formed with each connecting portion (12) expanding radially outward at the time of bending each connecting portion (12); an interior cutout (22) provided in a radial interior of each connecting portion (12) to define a bending position of each connecting portion (12); and a receptacle (16) provided in a radial exterior of each segment core piece (13) to receive an expanded part (15) of the thickness direction formed in the thickness direction at the time of bending each connecting portion (12).

35. 发明授权

US07692296B2 Semiconductor device and multilayer substrate therefor 失效
标题翻译：半导体装置及其多层基板
公开(公告)号：US07692296B2
公开(公告)日：2010-04-06
申请号：US11085520
申请日：2005-03-22
申请人： Naotaka Tanaka , Kenya Kawano , Akira Nagai , Koji Tasaki , Masaaki Yasuda
发明人： Naotaka Tanaka , Kenya Kawano , Akira Nagai , Koji Tasaki , Masaaki Yasuda
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/83 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/90 , H01L25/0657 , H01L25/50 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/274 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/83191 , H01L2224/83192 , H01L2224/838 , H01L2224/85203 , H01L2224/85205 , H01L2225/06513 , H01L2225/06517 , H01L2225/06558 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/45099
摘要： A semiconductor device is provided with connection reliability between a bump electrode and a substrate electrode. An elastic modulus of an adhesive material used to electrically connect a metal bump and an interconnect pattern, and sealing the circuit surface of an LSI chip, after thermosetting is Ea; an elastic modulus of an insulating material of a packaging substrate surface layer after thermosetting is Eb; an elastic modulus of a core material, if used, is Ec, and the following rational expression is satisfied at normal temperature or a thermal contact bonding temperature of the adhesive material: at least Ea
摘要翻译：半导体器件在凸起电极和衬底电极之间具有连接可靠性。用于电连接金属凸块和互连图案的粘合材料的弹性模量，并且在热固化之后密封LSI芯片的电路表面是Ea; 热固化后的封装基材表面层的绝缘材料的弹性模量为Eb; 如果使用的话，芯材的弹性模量为Ec，在粘接材料的常温或热接触粘合温度下满足以下有理表达式：至少Ea

36. 发明申请

US20100013078A1 ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME 失效
标题翻译：用于连接电路部件和使用其的半导体器件的粘合剂
公开(公告)号：US20100013078A1
公开(公告)日：2010-01-21
申请号：US12500114
申请日：2009-07-09
申请人： Akira Nagai
发明人： Akira Nagai
IPC分类号： H01L23/52 , C08K3/22
CPC分类号： C09J11/04 , C08K3/08 , C08K3/22 , C08L2666/28 , C09J163/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/90 , H01L2224/05111 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/0558 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/13144 , H01L2224/16238 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29369 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81903 , H01L2224/83101 , H01L2224/83191 , H01L2224/83851 , H01L2224/90 , H01L2224/9211 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/15788 , H01L2924/00011 , H01L2224/16225 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/0665 , H01L2224/81 , H01L2224/83
摘要： An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition.
摘要翻译：一种用于连接电路部件的粘合剂，其被插入在具有突出连接端子的半导体芯片和形成在其上的布线图案的板之间，用于将连接端子和彼此面对的布线图案电连接，并通过施加压力来接合半导体芯片和板 /热，含有含有热可塑性树脂的树脂组合物，交联性树脂和用于形成交联性树脂的交联结构的硬化剂; 和分散在树脂组合物中的复合氧化物颗粒。

37. 发明申请

US20090247670A1 Epoxy Resin Molding Material for Sealing, and Electronic Component Device 审中-公开
标题翻译：用于密封的环氧树脂成型材料和电子部件装置
公开(公告)号：US20090247670A1
公开(公告)日：2009-10-01
申请号：US12094532
申请日：2006-11-16
申请人： Mitsuyoshi Hamada , Akira Nagai , Mitsuo Katayose , Kazuyoshi Tendou
发明人： Mitsuyoshi Hamada , Akira Nagai , Mitsuo Katayose , Kazuyoshi Tendou
IPC分类号： C08L63/00 , C08L95/00
CPC分类号： H01L23/293 , C08G59/621 , C08J3/226 , C08J2363/00 , C08J2463/00 , C08K3/22 , C08K5/0041 , C08L63/00 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to an epoxy resin molding material for sealing, comprising an epoxy resin (A), a curing agent (B), and a colorant resin mixture (C) wherein a resin (C1) and a colorant (D) having an electric resistivity of 1×105Ω·cm or more are beforehand mixed with each other. This can provide an epoxy resin molding material for sealing which is good in moldabilities such as fluidity and curability, and colorability, and which does not cause a short circuit failure based on an electroconductive material even when the material is used in a package wherein the distance between pads or wires is small; and an electronic component device equipped with an element sealed therewith.
摘要翻译：本发明涉及一种用于密封的环氧树脂模制材料，其包括环氧树脂（A），固化剂（B）和着色剂树脂混合物（C），其中树脂（C1）和着色剂（D）具有电预先混合1×10 5Ω·cm以上的电阻率。这可以提供一种密封性优异的环氧树脂成型材料，其流动性，固化性，着色性等成型性良好，即使将该材料用于包装中也不会导致基于导电性材料的短路故障，焊盘或电线之间的距离小; 以及配备有与其密封的元件的电子部件装置。

38. 发明申请

US20070292668A1 RESIN COMPOSITION, PREPREG, LAMINATE SHEET AND PRINTED WIRING BOARD USING THE SAME AND METHOD FOR PRODUCTION THEREOF 有权
标题翻译：树脂组合物，PREPREG，层压板和印刷线路板及其制造方法
公开(公告)号：US20070292668A1
公开(公告)日：2007-12-20
申请号：US11836963
申请日：2007-08-10
申请人： Satoru Amou , Morimichi Umino , Akira Nagai , Yoshihiro Nakamura , Nobuyuki Minami
发明人： Satoru Amou , Morimichi Umino , Akira Nagai , Yoshihiro Nakamura , Nobuyuki Minami
IPC分类号： B32B15/08
CPC分类号： H05K1/032 , H05K1/024 , H05K3/4626 , H05K2201/012 , H05K2201/0158 , H05K2201/0209 , H05K2201/0239 , Y10T428/12569 , Y10T428/24917 , Y10T428/24994 , Y10T428/24995 , Y10T428/249951 , Y10T428/249952 , Y10T428/31645
摘要： There are provided a resin composition comprising a crosslinking component with a weight average molecular weight of 1,000 or less having a plurality of styrene groups and represented by the following formula: wherein R is a hydrocarbon skeleton, each of R1s is a hydrogen atom or a hydrocarbon group, each of R2, R3 and R4 is a hydrogen atom or an alkyl group, m is an integer of 1 to 4, and n is an integer of 2 or more, at least one high-molecular weight compound, an inorganic filler, and at least one treating agent for said inorganic filler; its cured product; and a prepreg, a laminate sheet having a conductor layer, and a multilayer printed wiring board obtained by processing the conductor layer of the laminate sheet into wiring.
摘要翻译：提供一种树脂组合物，其包含具有多个苯乙烯基团的重均分子量为1,000以下的交联组分，由下式表示：其中R为烃骨架，R 1〜 s是氢原子或烃基，R 2，R 3和R 4中的每一个是氢原子或烷基 m为1〜4的整数，n为2以上的整数，至少一种高分子化合物，无机填充剂和至少一种所述无机填料用处理剂。其固化产品; 和预浸料，具有导体层的层叠片材和通过将层压片材的导体层加工成布线而获得的多层印刷布线板。

39. 发明授权

US07273900B2 Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof 有权
标题翻译：树脂组合物，预浸料，层压片和使用其的印刷线路板及其制造方法
公开(公告)号：US07273900B2
公开(公告)日：2007-09-25
申请号：US10935266
申请日：2004-09-08
申请人： Satoru Amou , Morimichi Umino , Akira Nagai , Yoshihiro Nakamura , Nobuyuki Minami
发明人： Satoru Amou , Morimichi Umino , Akira Nagai , Yoshihiro Nakamura , Nobuyuki Minami
IPC分类号： C08F8/00
CPC分类号： H05K1/032 , H05K1/024 , H05K3/4626 , H05K2201/012 , H05K2201/0158 , H05K2201/0209 , H05K2201/0239 , Y10T428/12569 , Y10T428/24917 , Y10T428/24994 , Y10T428/24995 , Y10T428/249951 , Y10T428/249952 , Y10T428/31645
摘要： There are provided a resin composition comprising a crosslinking component with a weight average molecular weight of 1,000 or less having a plurality of styrene groups and represented by the following formula: wherein R is a hydrocarbon skeleton, each of R1s is a hydrogen atom or a hydrocarbon group, each of R2, R3 and R4 is a hydrogen atom or an alkyl group, m is an integer of 1 to 4, and n is an integer of 2 or more, at least one high-molecular weight compound, an inorganic filler, and at least one treating agent for said inorganic filler; its cured product; and a prepreg, a laminate sheet having a conductor layer, and a multilayer printed wiring board obtained by processing the conductor layer of the laminate sheet into wiring.
摘要翻译：提供一种树脂组合物，其包含具有多个苯乙烯基团的重均分子量为1,000以下的交联组分，由下式表示：其中R为烃骨架，R 1〜 s是氢原子或烃基，R 2，R 3和R 4中的每一个是氢原子或烷基 m为1〜4的整数，n为2以上的整数，至少一种高分子化合物，无机填充剂和至少一种所述无机填料用处理剂。其固化产品; 和预浸料，具有导体层的层叠片材和通过将层压片材的导体层加工成布线而获得的多层印刷布线板。

40. 发明申请

US20070137887A1 Adhesive for bonding circuit members, circuit board and process for its production 有权
标题翻译：用于粘合电路元件，电路板及其生产工艺的粘合剂
公开(公告)号：US20070137887A1
公开(公告)日：2007-06-21
申请号：US11702552
申请日：2007-02-06
申请人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
发明人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
IPC分类号： H05K1/09 , B32B7/02
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.
摘要翻译：一种用于将半导体芯片接合并固定到电路板并电连接两个电极的粘合剂，并且包含粘合剂树脂组合物和无机填料，其含量为10至200重量份，100重量份的100重量份粘合剂树脂组合物。

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