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    • 36. 发明授权
    • Coating apparatus and method of controlling the same
    • 涂布装置及其控制方法
    • US5908657A
    • 1999-06-01
    • US946917
    • 1997-10-09
    • Yoshio KimuraSatoshi MoritaYuuji Matsuyama
    • Yoshio KimuraSatoshi MoritaYuuji Matsuyama
    • B05B15/04B05C11/08B05D1/00H01L21/00B05D3/12B05C5/00
    • H01L21/6715B05B15/0406B05D1/005B05C11/08
    • In the present invention, a waste solution and a exhaust gas are guided together from a drain cup DC into a storing means through common discharge means. Naturally, the gas-liquid separation is performed within the storing means in place of performing the gas-liquid separation within the drain cup DC. Therefore, the waste solution is not solidified within the drain cup so as to plug the common discharge means. Also, a predetermined waste solution is kept stored in the storing means included in the coating apparatus of the present invention, making it possible to permit the surface of the stored waste solution to absorb the mist, and the waste solution is prevented from being solidified within the storing means. Further, since a minimum amount of the exhaust gas is kept discharged even during non-operation of the coating apparatus by using an exhaust gas damper whose degree of opening can be controlled, the waste solution stored in the storing means is prevented from being solidified. Also, the waste solution evaporated within the storing means can be released to the outside.
    • 在本发明中,废液和废气通过共同排放装置从排水杯DC一起被引导到存储装置中。 自然地,在储存装置内进行气液分离,代替在排水杯DC内进行气液分离。 因此,废液不会在排水杯内凝固,堵塞普通排放装置。 此外,将预定的废液保存在本发明的涂布装置所包含的储存装置中,使得可以使储存的废液的表面吸收雾气,并且防止废液在其内固化 存储装置。 此外,由于即使在使用能够控制开度的排气阻尼器的涂布装置的非操作期间,排气的最小量也被排出,所以防止存储在存储装置中的废液固化。 此外,在存储装置内蒸发的废液可以释放到外部。
    • 38. 发明授权
    • System for applying process liquid
    • 用于加工液体的系统
    • US5578127A
    • 1996-11-26
    • US574732
    • 1995-12-19
    • Yoshio Kimura
    • Yoshio Kimura
    • B65G49/07G03F7/16H01L21/00H01L21/31H01L21/677H01L21/68B05B13/02B05C5/00B05C13/00
    • G03F7/16H01L21/6715Y10S134/902
    • A system for coating a photoresist on a semiconductor wafer includes a loading/unloading unit and a process unit. A convey path is arranged in the process unit, and an adhesion process section, a pre-bake section, a cooling section, a resist coating section, and a cover film coating section are arranged along the convey path. The adhesion process section, the pre-bake section, and the cover film coating section are arranged in individual process chambers, while the cooling section and the resist coating section are arranged in a common main process chamber. A convey robot is disposed to be movable along the convey path, and a substrate is conveyed among the process chambers by the convey robot. A convey member is arranged in and dedicated to the main process chamber, and the substrate is conveyed from the cooling section to the-resist coating section by the convey member.
    • 用于在半导体晶片上涂覆光致抗蚀剂的系统包括装载/卸载单元和处理单元。 输送路径布置在处理单元中,沿着传送路径布置粘合处理部分,预烘烤部分,冷却部分,抗蚀剂涂覆部分和覆盖膜涂覆部分。 粘附处理部分,预烘烤部分和覆盖膜涂覆部分被布置在各个处理室中,而冷却部分和抗蚀剂涂覆部分被布置在共同的主处理室中。 输送机器人设置成可沿输送路径移动,并且基板通过输送机器人在处理室之间输送。 传送部件布置在主处理室中并专用于主处理室,并且基板通过传送部件从冷却部分传送到抗蚀涂层部分。