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    • 32. 发明授权
    • Semiconductor memory
    • 半导体存储器
    • US5966341A
    • 1999-10-12
    • US982398
    • 1997-12-02
    • Tsugio TakahashiGoro KitsukawaTakesada AkibaYasushi KawaseMasayuki Nakamura
    • Tsugio TakahashiGoro KitsukawaTakesada AkibaYasushi KawaseMasayuki Nakamura
    • G11C11/401G11C7/10G11C11/407G11C11/408G11C11/409G11C11/4096G11C11/4097H01L21/8242H01L27/105H01L27/108G11C13/00
    • H01L27/10805G11C11/408G11C11/4096G11C11/4097G11C7/10H01L27/105
    • A semiconductor memory such as a dynamic RAM having memory mats each divided into a plurality of units or sub-memory mats. Each sub-memory mat comprises: a memory array having sub-word lines and sub-bit lines intersecting orthogonally and dynamic memory cells located in lattice fashion at the intersection points between the intersecting sub-word and sub-bit lines; a sub-word line driver including unit sub-word line driving circuits corresponding to the sub-word lines; a sense amplifier including unit amplifier circuits and column selection switches corresponding to the sub-bit lines; and sub-common I/O lines to which designated sub-bit lines are connected selectively via the column selection switches. The sub-memory mats are arranged in lattice fashion. Above the sub-memory mats is a layer of: main word lines and column selection signal lines intersecting orthogonally, the main word lines having a pitch that is an integer multiple of the pitch of the sub-word lines, the column selection signal lines having a pitch that is an integer multiple of the pitch of the sub-bit lines; and main common I/O lines to which designated sub-common I/O lines are connected selectively.
    • 具有各自被划分为多个单元或子存储器垫的存储器垫的动态RAM等半导体存储器。 每个子存储器垫包括:存储器阵列,其具有在相交的子字和子位线之间的交叉点处以网格方式位于正交和动态存储器单元的子字线和子位线; 子字线驱动器,包括对应于子字线的单元子字线驱动电路; 感测放大器,包括对应于子位线的单位放大器电路和列选择开关; 以及经由列选择开关选择性地连接指定子位线的子公共I / O线。 子存储垫以格子排列。 在子存储器衬垫之上是与主要字线和列选择信号线正交相交的层,主字线具有作为子字线的间距的整数倍的间距,列选择信号线具有 间距,是子位线的间距的整数倍; 以及选择性地连接指定的子公共I / O线的主要公共I / O线。
    • 37. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08325524B2
    • 2012-12-04
    • US12903774
    • 2010-10-13
    • Yasushi OkaTadashi OmaeTakesada Akiba
    • Yasushi OkaTadashi OmaeTakesada Akiba
    • G11C14/00
    • G11C5/025H01L27/0207H01L27/115H01L27/11519H01L27/11521H01L27/11558
    • The chip area of a semiconductor device including a nonvolatile memory is reduced. The semiconductor device includes a first memory cell and a second memory cell which are formed on the principal surface of a substrate, and arranged adjacent to each other. In a principal surface of the substrate, active regions which are electrically isolated from each other are arranged. In the first active region, the capacitor element of the first memory cell is arranged, while the capacitor element of the second memory cell is arranged in the fourth active region. In the second active region, the respective write/erase elements of the first and second memory cells are both arranged. Further, in the third active region, the respective read elements of the first and second memory cells are both arranged.
    • 包括非易失性存储器的半导体器件的芯片面积减小。 半导体器件包括形成在基板的主表面上并彼此相邻布置的第一存储单元和第二存储单元。 在基板的主表面上布置有彼此电隔离的有源区。 在第一有源区域中,布置第一存储单元的电容器元件,而第二存储单元的电容器元件布置在第四有源区域中。 在第二有源区域中,布置有第一和第二存储单元的相应写/擦除元件。 此外,在第三有源区域中,布置有第一和第二存储单元的各个读取元件。
    • 38. 发明申请
    • Semiconductor Device
    • 半导体器件
    • US20110024814A1
    • 2011-02-03
    • US12903774
    • 2010-10-13
    • Yasushi OKATadashi OmaeTakesada Akiba
    • Yasushi OKATadashi OmaeTakesada Akiba
    • H01L27/108
    • G11C5/025H01L27/0207H01L27/115H01L27/11519H01L27/11521H01L27/11558
    • The chip area of a semiconductor device including a nonvolatile memory is reduced. The semiconductor device includes a first memory cell and a second memory cell which are formed on the principal surface of a substrate, and arranged adjacent to each other. In a principal surface of the substrate, active regions which are electrically isolated from each other are arranged. In the first active region, the capacitor element of the first memory cell is arranged, while the capacitor element of the second memory cell is arranged in the fourth active region. In the second active region, the respective write/erase elements of the first and second memory cells are both arranged. Further, in the third active region, the respective read elements of the first and second memory cells are both arranged.
    • 包括非易失性存储器的半导体器件的芯片面积减小。 半导体器件包括形成在基板的主表面上并彼此相邻布置的第一存储单元和第二存储单元。 在基板的主表面上布置有彼此电隔离的有源区。 在第一有源区域中,布置第一存储单元的电容器元件,而第二存储单元的电容器元件布置在第四有源区域中。 在第二有源区域中,布置有第一和第二存储单元的相应写/擦除元件。 此外,在第三有源区域中,布置有第一和第二存储单元的各个读取元件。
    • 40. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07839683B2
    • 2010-11-23
    • US12233580
    • 2008-09-18
    • Yasushi OkaTadashi OmaeTakesada Akiba
    • Yasushi OkaTadashi OmaeTakesada Akiba
    • G11C14/00
    • G11C5/025H01L27/0207H01L27/115H01L27/11519H01L27/11521H01L27/11558
    • The chip area of a semiconductor device including a nonvolatile memory is reduced. The semiconductor device includes a first memory cell and a second memory cell which are formed on the principal surface of a substrate, and arranged adjacent to each other. In a principal surface of the substrate, active regions which are electrically isolated from each other are arranged. In the first active region, the capacitor element of the first memory cell is arranged, while the capacitor element of the second memory cell is arranged in the fourth active region. In the second active region, the respective write/erase elements of the first and second memory cells are both arranged. Further, in the third active region, the respective read elements of the first and second memory cells are both arranged.
    • 包括非易失性存储器的半导体器件的芯片面积减小。 半导体器件包括形成在基板的主表面上并彼此相邻布置的第一存储单元和第二存储单元。 在基板的主表面上布置有彼此电隔离的有源区。 在第一有源区域中,布置第一存储单元的电容器元件,而第二存储单元的电容器元件布置在第四有源区域中。 在第二有源区域中,布置有第一和第二存储单元的相应写/擦除元件。 此外,在第三有源区域中,布置有第一和第二存储单元的各个读取元件。