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    • 36. 发明授权
    • Nonvolatile semiconductor memory and fabrication method for the same
    • 非易失性半导体存储器及其制造方法相同
    • US08541829B2
    • 2013-09-24
    • US13235948
    • 2011-09-19
    • Kikuko SugimaeMasayuki IchigeFumitaka AraiYasuhiko MatsunagaAtsuhiro Sato
    • Kikuko SugimaeMasayuki IchigeFumitaka AraiYasuhiko MatsunagaAtsuhiro Sato
    • H01L29/76H01L29/792
    • H01L27/115G11C16/0416G11C16/0433G11C16/0483G11C16/30H01L27/11521H01L27/11524
    • A nonvolatile semiconductor memory includes a memory cell transistor including a first floating gate electrode layer formed on a first tunneling insulating film, a first inter-gate insulating film, first and second control gate electrode layers, and a first metallic silicide film; a high voltage transistor including a high voltage gate electrode layer formed on a high voltage gate insulating film, a second inter-gate insulating film having an aperture, third and fourth control gate electrode layers, and a second metallic silicide film; a low voltage transistor including a second floating gate electrode layer formed on a second tunneling insulating film, a third inter-gate insulating film having an aperture, fifth and sixth control gate electrode layers, and a third metallic silicide film; and a liner insulating film directly disposed on source and drain regions of each of the memory cell transistor, the low voltage transistor, and the high voltage transistor.
    • 非易失性半导体存储器包括:存储单元晶体管,包括形成在第一隧穿绝缘膜上的第一浮栅电极层,第一栅间绝缘膜,第一和第二控制栅极电极层以及第一金属硅化物膜; 包括形成在高压栅极绝缘膜上的高电压栅极电极层,具有孔径的第二栅极间绝缘膜,第三和第四控制栅极电极层以及第二金属硅化物膜的高压晶体管; 包括形成在第二隧道绝缘膜上的第二浮栅电极层,具有孔的第三栅间绝缘膜,第五和第六控制栅电极层和第三金属硅化物膜的低压晶体管; 以及直接设置在每个存储单元晶体管,低压晶体管和高压晶体管的源极和漏极区域上的衬垫绝缘膜。
    • 37. 发明授权
    • NAND flash memory
    • NAND闪存
    • US08159880B2
    • 2012-04-17
    • US13164486
    • 2011-06-20
    • Atsuhiro SatoFumitaka Arai
    • Atsuhiro SatoFumitaka Arai
    • G11C16/00
    • G11C11/5628G11C16/0483
    • In a state in which a first and second selection gate transistors are turned off and a first voltage is applied to a control gate of a second memory cell transistor which is connected to a source line side of a first memory cell transistor selected from among the memory cell transistors and which is to be cut off, a second voltage which is higher than the first voltage and which causes a plurality of third memory cell transistors remaining unselected in the memory cell transistors to conduct is applied to control gates of the third memory cell transistors, and thereafter a threshold voltage of the first memory cell transistor is changed to a threshold voltage higher than the first threshold voltage corresponding to the erase state by applying a third voltage which is higher than the second voltage to a control gate of the first memory cell transistor.
    • 在第一和第二选择栅极晶体管被截止并且第一电压被施加到第二存储单元晶体管的控制栅极的状态下,第二存储单元晶体管连接到从存储器中选择的第一存储单元晶体管的源极线侧 单元晶体管并且要被切断,高于第一电压的第二电压并且使得在存储单元晶体管导通时保持未选择的多个第三存储单元晶体管被施加到第三存储单元晶体管的控制栅极 之后,通过向第一存储单元的控制栅极施加高于第二电压的第三电压,将第一存储单元晶体管的阈值电压改变为高于与擦除状态相对应的第一阈值电压的阈值电压 晶体管。
    • 39. 发明授权
    • Nonvolatile semiconductor memory device and manufacturing method thereof
    • 非易失性半导体存储器件及其制造方法
    • US08133782B2
    • 2012-03-13
    • US13028730
    • 2011-02-16
    • Hiroshi AkahoriWakako TakeuchiAtsuhiro Sato
    • Hiroshi AkahoriWakako TakeuchiAtsuhiro Sato
    • H01L21/8247
    • H01L27/11521H01L21/28273H01L27/115H01L29/42336
    • A memory device includes a semiconductor substrate, memory elements formed above the substrate in rows and columns, bit lines and word lines selectively connected with the memory elements in the respective columns and rows, each memory element including, a first gate insulator formed above the substrate, a charge accumulation layer formed on the first gate insulator, a second gate insulator formed on the charge accumulation layer, and a control electrode formed on the second gate insulator, wherein a ratio r/d is not smaller than 0.5, where r: a radius of curvature of an upper corner portion or surface roughness of the charge accumulation layer and d: an equivalent oxide thickness of the second gate insulator in a cross section along a direction vertical to the bit lines.
    • 存储器件包括:半导体衬底,以行和列形成在衬底上方的存储元件,位线和字线与各个列和行中的存储元件选择性地连接,每个存储元件包括形成在衬底上的第一栅极绝缘体 ,形成在第一栅极绝缘体上的电荷累积层,形成在电荷累积层上的第二栅极绝缘体和形成在第二栅极绝缘体上的控制电极,其中比率r / d不小于0.5,其中r:a 上角部的曲率半径或电荷蓄积层的表面粗糙度,d:沿着与位线垂直的方向的截面中的第二栅极绝缘体的等效氧化物厚度。
    • 40. 发明授权
    • Nonvolatile semiconductor memory with resistance elements and method of manufacturing the same
    • 具有电阻元件的非易失性半导体存储器及其制造方法
    • US08088661B2
    • 2012-01-03
    • US12652548
    • 2010-01-05
    • Fumitaka AraiAtsuhiro Sato
    • Fumitaka AraiAtsuhiro Sato
    • H01L29/72
    • H01L27/105H01L27/11526H01L27/11539H01L29/78
    • A nonvolatile semiconductor memory of an aspect of the present invention comprises a memory cell transistor and a resistance element arranged on a semiconductor substrate. The memory cell transistor includes a floating gate electrode constituted of a first conductive material arranged on a gate insulating film on a surface of the semiconductor substrate, an inter-gate insulating film arranged on the floating gate electrode, a control gate electrode arranged on the inter-gate insulating film, and a source/drain diffusion layer provided in the semiconductor substrate. The resistance element includes an element isolation insulating layer arranged in the semiconductor substrate and including a depression, and a resistor constituted of a second conductive material filling up the depression. An impurity concentration of the second conductive material is lower than that of the first conductive material.
    • 本发明的一个方面的非易失性半导体存储器包括存储单元晶体管和布置在半导体衬底上的电阻元件。 存储单元晶体管包括由在半导体衬底的表面上配置在栅极绝缘膜上的第一导电材料构成的浮置栅极电极,布置在浮置栅电极上的栅极间绝缘膜, 栅极绝缘膜和设置在半导体衬底中的源极/漏极扩散层。 电阻元件包括布置在半导体衬底中并包括凹陷的元件隔离绝缘层和由填充凹陷的第二导电材料构成的电阻器。 第二导电材料的杂质浓度低于第一导电材料的杂质浓度。