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    • 6. 发明授权
    • Semiconductor memory device and manufacturing method thereof
    • 半导体存储器件及其制造方法
    • US08377814B2
    • 2013-02-19
    • US13164931
    • 2011-06-21
    • Atsuhiro SatoHiroyuki NittaFumitaka Arai
    • Atsuhiro SatoHiroyuki NittaFumitaka Arai
    • H01L21/28
    • H01L27/11524H01L21/76816H01L27/11521
    • A semiconductor memory device includes a first block having first memory cells and first select transistors, a second block having second memory cells and second select transistors, and arranged adjacent to the first block in a first direction, the second select transistor being arranged to face the first select transistor and commonly having a diffusion region with the first select transistor, a first interconnection layer provided on the diffusion region between the first and second blocks and extending in a second direction, and a second interconnection layer having a first portion provided in contact with an upper portion of the first interconnection layer and extending to a portion outside the first interconnection layer, and a second portion extending in the second direction and connected to the first portion in a portion outside a portion on the first interconnection layer.
    • 半导体存储器件包括具有第一存储器单元和第一选择晶体管的第一块,具有第二存储单元和第二选择晶体管的第二块,并且沿第一方向布置成与第一块相邻,第二选择晶体管被布置为面对 第一选择晶体管,并且通常具有与第一选择晶体管的扩散区,第一互连层,设置在第一和第二块之间的扩散区上并沿第二方向延伸;第二互连层,具有设置成与第一选择晶体管接触的第一部分 第一互连层的上部并且延伸到第一互连层外部的部分,以及第二部分,其在第二方向上延伸并且在第一互连层上的部分外部的部分连接到第一部分。
    • 7. 发明授权
    • Semiconductor memory device and manufacturing method therefor
    • 半导体存储器件及其制造方法
    • US08120092B2
    • 2012-02-21
    • US12565181
    • 2009-09-23
    • Atsuhiro SatoFumitaka Arai
    • Atsuhiro SatoFumitaka Arai
    • H01L29/76H01L29/94H01L31/062H01L31/113H01L31/119
    • H01L27/11519H01L27/11521H01L27/11529
    • First gate electrodes of memory cell transistors are formed in series with each other on a semiconductor substrate. A second gate electrode of a first selection transistor is formed adjacent to one end of the first electrodes. A third gate electrode of a second selection transistor is formed adjacent to the second electrode. A fourth gate electrode of a peripheral transistor is formed on the substrate. First, second, and third sidewall films are formed on side surfaces of the second, third, and fourth gate electrodes, respectively. A film thickness of the third sidewall film is larger than that of the first and second sidewall films. A space between the first electrode and the second electrode is larger than a space between the first electrodes, and a space between the second electrode and the third electrode is larger than a space between the first electrode and the second electrode.
    • 存储单元晶体管的第一栅电极在半导体衬底上彼此串联形成。 第一选择晶体管的第二栅电极与第一电极的一端相邻地形成。 第二选择晶体管的第三栅电极与第二电极相邻地形成。 在基板上形成周边晶体管的第四栅电极。 第一,第二和第三侧壁膜分别形成在第二,第三和第四栅电极的侧表面上。 第三侧壁膜的膜厚大于第一和第二侧壁膜的膜厚。 第一电极和第二电极之间的空间大于第一电极之间的空间,并且第二电极和第三电极之间的间隔大于第一电极和第二电极之间的间隔。
    • 9. 发明授权
    • Non-volatile semiconductor storage device
    • 非易失性半导体存储器件
    • US08314455B2
    • 2012-11-20
    • US13156727
    • 2011-06-09
    • Yasuhiro ShiinoAtsuhiro SatoTakeshi KamigaichiFumitaka Arai
    • Yasuhiro ShiinoAtsuhiro SatoTakeshi KamigaichiFumitaka Arai
    • H01L29/792
    • H01L27/11578H01L27/11573H01L27/11582
    • A non-volatile semiconductor storage device includes: a memory cell area in which a plurality of electrically rewritable memory cells are formed; and a peripheral circuit area in which transistors that configure peripheral circuits to control the memory cells are formed. The memory cell area has formed therein: a semiconductor layer formed to extend in a vertical direction to a semiconductor substrate; a plurality of conductive layers extending in a parallel direction to, and laminated in a vertical direction to the semiconductor substrate; and a property-varying layer formed between the semiconductor layer and the conductive layers and having properties varying depending on a voltage applied to the conductive layers. The peripheral circuit area has formed therein a plurality of dummy wiring layers that are formed on the same plane as each of the plurality of conductive layers and that are electrically separated from the conductive layers.
    • 非易失性半导体存储装置包括:形成有多个电可重写存储单元的存储单元区域; 以及外围电路区域,其中形成配置外围电路以控制存储单元的晶体管。 在其中形成存储单元区域:形成为在垂直方向上延伸到半导体衬底的半导体层; 多个导电层,沿着与半导体基板的垂直方向平行的方向延伸并层叠; 以及形成在所述半导体层和所述导电层之间的性质变化层,并且具有根据施加到所述导电层的电压而变化的特性。 外围电路区域中形成有多个虚拟布线层,其形成在与多个导电层中的每一个相同的平面上,并且与导电层电分离。
    • 10. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREFOR
    • 半导体存储器件及其制造方法
    • US20120094461A1
    • 2012-04-19
    • US13332462
    • 2011-12-21
    • Atsuhiro SatoFumitaka Arai
    • Atsuhiro SatoFumitaka Arai
    • H01L21/8234
    • H01L27/11519H01L27/11521H01L27/11529
    • First gate electrodes of memory cell transistors are formed in series with each other on a semiconductor substrate. A second gate electrode of a first selection transistor is formed adjacent to one end of the first electrodes. A third gate electrode of a second selection transistor is formed adjacent to the second electrode. A fourth gate electrode of a peripheral transistor is formed on the substrate. First, second, and third sidewall films are formed on side surfaces of the second, third, and fourth gate electrodes, respectively. A film thickness of the third sidewall film is larger than that of the first and second sidewall films. A space between the first electrode and the second electrode is larger than a space between the first electrodes, and a space between the second electrode and the third electrode is larger than a space between the first electrode and the second electrode.
    • 存储单元晶体管的第一栅电极在半导体衬底上彼此串联形成。 第一选择晶体管的第二栅电极与第一电极的一端相邻地形成。 第二选择晶体管的第三栅电极与第二电极相邻地形成。 在基板上形成周边晶体管的第四栅电极。 第一,第二和第三侧壁膜分别形成在第二,第三和第四栅电极的侧表面上。 第三侧壁膜的膜厚大于第一和第二侧壁膜的膜厚。 第一电极和第二电极之间的空间大于第一电极之间的空间,并且第二电极和第三电极之间的间隔大于第一电极和第二电极之间的间隔。