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    • 31. 发明授权
    • Mortar mixing machine with two conveying and mixing tubes of opposite
conveying direction
    • 砂浆搅拌机与输送方向相反的输送混合管
    • US5752769A
    • 1998-05-19
    • US708567
    • 1996-09-05
    • Hans WeberAnton Muller
    • Hans WeberAnton Muller
    • B01F13/10B28C5/12B28C5/14
    • B28C5/1292
    • A mortar mixing machine has a frame and a hopper supported by the frame for containing dry mortar. The hopper has an outlet with an outlet opening. A first conveying and mixing tube, connected in a working position thereof to the outlet so as to extend horizontally, has at least one water inlet and is designed for mixing the dry mortar fed into the conveying and mixing tube from the hopper with water introduced via the at least one water inlet to prepare mixed moist mortar. The first conveying and mixing tube has a removal opening for the mixed moist mortar remote from the outlet. A second conveying and mixing tube is connected to the frame for directly receiving in a working position thereof the mixed moist mortar. The second conveying and mixing tube conveys the mixed moist mortar in a direction opposite to the conveying direction of the first conveying and mixing tube. The second conveying and mixing tube has a drive and is slidably retractable into a rest position together with the drive.
    • 砂浆混合机具有由框架支撑的框架和料斗,用于容纳干砂浆。 料斗具有带有出口的出口。 将其工作位置连接到出口以便水平延伸的第一输送和混合管具有至少一个进水口,并且设计成将从料斗供给到输送和混合管中的干砂浆与经由 至少一个进水口准备混合的湿砂浆。 第一输送和混合管具有远离出口的混合湿砂浆的去除开口。 第二输送和混合管连接到框架,用于在其工作位置直接接收混合的湿砂浆。 第二输送和混合管以与第一输送和混合管的输送方向相反的方向输送混合的湿砂浆。 第二输送和混合管具有驱动器并且与驱动器一起可滑动地缩回到静止位置。
    • 34. 发明授权
    • Semiconductor device with voltage compensation structure
    • 具有电压补偿结构的半导体器件
    • US08633095B2
    • 2014-01-21
    • US13174319
    • 2011-06-30
    • Hans-Joachim SchulzeHans Weber
    • Hans-Joachim SchulzeHans Weber
    • H01L21/00
    • H01L29/7827H01L29/0634H01L29/0653H01L29/1054H01L29/165H01L29/167H01L29/36H01L29/66712H01L29/73H01L29/7395H01L29/7802H01L29/808H01L29/872
    • A semiconductor device with a high voltage compensation component is manufactured by etching a trench into an epitaxial semiconductor material doped with n-type dopant atoms and p-type dopant atoms and disposing a first semiconductor or insulating material along one or more sidewalls of the trench. The first semiconductor or insulating material has a dopant diffusion constant which is at least 2× different for the n-type dopant atoms than the p-type dopant atoms. A second semiconductor material is disposed in the trench along the first semiconductor or insulating material. The second semiconductor material has a different dopant diffusion constant than the first semiconductor or insulating material. More n-type dopant atoms or p-type dopant atoms are diffused from the epitaxial semiconductor material through the first semiconductor or insulating material into the second semiconductor material than the other type of dopant atoms so that a lateral charge separation occurs between the second semiconductor material and the epitaxial semiconductor material.
    • 通过将沟槽蚀刻成掺杂有n型掺杂剂原子和p型掺杂剂原子的外延半导体材料并且沿沟槽的一个或多个侧壁设置第一半导体或绝缘材料来制造具有高电压补偿分量的半导体器件。 第一半导体或绝缘材料具有与p型掺杂剂原子相比对于n型掺杂剂原子至少为2×不同的掺杂剂扩散常数。 第二半导体材料沿着第一半导体或绝缘材料设置在沟槽中。 第二半导体材料具有与第一半导体或绝缘材料不同的掺杂剂扩散常数。 比其他类型的掺杂剂原子,更多的n型掺杂剂原子或p型掺杂剂原子从外延半导体材料通过第一半导体或绝缘材料扩散到第二半导体材料中,使得在第二半导体材料 和外延半导体材料。
    • 35. 发明申请
    • Charge Compensation Semiconductor Device
    • 充电补偿半导体器件
    • US20130234239A1
    • 2013-09-12
    • US13414037
    • 2012-03-07
    • Hans WeberFranz Hirler
    • Hans WeberFranz Hirler
    • H01L29/78H01L21/336
    • H01L29/7802H01L29/0634H01L29/1095H01L29/167H01L29/32H01L29/407H01L29/408H01L29/41766H01L29/66727
    • A semiconductor device includes a semiconductor body having a first surface defining a vertical direction and a source metallization arranged on the first surface. In a vertical cross-section the semiconductor body further includes: a drift region of a first conductivity type; at least two compensation regions of a second conductivity type each of which forms a pn-junction with the drift region and is in low resistive electric connection with the source metallization; a drain region of the first conductivity type having a maximum doping concentration higher than a maximum doping concentration of the drift region, and a third semiconductor layer of the first conductivity type arranged between the drift region and the drain region and includes at least one of a floating field plate and a floating semiconductor region of the second conductivity type forming a pn-junction with the third semiconductor layer.
    • 半导体器件包括具有限定垂直方向的第一表面和布置在第一表面上的源极金属化的半导体本体。 在垂直横截面中,半导体主体还包括:第一导电类型的漂移区; 至少两个第二导电类型的补偿区域,每个补偿区域与漂移区域形成pn结并与源极金属化处于低电阻电连接; 具有高于漂移区的最大掺杂浓度的最大掺杂浓度的第一导电类型的漏极区和布置在漂移区和漏极区之间的第一导电类型的第三半导体层,并且包括以下中的至少一个: 浮置场板和第二导电类型的浮置半导体区域形成与第三半导体层的pn结。
    • 36. 发明授权
    • Semiconductor device and manufacturing method
    • 半导体器件及制造方法
    • US08421196B2
    • 2013-04-16
    • US12626425
    • 2009-11-25
    • Hans WeberGerald Deboy
    • Hans WeberGerald Deboy
    • H01L29/06H01L21/336
    • H01L29/0611H01L21/20H01L29/0607H01L29/0634H01L29/0657H01L29/66348H01L29/7397
    • A semiconductor device includes a drift zone of a first conductivity type formed within a semiconductor body, wherein one side of opposing sides of the drift zone adjoins a first zone within the semiconductor body and the other side adjoins a second zone within the semiconductor body. First semiconductor subzones of a second conductivity type different from the first conductivity type are formed within each of the first and second zones opposing each other along a lateral direction extending parallel to a surface of the semiconductor body. A second semiconductor subzone is formed within each of the first and second zones and between the first semiconductor subzones along the lateral direction. An average concentration of dopants within the second semiconductor subzone along 10% to 90% of an extension of the second semiconductor subzone along a vertical direction perpendicular to the surface is smaller than the average concentration of dopants along a corresponding section of extension within the drift zone.
    • 半导体器件包括形成在半导体本体内的第一导电类型的漂移区,其中漂移区的相对侧的一侧与半导体本体内的第一区相邻,而另一侧邻接半导体内的第二区。 沿着与半导体主体的表面平行延伸的横向方向彼此相对地形成第一和第二区域中的第一导电类型不同于第一导电类型的第一半导体子区。 第二半导体子区域形成在第一和第二区域的每一个中,并且沿着横向形成在第一半导体子区域之间。 第二半导体子区域内的掺杂剂的平均浓度沿着垂直于表面的垂直方向的第二半导体子区域的延伸的10%至90%的平均浓度小于漂移区域内沿着相应的延伸部分的掺杂剂的平均浓度 。