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    • 34. 发明授权
    • Method of forming junction isolation to isolate active elements
    • 形成结隔离以隔离有源元件的方法
    • US06812149B1
    • 2004-11-02
    • US10662381
    • 2003-09-16
    • Chun Chi WangChun Lien SuWen Pin Lu
    • Chun Chi WangChun Lien SuWen Pin Lu
    • H01L21311
    • H01L21/761
    • A method of forming junction isolation to isolate active elements. A substrate having a plurality of active areas and an isolation area between active areas is provided. A first gate structure is formed on part of the substrate located in the active areas and, simultaneously, a second gate structure serving as a dummy gate structure is formed on the substrate located in the isolation area. A first doped region is formed in the substrate located at two sides of the first and the second gate structures. A bottom anti-reflection layer is formed on the substrate, the first gate structure and the second gate structure. Part of the bottom anti-reflection layer is etched to expose the second gate structure. The second gate structure is removed to expose the substrate. A second doped region serving as a junction isolation region is formed in the substrate located in the isolation area.
    • 形成结隔离以隔离有源元件的方法。 提供了具有多个有源区域和有源区域之间的隔离区域的衬底。 第一栅极结构形成在位于有源区域中的衬底的一部分上,并且同时,在位于隔离区域中的衬底上形成用作虚设栅极结构的第二栅极结构。 在位于第一和第二栅极结构的两侧的衬底中形成第一掺杂区域。 在基板,第一栅极结构和第二栅极结构上形成底部防反射层。 底部抗反射层的一部分被蚀刻以暴露第二栅极结构。 去除第二栅极结构以暴露衬底。 在位于隔离区域的基板中形成用作结隔离区域的第二掺杂区域。
    • 35. 发明授权
    • Process for planarization of flash memory cell
    • 闪存单元平坦化处理
    • US06680256B2
    • 2004-01-20
    • US09881438
    • 2001-06-14
    • Hung-Yu ChiuChun-Lien SuWen-Pin Lu
    • Hung-Yu ChiuChun-Lien SuWen-Pin Lu
    • H01L21302
    • H01L21/28273H01L21/31116
    • A process for planarization of a flash memory cell is described. A first polysilicon pattern having a top is formed over a substrate. A high-density plasma (HDP) oxide layer is deposited on the first polysilicon pattern, wherein the HDP oxide layer has a protuberance over the first polysilicon pattern. The HDP oxide layer and the first polysilicon pattern are partially etched by a sputtering etch technology. In this etching step, the protuberance is removed, the first polysilicon pattern is lowered, and the top of the first polysilicon pattern is rounded. A second polysilicon pattern covering the first polysilicon pattern is formed, wherein the second polysilicon pattern is wider than the first polysilicon pattern.
    • 描述了闪存单元的平坦化处理。 在衬底上形成具有顶部的第一多晶硅图案。 在第一多晶硅图案上沉积高密度等离子体(HDP)氧化物层,其中HDP氧化物层在第一多晶硅图案上具有突起。 通过溅射蚀刻技术部分地蚀刻HDP氧化物层和第一多晶硅图案。 在该蚀刻步骤中,去除突起,第一多晶硅图案降低,并且第一多晶硅图案的顶部是圆形的。 形成覆盖第一多晶硅图案的第二多晶硅图案,其中第二多晶硅图案比第一多晶硅图案宽。