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    • 31. 发明申请
    • Diode
    • 二极管
    • US20070007587A1
    • 2007-01-11
    • US11428741
    • 2006-07-05
    • Reiner BarthelmessFranz-Josef NiedernostheideHans-Joachim Schulze
    • Reiner BarthelmessFranz-Josef NiedernostheideHans-Joachim Schulze
    • H01L29/94
    • H01L29/861H01L21/263H01L21/3242H01L29/0661
    • A diode has a semiconductor body (1), which has a front side (11) and a rear side (12) opposite the front side (11) in a vertical direction (z) of the semiconductor (1), and in which a heavily n-doped zone (5), a weakly n-doped zone (4), a weakly p-doped zone (3) and a heavily p-doped zone (2) are arranged successively in the vertical direction (z) proceeding from the rear side (12) toward the front side (11). In order to produce the weakly p-doped zone (3) of such a diode, aluminum may be introduced into the semiconductor body (1) proceeding from the front side (11). Optionally, the diode may have a field stop zone (9). Such a field stop zone (9) may be produced by rear-side indiffusion of sulfur and/or selenium into the semiconductor body (1).
    • 二极管具有在半导体(1)的垂直方向(z)上具有与前侧(11)相对的前侧(11)和后侧(12)的半导体本体(1),其中 在n个掺杂区域(5),弱n掺杂区域(4),弱p掺杂区域(3)和重p掺杂区域(2)中,沿着从 后侧(12)朝向前侧(11)。 为了产生这种二极管的弱p掺杂区域(3),铝可以从前侧(11)引入到半导体本体(1)中。 可选地,二极管可以具有场停止区(9)。 这种场阻挡区(9)可以通过将硫和/或硒向后半侧向半导体本体(1)中的扩散而产生。
    • 33. 发明授权
    • High-voltage diode
    • 高压二极管
    • US06770917B2
    • 2004-08-03
    • US10395425
    • 2003-03-24
    • Reiner BarthelmessFrank PfirschAnton MauderGerhard Schmidt
    • Reiner BarthelmessFrank PfirschAnton MauderGerhard Schmidt
    • H01L29861
    • H01L29/405H01L29/66128H01L29/8611
    • A high-voltage diode and a method for producing the high-voltage diode involve only three masking steps. Only three masking steps are required due to the use of adjustment structures and of a chipping stopper with an edge passivation containing a-C:H or a-Si. In this manner, the high-voltage diode is inexpensive to manufacture. The diode has a rating for reverse voltages of, in particular, above about 400 V and preferably above about 500 V, and can be fabricated with the least possible process complexity and thus a small number of photo technologies and, in the edge region, can readily be equipped with a channel stopper for avoiding leakage currents and a chipping stopper for limiting the extent of saving defects.
    • 高压二极管和高压二极管的制造方法仅涉及三个掩模步骤。 由于使用调节结构和具有含有-c:H或a-Si的边缘钝化的切屑塞,仅需要三个掩模步骤。 以这种方式,高压二极管的制造便宜。 二极管的反向电压的额定值尤其高于约400V,优选高于约500V,并且可以以最不可能的工艺复杂性制造,因此可以制造少量的照相技术,并且在边缘区域中 容易配备有用于避免泄漏电流的通道止动器和用于限制挽救缺陷的程度的切屑止动器。
    • 37. 发明授权
    • Thyristor with recovery protection
    • 晶闸管具有恢复保护
    • US07687826B2
    • 2010-03-30
    • US11463188
    • 2006-08-08
    • Hans-Joachim SchulzeFranz Josef NiedernostheideUwe Kellner-WerdehausenReiner Barthelmess
    • Hans-Joachim SchulzeFranz Josef NiedernostheideUwe Kellner-WerdehausenReiner Barthelmess
    • H01L29/74H01L31/111
    • H01L31/1113H01L29/0692H01L29/083H01L29/7428
    • A main thyristor (1) has a recovery protection which is integrated into a drive thyristor (2) whose n-doped emitter (25) is electrically connected to a main thyristor control terminal (140). Moreover, the p-doped emitter (28) of the drive thyristor (2) is electrically connected to the p-doped emitter (18) of the main thyristor (1). Various optional measures for realizing a recovery protection are provided in this case. A method for producing a thyristor system having a main thyristor and a drive thyristor, the drive thyristor (2) having anode short circuits (211) involves introducing particles (230) into a target region (225) of the semiconductor body (200) of the drive thyristor (2), the distance between the target region (225) and a front side (201) of the semiconductor body (200) opposite to the rear side (202) being less than or equal to the distance between the p-doped emitter (28) and the front side (201).
    • 主晶闸管(1)具有集成到其n掺杂发射极(25)电连接到主晶闸管控制端子(140)的驱动晶闸管(2)的恢复保护。 此外,驱动晶闸管(2)的p掺杂发射极(28)电连接到主晶闸管(1)的p掺杂发射极(18)。 在这种情况下,提供了用于实现恢复保护的各种可选措施。 一种制造具有主晶闸管和驱动晶闸管的晶闸管系统的方法,所述驱动晶闸管(2)具有阳极短路(211),包括将粒子(230)引入所述半导体本体(200)的目标区域(225) 所述驱动晶闸管(2),所述半导体本体(200)的与所述后侧(202)相对的所述目标区域(225)与所述前侧(201)之间的距离小于或等于所述半导体本体 掺杂发射极(28)和前侧(201)。
    • 40. 发明授权
    • Power semiconductor component having a mesa edge termination
    • 功率半导体元件具有台面边缘端接
    • US06696705B1
    • 2004-02-24
    • US09660276
    • 2000-09-12
    • Reiner BarthelmessGerhard Schmidt
    • Reiner BarthelmessGerhard Schmidt
    • H01L29861
    • H01L29/0661H01L29/0615H01L29/0834H01L29/7396H01L29/744H01L29/8613
    • A power semiconductor component having a mesa edge termination is described. The component has a semiconductor body with first and second surfaces. An inner zone of a first conductivity type is disposed in the semiconductor body. A first zone is disposed in the semiconductor body and is connected to the inner zone. An edge area outside of the first zone has areas etched out. A second zone of a second conductivity type is disposed in the semiconductor body and is connected to the inner zone, and a boundary area between the second zone and the inner zone defines a pn junction. A field stop zone is adjacent the first surface in the edge area. The field stop zone is formed of the first conductivity type and is embedded in the semiconductor body, and the field stop zone is connected to the first zone and to the inner zone.
    • 描述具有台面边缘终止的功率半导体部件。 该部件具有带有第一和第二表面的半导体本体。 第一导电类型的内部区域设置在半导体本体中。 第一区域设置在半导体本体中并且连接到内部区域。 第一区域之外的边缘区域被蚀刻出来。 第二导电类型的第二区域设置在半导体本体中并且连接到内部区域,并且第二区域和内部区域之间的边界区域限定了pn结。 边界区域的第一个表面附近设有一个停止区域。 场阻挡区由第一导电类型形成,并且嵌入在半导体本体中,并且场停止区域连接到第一区域和内部区域。