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1. 发明授权

US07221004B2 Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：US07221004B2
公开(公告)日：2007-05-22
申请号：US11206887
申请日：2005-08-18
申请人： Detlef Scholz , Heinrich Gerstenkoeper
发明人： Detlef Scholz , Heinrich Gerstenkoeper
IPC分类号： H01L29/74
CPC分类号： H01L23/051 , H01L23/3185 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： Disclosed is a semiconductor module comprising a semiconductor element (1) and two terminal electrodes (3a, 3b, 3c) between which the semiconductor element (1) is disposed and with which the semiconductor element (1) is contacted in an electrically conducting manner. The semiconductor element (1) is surrounded by an at least partly electrically insulating housing (5, 7, 11, 12). In order to protect the housing from the effect of electric arcs occurring in the event of an overload, a high temperature-resistant insulator which is arranged at least at some points between a housing wall and the semiconductor element is provided inside the module. The insulator can surround the semiconductor element as a hollow cylinder.
摘要翻译：公开了一种半导体模块，其包括半导体元件（1）和两个端子电极（3a，3b，3c），在所述半导体元件（1）之间设置有半导体元件（1），半导体元件（1）进行方式半导体元件（1）由至少部分电绝缘的壳体（5,7,11,12）包围。为了保护外壳免受过载情况下发生的电弧的影响，在模块内部设置至少在壳体壁和半导体元件之间的某些点处布置的耐高温绝缘体。绝缘体可围绕半导体元件作为中空圆筒。

2. 发明授权

US08018064B2 Arrangement including a semiconductor device and a connecting element 有权
标题翻译：包括半导体器件和连接元件的布置
公开(公告)号：US08018064B2
公开(公告)日：2011-09-13
申请号：US11756110
申请日：2007-05-31
申请人： Uwe Kellner-Werdehausen , Reiner Barthelmess , Hans-Joachim Schulze , Heinrich Gerstenkoeper , Ralf Joerke
发明人： Uwe Kellner-Werdehausen , Reiner Barthelmess , Hans-Joachim Schulze , Heinrich Gerstenkoeper , Ralf Joerke
IPC分类号： H01L23/52 , H01L21/60
CPC分类号： H01L23/051 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/1301 , H01L2924/14 , H01L2924/351 , H01L2924/00
摘要： An integrated circuit and an arrangement including a semiconductor device and a connecting element and method for producing such an arrangement is disclosed. One embodiment provides a semiconductor element having a first contact face and a second contact face. The first contact face and the second contact face extend in a first lateral direction. An electrically conductive connecting element which has a third contact face electrically contacts the semiconductor element. The connecting element includes a trench system. A first trench of this trench system extends from the third contact face into the connecting element.
摘要翻译：公开了一种集成电路和包括半导体器件和连接元件的布置及其制造方法。一个实施例提供了具有第一接触面和第二接触面的半导体元件。第一接触面和第二接触面在第一横向延伸。导电连接元件，其具有与半导体元件电接触的第三接触面。连接元件包括沟槽系统。该沟槽系统的第一沟槽从第三接触面延伸到连接元件。

3. 发明授权

US06943418B2 Insulating element 有权
标题翻译：绝缘元件
公开(公告)号：US06943418B2
公开(公告)日：2005-09-13
申请号：US10372988
申请日：2003-02-24
申请人： Elmar Krause , Heinrich Gerstenkoeper , Werner Struwe
发明人： Elmar Krause , Heinrich Gerstenkoeper , Werner Struwe
IPC分类号： H01L23/48 , H01L29/82 , H01L29/00
CPC分类号： H01L24/72 , H01L2924/01005 , H01L2924/01013 , H01L2924/01019 , H01L2924/01033 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/1301 , H01L2924/13055 , H01L2924/00
摘要： An insulating element insulates a contact area of an electronic component from other contact areas of the component. In order to ensure an assembly that is as trouble-free as possible as well as a trouble-free operation, the insulation element has at least on a first section, which is accommodated inside a contact recess of a contact during operation, is provided with an outer contour that enables an accommodation with the utmost smallest amount of play inside the contact recess.
摘要翻译：绝缘元件将电子部件的接触区域与部件的其它接触区域绝缘。为了确保尽可能无故障的组装以及无故障的操作，绝缘元件至少在操作期间容纳在触点的接触凹部内的第一部分上设置有第一部分能够在接触凹部内容纳最小的游隙的外轮廓。

4. 发明申请

US20080296774A1 ARRANGEMENT INCLUDING A SEMICONDUCTOR DEVICE AND A CONNECTING ELEMENT 有权
标题翻译：包括半导体器件和连接元件的布置
公开(公告)号：US20080296774A1
公开(公告)日：2008-12-04
申请号：US11756110
申请日：2007-05-31
申请人： Uwe Kellner-Werdehausen , Reiner Barthelmess , Hans-Joachim Schulze , Heinrich Gerstenkoeper , Ralf Joerke
发明人： Uwe Kellner-Werdehausen , Reiner Barthelmess , Hans-Joachim Schulze , Heinrich Gerstenkoeper , Ralf Joerke
IPC分类号： H01L23/52 , H01L21/60
CPC分类号： H01L23/051 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/1301 , H01L2924/14 , H01L2924/351 , H01L2924/00
摘要： An integrated circuit and an arrangement including a semiconductor device and a connecting element and method for producing such an arrangement is disclosed. One embodiment provides a semiconductor element having a first contact face and a second contact face. The first contact face and the second contact face extend in a first lateral direction. An electrically conductive connecting element which has a third contact face electrically contacts the semiconductor element. The connecting element includes a trench system. A first trench of this trench system extends from the third contact face into the connecting element.
摘要翻译：公开了一种集成电路和包括半导体器件和连接元件的布置及其制造方法。一个实施例提供了具有第一接触面和第二接触面的半导体元件。第一接触面和第二接触面在第一横向延伸。导电连接元件，其具有与半导体元件电接触的第三接触面。连接元件包括沟槽系统。该沟槽系统的第一沟槽从第三接触面延伸到连接元件。

5. 发明申请

US20060038268A1 Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：US20060038268A1
公开(公告)日：2006-02-23
申请号：US11206887
申请日：2005-08-18
申请人： Detlef Scholz , Heinrich Gerstenkoeper
发明人： Detlef Scholz , Heinrich Gerstenkoeper
IPC分类号： H01L23/02 , H01L23/24 , H01L23/04 , H01L23/20
CPC分类号： H01L23/051 , H01L23/3185 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： Disclosed is a semiconductor module comprising a semiconductor element (1) and two terminal electrodes (3a, 3b, 3c) between which the semiconductor element (1) is disposed and with which the semiconductor element (1) is contacted in an electrically conducting manner. The semiconductor element (1) is surrounded by an at least partly electrically insulating housing (5, 7, 11, 12). In order to protect the housing from the effect of electric arcs occurring in the event of an overload, a high temperature-resistant insulator which is arranged at least at some points between a housing wall and the semiconductor element is provided inside the module. The insulator can surround the semiconductor element as a hollow cylinder.
摘要翻译：公开了一种半导体模块，其包括半导体元件（1）和两个端子电极（3a，3b，3c），在所述半导体元件（1）之间设置有半导体元件（1），半导体元件（1）进行方式半导体元件（1）由至少部分电绝缘的壳体（5,7,11,12）包围。为了保护外壳免受过载情况下发生的电弧的影响，在模块内部设置至少在壳体壁和半导体元件之间的某些点处布置的耐高温绝缘体。绝缘体可围绕半导体元件作为中空圆筒。

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