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21. 发明授权

US06338667B2 System for real-time control of semiconductor wafer polishing 有权
公开(公告)号：US06338667B2
公开(公告)日：2002-01-15
申请号：US09752217
申请日：2000-12-28
申请人： Gurtej S. Sandhu , Trung Tri Doan
发明人： Gurtej S. Sandhu , Trung Tri Doan
IPC分类号： B24B4900
CPC分类号： B24B37/107 , B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/015 , B24B37/12 , B24B37/205 , B24B49/003 , B24B49/02 , B24B49/04 , B24B49/10 , B24B49/12 , B24B57/02 , G05B19/404 , G05B2219/34403 , G05B2219/37398 , G05B2219/37602 , G05B2219/45026 , G05B2219/45199 , G05B2219/45232 , G05B2219/49052 , G05B2219/49057
摘要： A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and a controller selectively adjusting one of a plurality of adjustable polishing parameters during polishing of the wafer.

22. 发明申请

US20010016466A1 System for real-time control of semiconductor wafer polishing 有权
公开(公告)号：US20010016466A1
公开(公告)日：2001-08-23
申请号：US09838298
申请日：2001-04-18
发明人： Gurtej S. Sandhu , Trung Tri Doan
IPC分类号： B24B049/00 , B24B001/00 , B24B051/00
CPC分类号： B24B37/107 , B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/015 , B24B37/12 , B24B37/205 , B24B49/003 , B24B49/02 , B24B49/04 , B24B49/10 , B24B49/12 , B24B57/02 , G05B19/404 , G05B2219/34403 , G05B2219/37398 , G05B2219/37602 , G05B2219/45026 , G05B2219/45199 , G05B2219/45232 , G05B2219/49052 , G05B2219/49057
摘要： A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and a controller selectively adjusting one of a plurality of adjustable polishing parameters during polishing of the wafer.

23. 发明授权

US6120347A System for real-time control of semiconductor wafer polishing 有权
公开(公告)号：US6120347A
公开(公告)日：2000-09-19
申请号：US181433
申请日：1998-10-28
申请人： Gurtej S. Sandhu , Trung Tri Doan
发明人： Gurtej S. Sandhu , Trung Tri Doan
IPC分类号： B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/015 , B24B37/10 , B24B37/12 , B24B37/20 , B24B49/00 , B24B49/02 , B24B49/04 , B24B49/10 , B24B49/12 , B24B49/14 , B24B57/02 , G05B19/404
CPC分类号： B24B37/107 , B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/015 , B24B37/12 , B24B37/205 , B24B49/003 , B24B49/02 , B24B49/04 , B24B49/10 , B24B49/12 , B24B57/02 , G05B19/404 , G05B2219/34403 , G05B2219/37398 , G05B2219/37602 , G05B2219/45026 , G05B2219/45199 , G05B2219/45232 , G05B2219/49052 , G05B2219/49057
摘要： A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and a controller selectively adjusting one of a plurality of adjustable polishing parameters during polishing of the wafer.

24. 发明授权

US5486129A System and method for real-time control of semiconductor a wafer polishing, and a polishing head 失效
标题翻译：用于半导体晶片抛光的实时控制的系统和方法以及抛光头
公开(公告)号：US5486129A
公开(公告)日：1996-01-23
申请号：US112759
申请日：1993-08-25
申请人： Gurtej S. Sandhu , Trung T. Doan
发明人： Gurtej S. Sandhu , Trung T. Doan
IPC分类号： B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/12 , B24B37/20 , B24B49/02 , B24B49/04 , B24B49/10 , B24B49/12 , B24B49/14 , B24B57/02 , G05B19/404 , B24B49/00
CPC分类号： B24B37/205 , B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/12 , B24B49/12 , G05B19/404 , G05B2219/34403 , G05B2219/37398 , G05B2219/37602 , G05B2219/45199 , G05B2219/45232 , G05B2219/49052 , G05B2219/49057
摘要： A system for polishing a semiconductor wafer includes a rotatable platen subassembly and a drive mechanism coupled to rotate the platen subassembly at a platen velocity. A polishing head supports and holds a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face whereby individual regions of the wafer face have different polishing rates. The polishing head includes pressure applicators for applying various localized pressures on the individual regions of the semiconductor wafer to conform the wafer face to a selected contour. The system also includes a polish control subsystem for monitoring in situ the polishing rates at various regions of the semiconductor wafer. The polish control subsystem adjusts in situ the platen velocity and/or the individual localized pressures applied to the semiconductor wafer to change the polishing rates of the individual regions of the semiconductor wafer. The system can also be adapted to change other operational parameters, such as wafer velocity, wafer polishing path across the platen, slurry composition and flow rate (for CMP processes), and force applied to the wafer when contacting the platen. A method for polishing a semiconductor wafer is also described.
摘要翻译：用于抛光半导体晶片的系统包括可旋转压板子组件和联接成以压板速度旋转压板子组件的驱动机构。抛光头支撑并保持与压板子组件接触的半导体晶片的表面以抛光晶片表面，从而晶片表面的各个区域具有不同的抛光速率。抛光头包括用于在半导体晶片的各个区域上施加各种局部压力的压力施加器，以使晶片面与选定的轮廓一致。该系统还包括一个抛光控制子系统，用于原位监测半导体晶片各个区域的抛光速率。抛光控制子系统原位调整压板速度和/或施加到半导体晶片的各个局部压力，以改变半导体晶片的各个区域的抛光速率。该系统还可以适于改变其他操作参数，例如晶圆速度，横跨压板的晶片抛光路径，浆料组成和流速（对于CMP工艺），以及当接触压板时施加到晶片上的力。还描述了用于抛光半导体晶片的方法。

25. 发明授权

US4186529A Programmably controlled method for grinding end cutting tools and the like 失效
标题翻译：用于研磨端铣刀等的可编程控制方法
公开(公告)号：US4186529A
公开(公告)日：1980-02-05
申请号：US896987
申请日：1978-04-17
申请人： Stanley E. Huffman
发明人： Stanley E. Huffman
IPC分类号： B23Q11/10 , B24B3/02 , G05B19/18 , G05B19/404 , B24B1/00
CPC分类号： B23Q11/10 , B24B3/02 , G05B19/186 , G05B19/404 , G05B2219/33099 , G05B2219/34465 , G05B2219/37251 , G05B2219/45159 , G05B2219/45161 , G05B2219/49052 , G05B2219/49244 , G05B2219/50015 , G05B2219/50313 , G05B2219/50334 , G05B2219/50335
摘要： Disclosed is a numerically controlled method of broad application but particularly useful for grinding cutting edges and clearance surfaces on cutting tools such as end mills and other similar tools. A programmable numerical servo-motor type control is described. All of the grinding operations are completed at a single station in a series of consecutive grinding operations performed by the same grinding wheel and during which the tool remains in the same work holder. The various cutting edges and clearance surfaces to be ground are both mathematically located and mathematically defined such that the grinding operations may be conducted under numerical control according to optimum wheel speed, feed, position and coolant conditions and with a wide range of independently and simultaneously movable axes. A grinding wheel wear compensation program and a coolant dispensing program are also numerically controlled in coordination with the grinding operations.
摘要翻译：公开了一种广泛应用的数控方法，但特别适用于在诸如立铣刀和其它类似工具的切削工具上研磨切削刃和间隙表面。描述了可编程数字伺服电机类型控制。所有的磨削操作都是在单个工位上完成的，这些磨削过程是由相同的砂轮进行的一系列连续磨削操作完成的，在此期间刀具保持在相同的工件支架中。要研磨的各种切削刃和间隙表面都在数学上定位和数学上定义，使得磨削操作可以根据最佳车轮速度，进给，位置和冷却剂条件在数值控制下进行，并且具有宽范围的独立且可同时移动的轴。砂轮磨损补偿程序和冷却剂分配程序也与磨削操作协调进行数值控制。

26. 发明授权

US4115956A Programmably controlled machine for grinding end cutting tools and the like 失效
标题翻译：可编程控制的机床用于研磨端铣刀等
公开(公告)号：US4115956A
公开(公告)日：1978-09-26
申请号：US810776
申请日：1977-06-28
申请人： Stanley E. Huffman
发明人： Stanley E. Huffman
IPC分类号： B23Q11/10 , B24B3/02 , G05B19/18 , G05B19/404 , B24B3/08
CPC分类号： B23Q11/10 , B24B3/02 , G05B19/186 , G05B19/404 , G05B2219/33099 , G05B2219/34465 , G05B2219/37251 , G05B2219/45159 , G05B2219/45161 , G05B2219/49052 , G05B2219/49244 , G05B2219/50015 , G05B2219/50313 , G05B2219/50334 , G05B2219/50335
摘要： Disclosed is a numerically controlled machine and method of broad application but particularly useful for grinding cutting edges and clearance surfaces on cutting tools such as end mills and other similar tools. A programmable numerical servo-motor type control is described. All of the grinding operations are completed at a single station in a series of consecutive grinding operations performed by the same grinding wheel and during which the tool remains in the same work holder. The various cutting edges and clearance surfaces to be ground are both mathematically located and mathematically defined such that the grinding operations may be conducted under numerical control according to optimum wheel speed, feed, position and coolant conditions and with a wide range of independently and simultaneously movable axes. A grinding wheel wear compensation program and a coolant dispensing program are also numerically controlled in coordination with the grinding operations.
摘要翻译：公开了一种广泛应用的数控机器和方法，但是特别适用于在诸如端铣刀和其它类似工具的切削工具上研磨切削刃和间隙表面。描述了可编程数字伺服电机类型控制。所有的磨削操作都是在单个工位上完成的，这些磨削过程是由相同的砂轮进行的一系列连续磨削操作完成的，在此期间刀具保持在相同的工件支架中。要研磨的各种切削刃和间隙表面都在数学上定位和数学上定义，使得磨削操作可以根据最佳车轮速度，进给，位置和冷却剂条件在数值控制下进行，并且具有宽范围的独立且可同时移动的轴。砂轮磨损补偿程序和冷却剂分配程序也与磨削操作协调进行数值控制。

27. 发明申请

US20170139432A1 CONTROLLER WITH COOLANT MONITORING FUNCTION 审中-公开
公开(公告)号：US20170139432A1
公开(公告)日：2017-05-18
申请号：US15334259
申请日：2016-10-25
申请人： FANUC CORPORATION
发明人： Takahiro ENDOU
IPC分类号： G05D23/19 , G05D23/275
CPC分类号： G05D23/1917 , B23Q11/10 , B23Q17/007 , G05B19/404 , G05B2219/49052 , G05B2219/50324 , G05D23/1927 , G05D23/275
摘要： A controller for controlling a machine includes a coolant monitoring function. The controller generates and records history information in which the measurement values of a state of a coolant are associated with time information on the time when the measurement values are measured. Then, a rate of change in a measurement value for a state of the coolant is calculated based on the recorded history information, and a state of the coolant and a countermeasure therefore are determined based on the calculated rate of change in the measurement value.

28. 发明申请

US20150248123A1 NUMERICAL CONTROL DEVICE PROVIDED WITH HEAT RADIATION CHARACTERISTIC ESTIMATION PART 审中-公开
标题翻译：具有热辐射特性估计的数值控制装置
公开(公告)号：US20150248123A1
公开(公告)日：2015-09-03
申请号：US14635461
申请日：2015-03-02
申请人： FANUC CORPORATION
发明人： Junichi TEZUKA , Hajime OGAWA
IPC分类号： G05B19/18 , G05D23/19
CPC分类号： G05B19/18 , G05B19/406 , G05B2219/37429 , G05B2219/49052 , G05D23/19 , H02P29/60
摘要： A numerical control device, in a motor drive system which drives a motor part which has a cooling fan motor and is provided with the numerical control device to drive the motor part, which acquires the temperature of the component elements of the motor part from the temperature detectors, ambient temperature, input energy to the component elements, and output energy from the component elements, estimates the heat radiation characteristic of the component elements from the data of the temperature of the component elements, ambient temperature, and input/output energy, compares the estimated value of the heat radiation characteristic of the component elements with a normal value, judges that the cooling fan motor is abnormal when the heat radiation characteristic is below the normal value, and thereby prevents trouble due to overheating of the component elements of the motor part.
摘要翻译：一种数字控制装置，在驱动具有冷却风扇电动机的电动机部件的电动机驱动系统中，设置有用于驱动电动机部件的数控装置，该电动机部件从电动机部件的温度获取电动机部件的温度检测器，环境温度，组成元件的输入能量和来自组件元件的输出能量，根据元件元件的温度，环境温度和输入/输出能量的数据估计组件元件的散热特性，比较当正常值的成分元件的散热特性的估计值判断为当散热特性低于正常值时冷却风扇电机异常，从而防止由于电动机的元件过热引起的故障部分。

29. 发明授权

US08934998B1 Method and apparatus for delivery of minimum quantity lubrication 有权
标题翻译：用于输送最少量润滑的方法和装置
公开(公告)号：US08934998B1
公开(公告)日：2015-01-13
申请号：US13216386
申请日：2011-08-24
申请人： Charles W. Boelkins , Kevin M. Varnes
发明人： Charles W. Boelkins , Kevin M. Varnes
IPC分类号： G06F19/00
CPC分类号： B23Q11/1046 , G05B2219/49052 , Y02P70/169
摘要： A method for controlling the flow of a minimum quantity lubricant (MQL) system to a computer numerical controlled (CNC) machining system.
摘要翻译：一种用于控制最小量润滑剂（MQL）系统流向计算机数控（CNC）加工系统的方法。

30. 发明申请

US20020034922A1 System for real-time control of semiconductor wafer polishing 有权
公开(公告)号：US20020034922A1
公开(公告)日：2002-03-21
申请号：US09993010
申请日：2001-11-14
发明人： Gurtej S. Sandhu , Trung Tri Doan
IPC分类号： B24B049/00
CPC分类号： B24B37/107 , B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/015 , B24B37/12 , B24B37/205 , B24B49/003 , B24B49/02 , B24B49/04 , B24B49/10 , B24B49/12 , B24B57/02 , G05B19/404 , G05B2219/34403 , G05B2219/37398 , G05B2219/37602 , G05B2219/45026 , G05B2219/45199 , G05B2219/45232 , G05B2219/49052 , G05B2219/49057
摘要： A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and a controller selectively adjusting one of a plurality of adjustable polishing parameters during polishing of the wafer.

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