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    • 21. 发明授权
    • Method of manufacturing a semiconductor device capable of reducing contact resistance
    • 制造能够降低接触电阻的半导体器件的方法
    • US06277738B1
    • 2001-08-21
    • US09618271
    • 2000-07-18
    • Hyung Bok ChoiChang Seo ParkHyeon Soo Kim
    • Hyung Bok ChoiChang Seo ParkHyeon Soo Kim
    • H01L2144
    • H01L21/76802H01L21/31116H01L21/32134H01L21/76838
    • The present invention relates to a method of manufacturing a semiconductor device, which is capable of effectively removing a WO3 film generated on a tungsten silicide during contact hole etch that opens a gate electrode including the tungsten silicide as its top film by selectively etching a interlayer insulating film. The WO3 film is removed by a washing process using an alkaline solution such as TMAH(tetra-methyl-ammonium-hydroxide) or NH4OH solution. The effective removal of the WO3 film reduces the contact resistance between a conductive material layer to be formed in the contact hole by a later process and the gate electrode, thereby improving the operative characteristics of the semiconductor device. TMAH solution used in the washing process has a high selectivity of WO3 film relative to a thermal oxide film or a BPSG film that is generally used as the interlayer insulating film. Thus, the present invention is capable of minimizing the damage of the side parts of the interlayer insulating film during the washing process after contact etching.
    • 本发明涉及一种制造半导体器件的方法,其能够有效地去除在接触孔蚀刻期间在硅化钨上产生的WO 3膜,其通过选择性地蚀刻层间绝缘来打开包括硅化钨作为其顶部膜的栅电极 电影。 通过使用碱性溶液如TMAH(四甲基氢氧化铵)或NH 4 OH溶液的洗涤方法除去WO 3膜。 WO3膜的有效去除减少了通过后续工艺在接触孔中形成的导电材料层与栅电极之间的接触电阻,从而提高了半导体器件的操作特性。 在洗涤过程中使用的TMAH溶液相对于通常用作层间绝缘膜的热氧化膜或BPSG膜具有高选择性的WO 3膜。 因此,本发明能够最小化接触蚀刻后的洗涤工序中的层间绝缘膜的侧面部分的损伤。
    • 23. 发明申请
    • METHODS FOR FABRICATING INTEGRATED CIRCUITS
    • 制作集成电路的方法
    • US20130217204A1
    • 2013-08-22
    • US13399674
    • 2012-02-17
    • Chang Seo Park
    • Chang Seo Park
    • H01L21/762H01L21/20
    • H01L21/823431H01L21/76232H01L21/76283H01L29/7853
    • Methods are provided for forming semiconductor devices. One method includes forming a first layer overlying a bulk semiconductor substrate. A second layer is formed overlying the first layer. A first plurality of trenches is etched into the first and second layers. The first plurality of trenches is filled to form a plurality of support structures. A second plurality of trenches is etched into the first and second layers. Portions of the second layer disposed between adjacent trenches of the first and second pluralities of trenches define a plurality of fins. The first layer is etched to form gap spaces between the bulk semiconductor substrate and the plurality of fins. The plurality of fins is supported in position adjacent to the gap spaces by the plurality of support structures. The gap spaces are filled with an insulating material.
    • 提供了形成半导体器件的方法。 一种方法包括形成覆盖体半导体衬底的第一层。 第二层形成在第一层上。 第一多个沟槽被蚀刻到第一层和第二层中。 第一多个沟槽被填充以形成多个支撑结构。 第二多个沟槽被蚀刻到第一层和第二层中。 设置在第一和第二多个沟槽的相邻沟槽之间的第二层的部分限定多个鳍。 蚀刻第一层以在体半导体衬底和多个鳍之间形成间隙。 多个翅片通过多个支撑结构支撑在与间隙空间相邻的位置。 间隙空间填充绝缘材料。
    • 30. 发明授权
    • Method of manufacturing a semiconductor device capable of reducing
contact resistance
    • 制造能够降低接触电阻的半导体器件的方法
    • US6114241A
    • 2000-09-05
    • US338525
    • 1999-06-23
    • Hyung Bok ChoiChang Seo ParkHyeon Soo Kim
    • Hyung Bok ChoiChang Seo ParkHyeon Soo Kim
    • H01L21/768H01L21/44
    • H01L21/76814
    • The present invention relates to a method of manufacturing a semiconductor device, which is capable of effectively removing a WO.sub.3 film generated on a tungsten silicide during contact hole etch that opens a gate electrode including the tungsten silicide as its top film by selectively etching a interlayer insulating film. The WO.sub.3 film is removed by a washing process using an alkaline solution such as TMAH(tetra-methyl-ammonium-hydroxide) or NH.sub.4 OH solution. The effective removal of the WO.sub.3 film reduces the contact resistance between a conductive material layer to be formed in he contact hole by a later process and the gate electrode, thereby improving the operative characteristics of the semiconductor device. TMAH solution used in the washing process has a high selectivity of WO.sub.3 film relative to a thermal oxide film or a BPSG film that is generally used as the interlayer insulating film. Thus, the present invention is capable of minimizing the damage of the side parts of the interlayer insulating film during the washing process after contact etching.
    • 本发明涉及一种制造半导体器件的方法,该方法能够有效地除去在接触孔蚀刻期间在硅化钨上产生的WO 3膜,其通过选择性地蚀刻层间绝缘体来打开包括硅化钨作为其顶部膜的栅电极 电影。 通过使用碱性溶液如TMAH(四甲基氢氧化铵)或NH 4 OH溶液的洗涤方法除去WO 3膜。 WO3膜的有效去除通过后续工艺在接触孔中形成的导电材料层与栅电极之间的接触电阻降低,从而提高半导体器件的操作特性。 在洗涤过程中使用的TMAH溶液相对于通常用作层间绝缘膜的热氧化膜或BPSG膜具有高选择性的WO 3膜。 因此,本发明能够最小化接触蚀刻后的洗涤工序中的层间绝缘膜的侧面部分的损伤。