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21. 发明申请

US20050274622A1 Plating chemistry and method of single-step electroplating of copper on a barrier metal 审中-公开
标题翻译：电镀化学和铜在屏障金属上的单步电镀方法
公开(公告)号：US20050274622A1
公开(公告)日：2005-12-15
申请号：US11012965
申请日：2004-12-15
申请人： Zhi-Wen Sun , Renren He , Nicolay Kovarsky , You Wang
发明人： Zhi-Wen Sun , Renren He , Nicolay Kovarsky , You Wang
IPC分类号： C25D3/00 , C25D3/38 , C25D5/18 , C25D5/34 , C25D7/12 , H01L21/288 , H01L21/768
CPC分类号： H01L21/76873 , C25D3/38 , C25D5/18 , C25D5/34 , C25D7/123 , H01L21/2885 , H01L21/76843 , H01L21/76864
摘要： Embodiments of a method of copper plating a substrate surface with a group VIII metal layer have been described. In one embodiment, a method of plating copper on a substrate surface with a group VIII metal layer comprises pre-treating the substrate surface by removing a group VIII metal surface oxide layer and/or surface contaminants and plating the substrate in a copper plating solution comprising about 50 g/l to about 300 g/l of sulfuric acid at an initial plating current higher than the critical current density to deposit a continuous copper layer on the substrate surface. The Pre-treating the substrate can be accomplished by annealing the substrate in an environment with a hydrogen-containing gas environment and/or a non-reactive gas(es) to Ru, by a cathodic treatment in an acid-containing bath, or by immersing the substrate in an acid-containing bath.
摘要翻译：已经描述了用VIII族金属层对基板表面进行镀铜的方法的实施例。在一个实施例中，在基板表面上用第VIII族金属层电镀铜的方法包括通过去除第VIII族金属表面氧化物层和/或表面污染物并将该基板镀在包括约50g / l至约300g / l的硫酸，其初始电镀电流高于临界电流密度，以在衬底表面上沉积连续的铜层。通过在含酸浴中进行阴极处理，或通过在含酸浴中进行阴极处理，可以通过在具有含氢气体环境和/或非反应性气体的Ru的环境中对基底进行退火来实现基底的预处理将基板浸入含酸浴中。

22. 发明授权

US5582654A Method for creating a corrosion-resistant surface on aluminum alloys having a high copper content 失效
标题翻译：在具有高铜含量的铝合金上形成耐腐蚀表面的方法
公开(公告)号：US5582654A
公开(公告)日：1996-12-10
申请号：US247147
申请日：1994-05-20
申请人： Florian B. Mansfeld , You Wang , Simon H. Lin
发明人： Florian B. Mansfeld , You Wang , Simon H. Lin
IPC分类号： C25D11/06 , C25F3/04 , C25F3/06 , C23C22/50
CPC分类号： C23F1/00 , C23C22/68 , C23C22/78 , C25D11/06 , C25F3/04 , C25F3/06
摘要： A method for treating the surface of aluminum alloys having a relatively high copper content is provided which includes the steps of removing substantially all of the copper from the surface, contacting the surface with a first solution containing cerium, electrically charging the surface while contacting the surface in an aqueous molybdate solution, and contacting the surface with a second solution containing cerium. The copper is substantially removed from the surface in the first step either by (i) contacting the surface with an acidic chromate solution or by (ii) contacting the surface with an acidic nitrate solution while subjecting the surface to an electric potential. The corrosion-resistant surface resulting from the invention is excellent, consistent and uniform throughout the surface. Surfaces treated by the invention may often be certified for use in salt-water services.
摘要翻译：提供了一种用于处理铜含量相对较高的铝合金表面的方法，其包括从表面去除基本上所有的铜的步骤，使表面与含有铈的第一溶液接触，同时使表面接触，同时接触表面在钼酸水溶液中，并使表面与含有铈的第二溶液接触。通过（i）使表面与酸性铬酸盐溶液接触或（ii）使表面与酸性硝酸盐溶液接触，同时使表面经受电位，铜在第一步骤中基本上从表面除去。由本发明产生的耐腐蚀表面在整个表面上是优异的，一致的和均匀的。通过本发明处理的表面通常可以被认证用于盐水服务。

23. 发明授权

US09040738B2 Intermediate compounds of tamiflu, methods of preparation and uses thereof 有权
标题翻译：塔米夫的中间体化合物，其制备方法和用途
公开(公告)号：US09040738B2
公开(公告)日：2015-05-26
申请号：US14123870
申请日：2010-12-17
申请人： Dawei Ma , Shaolin Zhu , Shouyun Yu , You Wang , Qianghui Zhou
发明人： Dawei Ma , Shaolin Zhu , Shouyun Yu , You Wang , Qianghui Zhou
IPC分类号： C07C205/00 , C07C319/12 , C07C233/31 , C07C271/18 , C07D209/48 , C07D213/73 , C07D401/04 , C07D403/04 , C07C227/14 , C07C227/16 , C07C229/66 , C07D207/14 , C07C323/61
CPC分类号： C07C319/12 , C07B2200/07 , C07C227/14 , C07C227/16 , C07C229/66 , C07C233/31 , C07C271/18 , C07C323/61 , C07C2601/14 , C07C2601/16 , C07D207/14 , C07D209/48 , C07D213/73 , C07D401/04 , C07D403/04
摘要： Chiral amino compounds, methods of preparation and uses thereof. Tamiflu can be obtained from the said compounds. Multi-substituted chiral tetrahydropyrrolyl amine which can be used as intermediate compounds of medicament can also be produced by the said compounds.
摘要翻译：手性氨基化合物，其制备方法及其应用。可以从所述化合物获得达菲。可以用作药物的中间体化合物的多取代手性四氢吡咯胺也可以由所述化合物制备。

24. 发明授权

US07576007B2 Method for electrochemically mechanically polishing a conductive material on a substrate 失效
标题翻译：在基板上进行电化学机械研磨导电材料的方法
公开(公告)号：US07576007B2
公开(公告)日：2009-08-18
申请号：US11328958
申请日：2006-01-09
申请人： You Wang , Zhihong Wang , Renhe Jia , Stan D. Tsai , Yongqi Hu
发明人： You Wang , Zhihong Wang , Renhe Jia , Stan D. Tsai , Yongqi Hu
IPC分类号： H01L21/302
CPC分类号： H01L21/7684 , B23H5/08 , H01L21/32125
摘要： Aspects of the present invention include a method and an apparatus that may be utilized to reduce dishing and improve cleaning efficiency of a material layer residue (e.g., copper residual) by varying a substrate potential in a substrate processing system. For example, by utilizing multiple polishing steps and applying different voltages (e.g., while a substrate is being in a polishing station), ECMP can be used to effectively reduce dishing and it can be used to enhance copper residual cleaning as well as minimizing a possibility of arcing, which can occur at the end of the polishing process, when a substrate is moved from a polishing station.
摘要翻译：本发明的方面包括可以通过改变衬底处理系统中的衬底电位来减少凹陷并提高材料层残留物（例如铜残留物）的清洁效率的方法和装置。例如，通过利用多个抛光步骤和施加不同的电压（例如，当衬底处于抛光站中时），ECMP可以用于有效地减少凹陷，并且可以用于增强铜残留清洁以及最小化可能性当抛光工位移动基板时，可能在抛光过程结束时发生电弧。

25. 发明申请

US20080035474A1 APPARATUS FOR ELECTROPROCESSING A SUBSTRATE WITH EDGE PROFILE CONTROL 审中-公开
标题翻译：用于电镀具有边缘型材控制的基板的装置
公开(公告)号：US20080035474A1
公开(公告)日：2008-02-14
申请号：US11877356
申请日：2007-10-23
申请人： You Wang , Jie DIAO , Stan TSAI , Lakshmanan Karuppiah
发明人： You Wang , Jie DIAO , Stan TSAI , Lakshmanan Karuppiah
IPC分类号： C25B9/00
CPC分类号： B23H5/08 , C25D17/10 , C25D17/12 , C25D21/12
摘要： Embodiments of the invention generally provide methods and apparatuses for electroprocessing a substrate. In one embodiment, an apparatus for electrochemically processing the substrate includes a conductive processing surface adapted for processing a substrate thereon, and a polishing head for retaining the substrate against the processing surface. At least one drive mechanism provides relative motion between the conductive processing surface and the substrate. A first electrode is disposed below the conductive processing surface and is comprised of a first material. A second electrode is disposed radially inward of the first electrode and comprised of a second material.
摘要翻译：本发明的实施方案通常提供用于对基底进行电处理的方法和装置。在一个实施例中，用于电化学处理衬底的装置包括适于在其上处理衬底的导电处理表面和用于将衬底保持在处理表面上的抛光头。至少一个驱动机构在导电处理表面和基底之间提供相对运动。第一电极设置在导电处理表面下方并且由第一材料构成。第二电极设置在第一电极的径向内侧并由第二材料构成。

26. 发明申请

US20080020682A1 Method for conditioning a polishing pad 审中-公开
标题翻译：调整抛光垫的方法
公开(公告)号：US20080020682A1
公开(公告)日：2008-01-24
申请号：US11490883
申请日：2006-07-21
申请人： Renhe Jia , Jie Diao , You Wang , Stan Tsai , Jim Atkinson , Lakshmanan Karuppiah , Liang-Yuh Chen
发明人： Renhe Jia , Jie Diao , You Wang , Stan Tsai , Jim Atkinson , Lakshmanan Karuppiah , Liang-Yuh Chen
IPC分类号： B24B1/00
CPC分类号： B24B53/017
摘要： A method of conditioning processing pads increases the removal rate of conductive material from a substrate surface during polishing. In this method, the direction of rotation of the processing pad relative to the conditioning disc during conditioning is opposite the direction of rotation of the processing pad relative to the substrate during polishing.
摘要翻译：调整处理垫的方法在抛光期间增加导电材料从衬底表面的去除速率。在这种方法中，处理衬垫相对于调理盘在调节期间的旋转方向与抛光期间相对于衬底相对于处理垫的旋转方向。

27. 发明申请

US20070181442A1 Method and apparatus for foam removal in an electrochemical mechanical substrate polishing process 审中-公开
标题翻译：在电化学机械衬底抛光过程中泡沫去除的方法和装置
公开(公告)号：US20070181442A1
公开(公告)日：2007-08-09
申请号：US11346891
申请日：2006-02-03
申请人： Renhe Jia , Jie Diao , You Wang , Stan Tsai , Lakshmanan Karuppiah
发明人： Renhe Jia , Jie Diao , You Wang , Stan Tsai , Lakshmanan Karuppiah
IPC分类号： B23H7/00
CPC分类号： B23H5/08 , B24B53/001 , B24B53/017 , C25F7/00
摘要： The embodiments of the invention generally relate to a method and apparatus for processing a substrate where reduced defect formation is desired. Embodiments of the invention may be beneficially practiced in chemical mechanical polishing and electrochemical mechanical polishing processes, among other processes where reduction in defect formation due to foam formation is desired. In one embodiment, a processing system for planarizing a substrate is provided that includes a platen, a pad disposed on the platen, a carrier head configured to retain the substrate against the pad while contacting an electronically conductive processing solution; and a foam removal assembly. The foam removal assembly is configured to remove foam from the electrically conductive processing solution, wherein a gap exists between a surface of the electrically conductive processing solution and a bottom edge of the foam removal assembly.
摘要翻译：本发明的实施例一般涉及用于处理需要减少缺陷形成的衬底的方法和装置。在化学机械抛光和电化学机械抛光工艺中，本发明的实施例以及其它需要减少形成泡沫的缺陷形成工艺也是有益的。在一个实施例中，提供了一种用于平坦化衬底的处理系统，其包括压板，设置在压板上的衬垫，构造成在接触电子导电处理溶液的同时将衬底保持抵靠衬垫的载体头; 和泡沫去除组件。泡沫去除组件被配置为从导电处理溶液中除去泡沫，其中在导电处理溶液的表面和泡沫去除组件的底部边缘之间存在间隙。

28. 发明申请

US20070151866A1 Substrate polishing with surface pretreatment 审中-公开
标题翻译：基材抛光与表面预处理
公开(公告)号：US20070151866A1
公开(公告)日：2007-07-05
申请号：US11326636
申请日：2006-01-05
申请人： Zhihong Wang , You Wang , Renhe Jia , Stan Tsai
发明人： Zhihong Wang , You Wang , Renhe Jia , Stan Tsai
IPC分类号： B23H9/00 , B23H5/06 , C25F7/00 , B23H7/00
CPC分类号： B23H5/08 , B24B37/042 , C25F3/02
摘要： A method for processing a surface of a substrate is provided. In one embodiment, the method includes pretreating a conductive layer of the substrate by exposing the substrate to a pretreatment fluid, and planarizing the pre-treated substrate in the system.
摘要翻译：提供了一种处理基板表面的方法。在一个实施例中，该方法包括通过将衬底暴露于预处理流体并且对系统中的预处理衬底进行平坦化来预处理衬底的导电层。

29. 发明申请

US20070095677A1 ELECTROCHEMICAL METHOD FOR ECMP POLISHING PAD CONDITIONING 失效
标题翻译：用于ECMP抛光垫调节的电化学方法
公开(公告)号：US20070095677A1
公开(公告)日：2007-05-03
申请号：US11554928
申请日：2006-10-31
申请人： You Wang , Stan Tsai , Lakshmanan Karuppiah , Jie Diao , Renhe Jia , Alpay Yilmaz
发明人： You Wang , Stan Tsai , Lakshmanan Karuppiah , Jie Diao , Renhe Jia , Alpay Yilmaz
IPC分类号： B23H3/00
CPC分类号： B23H5/08 , B24B37/042 , B24B37/046 , B24B53/017 , C25F1/00 , H01L21/32125
摘要： A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the top surface of the pad.
摘要翻译：提供了一种调节Ecmp垫的方法。在一个实施例中，用于电化学处理衬底的方法包括以下步骤：在衬垫组件的顶表面和电极之间提供电偏置电压，以及电化学去除衬垫顶表面的污染物。

30. 发明申请

US20050218010A1 Process and composition for conductive material removal by electrochemical mechanical polishing 失效
标题翻译：通过电化学机械抛光去除导电材料的工艺和组成
公开(公告)号：US20050218010A1
公开(公告)日：2005-10-06
申请号：US11123274
申请日：2005-05-05
申请人： Zhihong Wang , You Wang , Daxin Mao , Renhe Jia , Stan Tsai , Yongqi Hu , Yuan Tian , Liang-Yuh Chen
发明人： Zhihong Wang , You Wang , Daxin Mao , Renhe Jia , Stan Tsai , Yongqi Hu , Yuan Tian , Liang-Yuh Chen
IPC分类号： B23H3/08 , B23H5/08 , C09G1/02 , C25F3/02 , H01L21/321 , H01L21/768
CPC分类号： C25F3/02 , B23H5/08 , C09G1/02 , H01L21/32125 , H01L21/7684
摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.
摘要翻译：提供了用于处理其上设置有导电材料层的基板的组合物和方法。在一个实施方案中，提供了一种用于处理其上设置导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，溶剂和 pH为约3至约10.该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除导电材料层。

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