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1. 发明申请

US20070161250A1 Method for electrochemically mechanically polishing a conductive material on a substrate 失效
标题翻译：在基板上进行电化学机械研磨导电材料的方法
公开(公告)号：US20070161250A1
公开(公告)日：2007-07-12
申请号：US11328958
申请日：2006-01-09
申请人： You Wang , Zhihong Wang , Renhe Jia , Stan Tsai , Yongqi Hu
发明人： You Wang , Zhihong Wang , Renhe Jia , Stan Tsai , Yongqi Hu
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： H01L21/7684 , B23H5/08 , H01L21/32125
摘要： Aspects of the present invention include a method and an apparatus that may be utilized to reduce dishing and improve cleaning efficiency of a material layer residue (e.g., copper residual) by varying a substrate potential in a substrate processing system. For example, by utilizing multiple polishing steps and applying different voltages (e.g., while a substrate is being in a polishing station), ECMP can be used to effectively reduce dishing and it can be used to enhance copper residual cleaning as well as minimizing a possibility of arcing, which can occur at the end of the polishing process, when a substrate is moved from a polishing station.
摘要翻译：本发明的方面包括可以通过改变衬底处理系统中的衬底电位来减少凹陷并提高材料层残留物（例如铜残留物）的清洁效率的方法和装置。例如，通过利用多个抛光步骤和施加不同的电压（例如，当衬底处于抛光站中时），ECMP可以用于有效地减少凹陷，并且可以用于增强铜残留清洁以及最小化可能性当抛光工位移动基板时，可能在抛光过程结束时发生电弧。

2. 发明申请

US20060249394A1 Process and composition for electrochemical mechanical polishing 审中-公开
标题翻译：电化学机械抛光的工艺和组成
公开(公告)号：US20060249394A1
公开(公告)日：2006-11-09
申请号：US11251630
申请日：2005-10-14
申请人： Renhe Jia , You Wang , Zhihong Wang , Jie Diao , Daxin Mao , Stan Tsai , Lakshmanan Karuppiah , Liang-Yuh Chen
发明人： Renhe Jia , You Wang , Zhihong Wang , Jie Diao , Daxin Mao , Stan Tsai , Lakshmanan Karuppiah , Liang-Yuh Chen
IPC分类号： C09K13/00 , B23H9/00 , C25F3/00 , C09K13/06
CPC分类号： C25F3/02 , B23H5/08 , C09K3/1463
摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.
摘要翻译：提供了用于处理其上设置有导电材料层的基板的组合物和方法。在一个实施方案中，提供了一种用于处理其上设置导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，溶剂和 pH为约3至约10.该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除导电材料层。

3. 发明申请

US20070151866A1 Substrate polishing with surface pretreatment 审中-公开
标题翻译：基材抛光与表面预处理
公开(公告)号：US20070151866A1
公开(公告)日：2007-07-05
申请号：US11326636
申请日：2006-01-05
申请人： Zhihong Wang , You Wang , Renhe Jia , Stan Tsai
发明人： Zhihong Wang , You Wang , Renhe Jia , Stan Tsai
IPC分类号： B23H9/00 , B23H5/06 , C25F7/00 , B23H7/00
CPC分类号： B23H5/08 , B24B37/042 , C25F3/02
摘要： A method for processing a surface of a substrate is provided. In one embodiment, the method includes pretreating a conductive layer of the substrate by exposing the substrate to a pretreatment fluid, and planarizing the pre-treated substrate in the system.
摘要翻译：提供了一种处理基板表面的方法。在一个实施例中，该方法包括通过将衬底暴露于预处理流体并且对系统中的预处理衬底进行平坦化来预处理衬底的导电层。

4. 发明申请

US20050218010A1 Process and composition for conductive material removal by electrochemical mechanical polishing 失效
标题翻译：通过电化学机械抛光去除导电材料的工艺和组成
公开(公告)号：US20050218010A1
公开(公告)日：2005-10-06
申请号：US11123274
申请日：2005-05-05
申请人： Zhihong Wang , You Wang , Daxin Mao , Renhe Jia , Stan Tsai , Yongqi Hu , Yuan Tian , Liang-Yuh Chen
发明人： Zhihong Wang , You Wang , Daxin Mao , Renhe Jia , Stan Tsai , Yongqi Hu , Yuan Tian , Liang-Yuh Chen
IPC分类号： B23H3/08 , B23H5/08 , C09G1/02 , C25F3/02 , H01L21/321 , H01L21/768
CPC分类号： C25F3/02 , B23H5/08 , C09G1/02 , H01L21/32125 , H01L21/7684
摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.
摘要翻译：提供了用于处理其上设置有导电材料层的基板的组合物和方法。在一个实施方案中，提供了一种用于处理其上设置导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，溶剂和 pH为约3至约10.该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除导电材料层。

5. 发明申请

US20070153453A1 Fully conductive pad for electrochemical mechanical processing 审中-公开
标题翻译：全导电垫用于电化学机械加工
公开(公告)号：US20070153453A1
公开(公告)日：2007-07-05
申请号：US11327527
申请日：2006-01-05
申请人： You Wang , Renhe Jia , Stan Tsai , Yongqi Hu , Zhihong Wang , Jie Diao , Gerald Alonzo
发明人： You Wang , Renhe Jia , Stan Tsai , Yongqi Hu , Zhihong Wang , Jie Diao , Gerald Alonzo
IPC分类号： H05K5/00 , H05K3/10
CPC分类号： C25F7/00 , B23H5/08 , B24B37/20 , Y10T29/49155 , Y10T29/49156
摘要： Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a plurality of discrete members and a plurality of apertures. Each of the plurality of discrete members include a first conductive layer and a second conductive layer, with an isolation layer therebetween, and a recess for byproduct accumulation. The second conductive layer comprises a plurality of reaction surfaces that are orthogonal to the upper and lower surfaces of the pad assembly.
摘要翻译：提供了用于处理基板的垫组件的实施例。垫组件包括多个分立构件和多个孔。多个离散构件中的每一个包括第一导电层和第二导电层，其间具有隔离层，以及用于副产物积累的凹部。第二导电层包括与焊盘组件的上表面和下表面正交的多个反应表面。

6. 发明申请

US20060249395A1 Process and composition for electrochemical mechanical polishing 审中-公开
标题翻译：电化学机械抛光的工艺和组成
公开(公告)号：US20060249395A1
公开(公告)日：2006-11-09
申请号：US11389867
申请日：2006-03-27
申请人： You Wang , Junzi Zhao , Jie Diao , Renhe Jia , Stan Tsai , Lakshmanan Karuppiah , Robert Ewald
发明人： You Wang , Junzi Zhao , Jie Diao , Renhe Jia , Stan Tsai , Lakshmanan Karuppiah , Robert Ewald
IPC分类号： C09K13/00 , B23H9/00 , B23H3/00
CPC分类号： C09K3/1463 , B23H5/08
摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a leveler a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.
摘要翻译：提供了用于处理其上设置有导电材料层的基板的组合物和方法。在一个实施方案中，提供了一种用于处理其上设置有导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，整理剂，溶剂，并且pH在约3至约10之间。该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除导电材料层。

7. 发明申请

US20070099552A1 CONDUCTIVE PAD WITH ION EXCHANGE MEMBRANE FOR ELECTROCHEMICAL MECHANICAL POLISHING 失效
标题翻译：带有离子交换膜的电化学机械电化学机械抛光
公开(公告)号：US20070099552A1
公开(公告)日：2007-05-03
申请号：US11555145
申请日：2006-10-31
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel Carl , Ralph Wadensweiler , Manoocher Birang , Paul Butterfield , Rashid Mavliev , Stan Tsai , You Wang , Jie Diao , Renhe Jia , Lakshmanan Karuppiah , Robert Ewald
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel Carl , Ralph Wadensweiler , Manoocher Birang , Paul Butterfield , Rashid Mavliev , Stan Tsai , You Wang , Jie Diao , Renhe Jia , Lakshmanan Karuppiah , Robert Ewald
IPC分类号： B23F21/03
CPC分类号： B24B37/046 , B24B27/0023 , B24B37/24 , B24B37/26 , B24D3/34 , B82Y30/00
摘要： An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing surface. An electrode is disposed below the polishing surface having a dielectric material therebetween. A plurality of apertures may be formed in the polishing surface and the dielectric material to at least partially expose the electrode to the polishing surface. A membrane may be disposed between the electrode and the polishing surface that is permeable to ions and current to promote continuity between the electrode and the polishing surface.
摘要翻译：提供了一种用于处理基板表面的制造和设备。在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括具有至少部分导电的抛光表面的主体的抛光制品。电极设置在其间具有介电材料的抛光表面下方。可以在抛光表面和电介质材料中形成多个孔，以至少部分地将电极暴露于抛光表面。可以在电极和抛光表面之间设置膜，其可透过离子和电流，以促进电极和抛光表面之间的连续性。

8. 发明申请

US20070158207A1 Methods for electrochemical processing with pre-biased cells 审中-公开
标题翻译：使用预偏置电池进行电化学处理的方法
公开(公告)号：US20070158207A1
公开(公告)日：2007-07-12
申请号：US11326647
申请日：2006-01-06
申请人： Jie Diao , Renhe Jia , You Wang , Gerald Alonzo , Stan Tsai , Lakshmanan Karuppiah
发明人： Jie Diao , Renhe Jia , You Wang , Gerald Alonzo , Stan Tsai , Lakshmanan Karuppiah
IPC分类号： B23H3/00
CPC分类号： B23H5/08 , B24B53/017 , C25F1/00 , C25F3/02
摘要： A method for electrochemically processing a substrate is provided. In one embodiment, the method includes performing a conditioning procedure on a processing pad having a plurality of process cells, energizing the process cells by applying a voltage to the conditioned processing pad, placing a substrate having at least a conductive layer disposed thereon on the energized pad, and removing at least a portion of the conductive layer in the energized process cells. In another embodiment, a method for polishing a substrate includes placing an unused conductive pad having a plurality of process cells on a platen of a processing system, breaking in the pad on the platen, energizing the process cells by applying a voltage to the broken-in pad, placing a substrate having at least a conductive layer disposed thereon on the energized pad, and removing at least a portion of the conductive layer in the energized cells.
摘要翻译：提供了一种用于电化学处理衬底的方法。在一个实施例中，该方法包括在具有多个处理单元的处理垫上执行调节程序，通过向经调节的处理垫施加电压来激励处理单元，将其上布置有至少一个导电层的基板放置在通电并且在通电的处理单元中去除导电层的至少一部分。在另一个实施例中，用于抛光衬底的方法包括将具有多个处理单元的未使用的导电焊盘放置在处理系统的压板上，在压板上的焊盘中断开，在衬垫中，将具有至少其上设置有导电层的衬底放置在通电焊盘上，以及去除通电电池中的至少一部分导电层。

9. 发明申请

US20070235344A1 Process for high copper removal rate with good planarization and surface finish 审中-公开
标题翻译：具有良好的平坦化和表面光洁度的高铜去除率的工艺
公开(公告)号：US20070235344A1
公开(公告)日：2007-10-11
申请号：US11399560
申请日：2006-04-06
申请人： Renhe Jia , You Wang , Gerald Alonzo , Yongqi Hu , Zhihong Wang , Jie Diao , Stan D Tsai , Alpay Yilmaz , Lakshmanan Karuppiah , Liang-Yuh Chen
发明人： Renhe Jia , You Wang , Gerald Alonzo , Yongqi Hu , Zhihong Wang , Jie Diao , Stan D Tsai , Alpay Yilmaz , Lakshmanan Karuppiah , Liang-Yuh Chen
IPC分类号： B23H5/08
CPC分类号： B23H5/08 , C25F3/02 , H01L21/32125
摘要： A method for electrochemical mechanical polishing (ECMP) is disclosed. The polishing rate and surface finish of the layer on the wafer are improved by controlling the surface speed of both the platen and head, controlling the current applied to the pad, and preselecting the density of the perforations on the fully conductive polishing pad. ECMP produces much higher removal rates, good surface finishes, and good planarization efficiency at a lower down force. Generally, increasing the surface speed of both the platen and the head will increase the surface smoothness. Also, increasing the current density on the wafer will increase the surface smoothness. There is virtually no difference in the smoothness of the wafer surface between the center, middle, and edge of the wafer. For copper, removal rates of 10,000 Å/min and greater can be achieved.
摘要翻译：公开了一种用于电化学机械抛光（ECMP）的方法。通过控制压板和头部的表面速度，控制施加到垫的电流以及预选在全导电抛光垫上的穿孔密度来提高晶片上层的抛光速率和表面光洁度。 ECMP在较低的下压力下产生高得多的去除率，良好的表面光洁度和良好的平面化效率。通常，增加压板和头部的表面速度将增加表面平滑度。此外，增加晶片上的电流密度将增加表面平滑度。在晶片的中心，中间和边缘之间的晶片表面的平滑度几乎没有差别。对于铜，可以实现10,000 / min以上的去除率。

10. 发明申请

US20080020682A1 Method for conditioning a polishing pad 审中-公开
标题翻译：调整抛光垫的方法
公开(公告)号：US20080020682A1
公开(公告)日：2008-01-24
申请号：US11490883
申请日：2006-07-21
申请人： Renhe Jia , Jie Diao , You Wang , Stan Tsai , Jim Atkinson , Lakshmanan Karuppiah , Liang-Yuh Chen
发明人： Renhe Jia , Jie Diao , You Wang , Stan Tsai , Jim Atkinson , Lakshmanan Karuppiah , Liang-Yuh Chen
IPC分类号： B24B1/00
CPC分类号： B24B53/017
摘要： A method of conditioning processing pads increases the removal rate of conductive material from a substrate surface during polishing. In this method, the direction of rotation of the processing pad relative to the conditioning disc during conditioning is opposite the direction of rotation of the processing pad relative to the substrate during polishing.
摘要翻译：调整处理垫的方法在抛光期间增加导电材料从衬底表面的去除速率。在这种方法中，处理衬垫相对于调理盘在调节期间的旋转方向与抛光期间相对于衬底相对于处理垫的旋转方向。

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