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    • 22. 发明申请
    • SEMICONDUCTOR PROCESSING SYSTEM
    • 半导体加工系统
    • US20080187416A1
    • 2008-08-07
    • US11774335
    • 2007-07-06
    • Tsutomu HirokiHiroaki Saeki
    • Tsutomu HirokiHiroaki Saeki
    • H01L21/67
    • H01L21/68742H01L21/68H01L21/68714H01L21/6875Y10S414/139
    • A supporting mechanism (12A) is used for transfer-ring a target substrate (W) in cooperation with a transfer arm (32), in a semiconductor processing system. The supporting mechanism includes first and second holding portions (38A to 38C, 40A to 40C) each configured to be moved up and down and transfer a substrate to and from the transfer arm. The first and second holding portions are configured to be moved relative to each other in a vertical direction without spatially interfering with each other, and support substrates at substantially the same horizontal coordinate position. The supporting mechanism further includes first and second drives (46, 48) configured to move the first and second holding portions up and down, and a controller (68) configured to control the first and second drives. The controller is arranged to control the first and second drives to alternatively support a substrate by the first and second holding portions.
    • 在半导体处理系统中,支撑机构(12A)用于与传送臂(32)协作传送环目标衬底(W)。 支撑机构包括构造成上下移动的第一和第二保持部分(38A至38C,40A至40C),并将基板传送到传送臂和从传送臂传送。 第一保持部和第二保持部被配置为在垂直方向上相对于彼此移动而没有彼此空间干涉,并且将基板支撑在基本上相同的水平坐标位置。 支撑机构还包括构造成使第一和第二保持部分上下移动的第一和第二驱动器(46,48)以及被配置为控制第一和第二驱动器的控制器(68)。 控制器被布置成控制第一和第二驱动器以由第一和第二保持部分交替地支撑衬底。
    • 24. 发明授权
    • Fuel supply system for internal combustion engine
    • 内燃机燃油供应系统
    • US07013869B2
    • 2006-03-21
    • US10681245
    • 2003-10-09
    • Masami NaganoTakanobu IchiharaHiroaki Saeki
    • Masami NaganoTakanobu IchiharaHiroaki Saeki
    • F02D41/00
    • F02M69/32F02D41/3094F02M31/135F02M31/18F02M53/02F02M69/325Y02T10/126
    • The present invention provides an electronically-controlled fuel injector, for an internal combustion engine, comprising a downstream fuel injection valve located near an air intake port of each cylinder or inside a cylinder, an air intake passage which bypasses the throttle valve located upstream of a downstream fuel injection valve, and a fuel vaporizing section including an upstream fuel injection valve, and a heater which vaporizes fuel injected from the upstream fuel injection valve; and further having an air intake port located upstream of the throttle valve, air flow control section for controlling an amount of air, said fuel vaporizing section, vaporized-fuel branch section for supplying vaporized fuel to each cylinder, and a vaporized-fuel distribution passage which extends from the vaporized-fuel branch section to an opening located in each air intake pipe located downstream of the throttle valve.
    • 本发明提供了一种用于内燃机的电子控制燃料喷射器,包括位于每个气缸的进气口附近或气缸内的下游燃料喷射阀,绕过位于气缸的上游的节流阀的进气通道 下游燃料喷射阀和包括上游燃料喷射阀的燃料蒸发部和使从上游燃料喷射阀喷射的燃料蒸发的加热器; 并且还具有位于节流阀上游的进气口,用于控制空气量的空气流量控制部分,所述燃料蒸发部分,用于向每个气缸供应蒸发燃料的蒸发燃料分支部分,以及蒸发燃料分配通道 其从蒸发燃料分支部分延伸到位于节流阀下游的每个进气管中的开口。
    • 25. 发明授权
    • Positioning substrate for semiconductor process
    • 半导体工艺定位基板
    • US06950721B2
    • 2005-09-27
    • US10391574
    • 2003-03-20
    • Makoto TashiroKeisuke KondohHiroaki Saeki
    • Makoto TashiroKeisuke KondohHiroaki Saeki
    • H01L21/027H01L21/02H01L21/68G06F7/00
    • H01L21/68Y10S414/135
    • A positioning substrate is used for performing a teaching operation on a transfer mechanism for transferring a target substrate in a semiconductor processing system. The positioning substrate includes a substrate body made of a material selected from the group consisting of the same material as the target substrate, semiconductor, compound semiconductor, and ceramic. The substrate body has an outer contour sized to be handled by the transfer mechanism as an alternative to the target substrate. The positioning substrate also includes a positioning assistant having a combination of a positioning hole and a positioning reference line formed in the substrate body. The positioning hole is formed to penetrate the substrate body in a thickness direction. The positioning reference line is formed on a surface of the substrate body to extend across an opening of the positioning hole and have a predetermined width.
    • 定位基板用于对在半导体处理系统中传送目标基板的转印机构进行示教操作。 定位基板包括由与靶基板,半导体,化合物半导体和陶瓷相同的材料组成的组中选择的材料制成的基板主体。 基板主体具有外形轮廓,其尺寸设置成由作为目标基板的替代的传送机构来处理。 定位基板还包括具有定位孔和形成在基板主体中的定位基准线的组合的定位辅助件。 定位孔形成为在厚度方向上穿透基体。 定位参考线形成在基体的表面上,以延伸穿过定位孔的开口并具有预定的宽度。
    • 27. 发明授权
    • Processing apparatus
    • 处理装置
    • US06802934B2
    • 2004-10-12
    • US10378890
    • 2003-03-05
    • Hiroaki SaekiKeiichi MatsushimaTeruo AsakawaMasaki Narushima
    • Hiroaki SaekiKeiichi MatsushimaTeruo AsakawaMasaki Narushima
    • H01L2100
    • H01L21/67766H01L21/67167H01L21/67201H01L21/67742H01L21/67745Y10S414/135Y10S414/136
    • Two load lock chambers 130 and 132 are arranged between a first transfer chamber 122 and a second transfer chamber 133. Each of the load lock chambers is capable of accommodating a single wafer W. The first transfer chamber 122 is provided with a first transfer unit 124 having two substrate holders 124a, 124b each capable of holding a single object to be processed, in order to transport the wafer W among a load port site 120, the first load lock chamber 130, the second load lock chamber 132 and a positioning unit 150. The second transfer chamber 133 is provided with a second transfer unit 156 having two substrate holders 156a, 156b each capable of holding the single object to be processed, in order to transport the wafer between the first load lock chamber 130, the second load lock chamber 132 and respective vacuum processing chambers 158 to 164. Since the volume of each load lock chamber can be minimized, it is possible to perform the prompt control of atmospheres in the load lock chambers. Additionally, it is possible to perform the delivery of the wafers promptly.
    • 两个负载锁定室130和132设置在第一传送室122和第二传送室133之间。每个负载锁定室能够容纳单个晶片W.第一传送室122设置有第一传送单元124 具有能够保持单个待处理物体的两个基板保持件124a,124b,以便在载荷端口位置120,第一加载锁定室130,第二加载锁定室132和定位单元150之间输送晶片W 第二传送室133设置有第二传送单元156,第二传送单元156具有两个能够保持单个待处理物体的基板保持器156a,156b,以便在第一加载锁定室130,第二加载锁 室132和相应的真空处理室158至164.由于每个负载锁定室的体积可以最小化,因此可以对负载锁中的气氛进行即时控制 mbers。 此外,可以及时执行晶片的传送。
    • 29. 发明授权
    • Transfer arm
    • 转臂
    • US06575691B1
    • 2003-06-10
    • US09744175
    • 2001-01-19
    • Hiroaki Saeki
    • Hiroaki Saeki
    • B66C2300
    • B25J9/107H01L21/67766H01L21/68707Y10T74/20305Y10T74/20329
    • A conveying arm of the invention includes a first pivotable shaft connected to a first arm which is also pivotably connected to a third arm having an intermediate pivotable portion. The third arm is also pivotably connected to a fifth arm which is also pivotably connected to a seventh arm which has a holding portion for an object to be conveyed. The conveying arm also includes a second pivotable shaft connected to a second arm which is also pivotably connected to a fourth arm having an intermediate pivotable portion. The fourth arm is also pivotably connected to a sixth arm which is also pivotably connected to the seventh arm. With respect to both the third and fourth arms, a line linking one-side end portion to an intermediate pivotable portion is substantially perpendicular to a line linking the other-side end portion to the intermediate pivotable portion.
    • 本发明的传送臂包括连接到第一臂的第一可枢转轴,其也可枢转地连接到具有中间可枢转部分的第三臂。 第三臂也可枢转地连接到第五臂,第五臂也可枢转地连接到具有用于待传送物体的保持部分的第七臂。 输送臂还包括连接到第二臂的第二可枢转轴,第二臂也可枢转地连接到具有中间可枢转部分的第四臂。 第四臂也可枢转地连接到也可枢转地连接到第七臂的第六臂。 相对于第三臂和第四臂,连接单侧端部与中间枢转部分的线基本上垂直于将另一侧端部连接到中间枢转部分的线。