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21. 发明授权

US5428503A Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon 失效
标题翻译：用于冷却电子设备的喷射冷却装置和安装在其上的计算机
公开(公告)号：US5428503A
公开(公告)日：1995-06-27
申请号：US317614
申请日：1994-09-26
申请人： Hitoshi Matsushima , Toshihiro Komatu , Yoshihiro Kondou , Toshio Hatada , Susumu Iwai , Tetsuro Honma , Toshiki Iino , Takao Ohba , Akira Yamagiwa
发明人： Hitoshi Matsushima , Toshihiro Komatu , Yoshihiro Kondou , Toshio Hatada , Susumu Iwai , Tetsuro Honma , Toshiki Iino , Takao Ohba , Akira Yamagiwa
IPC分类号： H05K7/20
CPC分类号： H05K7/20154 , Y10S165/908
摘要： A cooling apparatus for electronic equipment for improving the reliability of the equipment by making uniform the temperature distribution of heat generating devices mounted on the electronic equipment, more particularly on a computer and for reducing the working process required at the time of performing a maintenance of a printed circuit board in the electronic equipment by stacking, in a frame, the electronic printed circuit boards on which the heat generating devices, such as a CPU and memories, are mounted at predetermined intervals. The cooling apparatus has a fan fastened to one wall surface of a chamber and a plurality of jet cooling devices formed on the surface opposing the wall surface. The jet cooling devices are formed in parallel to the printed circuit boards. The jet cooling devices are slits, or nozzles or jet stream ducts extending among the printed circuit boards and are so formed as to supply cooling air in a jet stream state to each heat generating device. Therefore, the cooling air can be concentrated to locally cool the printed circuit board including the device that generates heat of a large heating value. Hence, the temperature rise in the heat generating devices can be made uniform.
摘要翻译：一种用于电子设备的冷却装置，用于通过使安装在电子设备上的发热装置的温度分布均匀，更具体地在计算机上，并且为了减少进行维护时所需的工作过程而提高设备的可靠性电子设备中的印刷电路板通过在框架中堆叠以预定间隔安装诸如CPU和存储器的发热装置的电子印刷电路板。冷却装置具有固定在室的一个壁表面上的风扇和形成在与壁表面相对的表面上的多个喷射冷却装置。喷射冷却装置与印刷电路板平行地形成。喷射冷却装置是在印刷电路板之间延伸的狭缝或喷嘴或喷射流管道，并且形成为将喷射流状态的冷却空气供应到每个发热装置。因此，冷却空气可以集中以局部冷却印刷电路板，包括产生大热值的热的装置。因此，能够使发热元件的温度上升均匀。

22. 发明授权

US5353866A Heat transfer fins and heat exchanger 失效
标题翻译：换热片和热交换器
公开(公告)号：US5353866A
公开(公告)日：1994-10-11
申请号：US038190
申请日：1993-03-29
申请人： Hironobu Ueda , Toshio Hatada , Yoshifumi Kunugi , Tomihisa Oouchi , Sigeo Sugimoto , Tamio Shimizu , Kyoji Kohno
发明人： Hironobu Ueda , Toshio Hatada , Yoshifumi Kunugi , Tomihisa Oouchi , Sigeo Sugimoto , Tamio Shimizu , Kyoji Kohno
IPC分类号： F25B15/00 , F28F1/32 , F28D9/00
CPC分类号： F28F1/325 , F25B15/008
摘要： Louver segments of a heat transfer fin each have a longitudinal central portion disposed at the center of the louver segment in a direction crossing the flow of a fluid and longitudinal end portions each disposed on either side of the longitudinal central portion and sectioned into parts. Each louver segment has a configuration such that an area of the longitudinal central portion projected in the direction of the flow of the fluid is larger than an area of each of the longitudinal end portions projected in the direction of the flow of the fluid, with respect to the same width of the passage of the fluid.
摘要翻译：传热翅片的百叶窗段具有纵向中心部分，该纵向中心部分沿着与流体纵向端部交叉的方向设置在百叶窗部分的中心，纵向端部分别设置在纵向中心部分的任一侧并且被分成多个部分。每个百叶窗段具有这样的构造，使得沿着流体的流动方向突出的纵向中心部分的面积大于沿着流体的流动方向突出的每个纵向端部的面积，相对于到流体通道的相同宽度。

23. 发明授权

US4365667A Heat exchanger 失效
标题翻译：热交换器
公开(公告)号：US4365667A
公开(公告)日：1982-12-28
申请号：US118723
申请日：1980-02-05
申请人： Toshio Hatada , Takao Senshu , Akira Arai , Fumio Harada , Atsushi Matsuzaki , Hajime Futawatari , Yutaka Imaizumi , Sumiyoshi Takeda
发明人： Toshio Hatada , Takao Senshu , Akira Arai , Fumio Harada , Atsushi Matsuzaki , Hajime Futawatari , Yutaka Imaizumi , Sumiyoshi Takeda
IPC分类号： F28F1/32 , F28F1/22
CPC分类号： F28F1/325 , Y10S165/503 , Y10T29/4938
摘要： In a cross finned tube heat exchanger including a multiplicity of side-by-side fin plates, and a plurality of heat transfer tubes extending through the fin plates at least in one row to provide a serpentine flow passage for a heat transfer medium which exchanges heat with another heat transfer medium flowing across the surfaces of the fin plates, a multiplicity of stepped louvers are formed on the wall of each fin plate between the adjacent heat transfer tubes of the same row. The stepped louvers each extending in a direction at right angles to the direction of air flow across the surfaces of the fin plates include at least one tilting rise wall and may differ from one another in shape depending on their positions. The stepped louvers on each fin plate may be arranged in the form of waves or uniform in height with respect to the direction in which each fin plate extends. The adjacent stepped louvers have edges varying in vertical positions.
摘要翻译：在包括多个并排翅片板的交叉翅片管式热交换器中，以及多个传热管，其至少在一排中延伸穿过翅片板，以提供用于传热的传热介质的蛇形流动通道另一个传热介质流过翅片板的表面，在同一行的相邻传热管之间的每个翅板的壁上形成多个台阶式百叶窗。每个沿与翅片的表面的空气流的方向成直角的方向延伸的台阶式百叶窗包括至少一个倾斜上升壁，并且可以根据它们的位置彼此不同。每个翅片上的台阶式百叶窗可以相对于每个翅板延伸的方向以波浪的形式或高度均匀地布置。相邻的台阶式百叶窗具有垂直位置变化的边缘。

24. 发明授权

US4300629A Cross-fin tube type heat exchanger 失效
标题翻译：横管式换热器
公开(公告)号：US4300629A
公开(公告)日：1981-11-17
申请号：US50455
申请日：1979-06-20
申请人： Toshio Hatada , Takao Senshu , Akira Arai , Fumio Harada , Atsushi Matsuzaki , Hajime Futawatari , Yutaka Imaizumi , Sumiyoshi Takeda
发明人： Toshio Hatada , Takao Senshu , Akira Arai , Fumio Harada , Atsushi Matsuzaki , Hajime Futawatari , Yutaka Imaizumi , Sumiyoshi Takeda
IPC分类号： F28F1/32 , F28F1/38
CPC分类号： F28F1/325 , F28F2250/02 , Y10S165/503
摘要： A cross-fin tube type heat exchanger having a large number of parallel fins and a plurality of heat transfer tubes extended through and fixed to the fins, so that heat may be exchanged between a first heat exchanging medium flowing through the heat transfer tubes and a second heat exchanging medium flowing along the surfaces of the fin, across the walls of the heat transfer tubes and through the fins. In the portions of each fin between adjacent heat transfer tubes of the same row, formed are a number of slits perpendicular to the direction of flow of the second heat exchanging medium. Each elongated section defined between each pair of adjacent slits is bent along its breadthwise bisector line and is raised in the form of a bridge to constitute an upwardly convexed louver element. The upwardly convexed louver element may have a cross section with an obtuse apex angle, or may have an arcuate cross section. The successive louver elements are arrayed in the direction of flow of the second heat exchanging medium in a manner of corrugation, or alternately staggered in the heightwise direction so that the edges of adjacent louver elements may be staggered in the heightwise direction. The fins having louver elements thus constructed cause a turbulency of the flow of the second heat exchanging medium to effectively prevent boundary layers of the latter from growing, thereby to ensure a higher efficiency of the heat exchange. Also increased stiffness or rigidity of the fin is obtained thanks to the provision of upwardly convexed louver elements.
摘要翻译：一种具有大量平行翅片和多个传热管的交叉翅片管型热交换器，其延伸并固定在翅片上，使得热量可以在流过传热管的第一热交换介质和第二热交换介质沿着翅片的表面流动，穿过传热管的壁并且通过翅片。在相邻行的相邻传热管之间的每个翅片的部分形成有垂直于第二热交换介质的流动方向的多个狭缝。限定在每对相邻狭缝之间的每个细长部分沿着其宽度方向的平分线弯曲并且以桥的形式被升高以构成向上凸起的百叶窗元件。向上凸起的百叶窗元件可以具有钝角顶角的横截面，或者可以具有弓形横截面。连续的百叶窗元件以波纹的方式在第二热交换介质的流动方向上排列，或者在高度方向上交错排列，使得相邻百叶窗元件的边缘可能在高度方向上交错。具有如此构造的百叶窗元件的翅片导致第二热交换介质的流动的湍流，以有效地防止后者的边界层生长，从而确保更高的热交换效率。由于提供了向上凸起的百叶窗元件，还获得了翅片的增加的刚度或刚度。

25. 发明授权

US5796580A Air-cooled information processing apparatus having cooling air fan, sub-fan, and plural separated cooling air flow channels 失效
标题翻译：具有冷却风扇，副风扇和多个分离的冷却空气流动通道的风冷信息处理设备
公开(公告)号：US5796580A
公开(公告)日：1998-08-18
申请号：US226824
申请日：1994-04-13
申请人： Toshihiro Komatsu , Hitoshi Matsushima , Toshio Hatada , Susumu Iwai , Tetsuro Homma , Yoshihiro Kondo , Shouhei Fuse , Hiroshi Yamada , Kazuo Morita , Hiroshi Ito , Akiyoshi Iida , Kenta Kumagai , Shinichi Shimode
发明人： Toshihiro Komatsu , Hitoshi Matsushima , Toshio Hatada , Susumu Iwai , Tetsuro Homma , Yoshihiro Kondo , Shouhei Fuse , Hiroshi Yamada , Kazuo Morita , Hiroshi Ito , Akiyoshi Iida , Kenta Kumagai , Shinichi Shimode
IPC分类号： G06F1/20 , H05K7/20 , G06F1/16
CPC分类号： H05K7/20727 , G06F1/20
摘要： An air-cooled information processing apparatus has a plurality of units and a casing accommodating the units. At least one cooling air supply section and at least one cooling air discharge section are provided in the casing, for supplying cooling air into the apparatus and for discharging the air therefrom. A partition member divides the space inside the casing so as to define at least two cooling air flow channels between the cooling air supply section and the cooling air discharge section. At least one main fan unit is disposed in each of the cooling air flow channels. The cooling air flow channels include at least one first cooling air flow channel in which at least two units from among the plurality of units are disposed in parallel with each other with respect to the direction of flow of cooling air, and at least one second cooling air flow channel in which at least two units from among the plurality of units are arranged in series to each other along the flow of cooling air. This cooling arrangement ensures optimum cooling for different types of units in the apparatus, without being accompanied by rise in the noise level, rate of discharge of air, power consumption and production cost.
摘要翻译：风冷信息处理装置具有多个单元和容纳该单元的壳体。至少一个冷却空气供应部分和至少一个冷却空气排放部分设置在壳体中，用于将冷却空气供给到设备中并从中排出空气。分隔构件将壳体内的空间分隔开，以便在冷却空气供应部分和冷却空气排放部分之间限定至少两个冷却空气流动通道。至少一个主风扇单元设置在每个冷却空气流动通道中。冷却空气流动通道包括至少一个第一冷却空气流动通道，其中多个单元中的至少两个单元相对于冷却空气的流动方向彼此平行地设置，并且至少一个第二冷却空气流动通道，其中来自多个单元中的至少两个单元沿着冷却空气的流动彼此串联布置。该冷却装置确保了设备中不同类型单元的最佳冷却，而不伴随着噪声水平，空气排放速率，功率消耗和生产成本的上升。

26. 发明授权

US5504924A Cooling system of electronic computer using flexible members in contact with semiconductor devices on boards 失效
标题翻译：使用与板上的半导体器件接触的柔性部件的电子计算机的冷却系统
公开(公告)号：US5504924A
公开(公告)日：1996-04-02
申请号：US317621
申请日：1994-09-26
申请人： Shingeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Toshio Hatada , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa
发明人： Shingeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Toshio Hatada , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa
IPC分类号： G06F1/00 , F28D15/02 , G06F1/20 , H05K7/20 , G06F9/00
CPC分类号： H05K7/208 , F28D15/0233 , F28D15/0275 , G06F1/20 , G06F1/206 , H05K7/20809 , G06F2200/201
摘要： An electronic computer cooling system having a cooling apparatus to cool an electronic computer and cooling members for thermally connecting semiconductor devices whose operating speeds are raised by cooling to a low temperature source of the cooling apparatus. Circuit boards onto which the semiconductor devices and the like constructing the electronic computer are mounted and the cooling apparatus such as a refrigerating apparatus and the like are compactly enclosed in a single casing. Or, the circuit boards and the cooling apparatus are compactly enclosed in separate detachable casings, respectively. Thus, a structure in which desired semiconductor devices can be certainly cooled by using the cooling members is obtained.
摘要翻译：一种电子计算机冷却系统，其具有用于冷却电子计算机的冷却装置和用于热连接半导体装置的冷却构件，所述冷却构件的工作速度通过冷却而升高到所述冷却装置的低温源。安装构成电子计算机的半导体装置等的电路板被紧凑地封闭在一个壳体中，诸如制冷装置等的冷却装置。或者，电路板和冷却装置分别紧密地封闭在分离的可拆卸的外壳中。因此，可以获得通过使用冷却部件可靠地冷却期望的半导体器件的结构。

27. 发明授权

US5365402A Cooling apparatus of electronic device 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5365402A
公开(公告)日：1994-11-15
申请号：US800268
申请日：1991-11-29
申请人： Toshio Hatada , Shigeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa , Kanji Otsuka , Yuuji Shirai
发明人： Toshio Hatada , Shigeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa , Kanji Otsuka , Yuuji Shirai
IPC分类号： H01L23/36 , H01L23/367 , H01L23/40 , H01L23/433 , H05K7/20
CPC分类号： H01L23/433 , H01L23/3677 , H01L23/4006 , H01L2023/405 , H01L2224/32188 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/15312 , H01L2924/1532 , H01L2924/16195
摘要： A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer may also be in close contact with a large number of semiconductor chips having various configurations which are mounted on a board, so that the elastomer is thermally connected with them, whereby the elastomer absorbs thermal deformations.
摘要翻译：一种用于高热密度的电子装置的冷却装置，包括插入在半导体芯片和散热片之间的弹性体，以便将它们热连接。弹性体还可以与安装在板上的具有各种构造的大量半导体芯片紧密接触，使得弹性体与它们热连接，由此弹性体吸收热变形。

28. 发明授权

US5361188A Cooling apparatus of electronic equipment 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5361188A
公开(公告)日：1994-11-01
申请号：US115669
申请日：1993-09-02
申请人： Yoshihiro Kondou , Hitoshi Matsushima , Toshio Hatada , Hiroshi Inouye , Toshihiro Komatsu , Takao Ohba , Akira Yamagiwa
发明人： Yoshihiro Kondou , Hitoshi Matsushima , Toshio Hatada , Hiroshi Inouye , Toshihiro Komatsu , Takao Ohba , Akira Yamagiwa
IPC分类号： H05K7/20 , H01L23/467
CPC分类号： H01L23/467 , H05K7/20563 , H01L2224/32 , H01L2224/73253 , Y10S165/908
摘要： In a cooling apparatus of an electronic equipment, a plurality each of integrated circuit devices and large-scale integrated circuit devices are mounted onto a plurality of substrates, respectively, and a cooling fan supplies cooling air from outside to each of these integrated circuit devices. A duct having a comb-tooth shape suitable for encompassing each substrate and defining flow paths along the substrates introduces the cooling air supplied by the cooling fan to each of the integrated circuit devices. The duct includes a plurality of small holes disposed at positions corresponding to the positions of the integrated circuit devices on the substrates and having open areas corresponding to the heating values of the integrated circuit devices. The small holes flow the cooling air supplied by the cooling fan as jet streams to the integrated circuit devices. This jet stream cooling improves cooling performance and can make uniform the temperature distribution of the integrated circuit devices.
摘要翻译：在电子设备的冷却装置中，分别将多个集成电路装置和大型集成电路装置安装在多个基板上，并且冷却风扇从外部向这些集成电路装置中的每一个提供冷却空气。具有适于包围每个基板并且沿着基板限定流动路径的梳齿形状的管道将由冷却风扇供应的冷却空气引入到每个集成电路装置。导管包括多个小孔，其设置在与基板上的集成电路器件的位置对应的位置处，并且具有与集成电路器件的发热值对应的开放区域。这些小孔将作为喷射流的冷却风扇供给的冷却空气流向集成电路装置。这种喷射流冷却改善了冷却性能，并且可以使集成电路器件的温度分布均匀。

29. 发明授权

US5360060A Fin-tube type heat exchanger 失效
标题翻译：翅片式换热器
公开(公告)号：US5360060A
公开(公告)日：1994-11-01
申请号：US986702
申请日：1992-12-08
申请人： Takeo Tanaka , Toshio Hatada , Masaaki Itoh , Takao Senshu , Naoto Katsumata , Yoshihiko Mochizuki , Hirokiyo Terada , Minetoshi Izushi , Minoru Sato , Hiromi Tsuji , Makoto Nagai
发明人： Takeo Tanaka , Toshio Hatada , Masaaki Itoh , Takao Senshu , Naoto Katsumata , Yoshihiko Mochizuki , Hirokiyo Terada , Minetoshi Izushi , Minoru Sato , Hiromi Tsuji , Makoto Nagai
IPC分类号： F28F1/32 , F28D1/04
CPC分类号： F28F1/325
摘要： A fin-tube type heat exchanger has parallel heat transfer tubes and a stack of a plurality of plate fins mounted on the tubes. Heat exchange is conducted between a first fluid flowing through the tubes and a second fluid flowing through the stack across each of the fins. Each fin has flat tube-mounting portions spaced in the longitudinal direction of the fin and formed with tube-mounting holes and a louver section disposed between each adjacent pair of tube-mounting portions. The louver section has elongated slats extending longitudinally of the fin and having side edges each spaced from an adjacent side edge of an adjacent slat. The slats are classified into two groups in respect of the cross-sectional shape. The slats of one group have generally flat cross-sections to reduce the resistance of the fin to the flow of the second fluid through the stack and are disposed in planes offset from the plane of the tube-mounting portions. The slats of the other group have V-shaped or inverted V-shaped cross-sections to increase stiffness of the fin in the longitudinal direction thereof.
摘要翻译：翅片管型热交换器具有平行的传热管和安装在管上的多个板翅片的堆叠。在流过管的第一流体和跨过每个翅片流过堆叠的第二流体之间进行热交换。每个翅片具有在翅片的纵向间隔开的扁平管安装部分，并且形成有管安装孔和布置在每个相邻的一对管安装部分之间的百叶窗部分。百叶窗部分具有从翅片纵向延伸的细长板条，并且具有与相邻板条的相邻侧边缘间隔开的侧边缘。板条在横截面形状上分为两组。一组的板条具有大致平坦的横截面，以减小翅片对通过堆叠的第二流体的流动的阻力，并且设置在从管安装部分的平面偏移的平面中。另一组的板条具有V形或倒V形横截面，以增加翅片在其纵向上的刚度。

30. 发明授权

US5315482A Semiconductor apparatus of module installing type 失效
标题翻译：模块安装型半导体装置
公开(公告)号：US5315482A
公开(公告)日：1994-05-24
申请号：US961394
申请日：1992-10-15
申请人： Akira Tanaka , Hiroichi Shinohara , Kazuji Yamada , Takao Ohba , Akira Yamagiwa , Hitoshi Yoshidome , Yuji Shirai , Toshio Hatada , Munehisa Kishimoto , Michiharu Honda
发明人： Akira Tanaka , Hiroichi Shinohara , Kazuji Yamada , Takao Ohba , Akira Yamagiwa , Hitoshi Yoshidome , Yuji Shirai , Toshio Hatada , Munehisa Kishimoto , Michiharu Honda
IPC分类号： H01L23/36 , H01L23/367 , H01L25/10 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/00 , H05K3/36 , H05K7/20
CPC分类号： H05K1/021 , H01L23/367 , H01L25/105 , H01L2225/107 , H01L2225/1094 , H01L2924/0002 , H05K1/141 , H05K1/182 , H05K2203/049 , H05K3/0061 , H05K3/366
摘要： A semiconductor apparatus comprises a heat diffusing plate and a surface installing printed board. A semiconductor device of a high heat generation is installed on the heat diffusing plate. A surface installing package and chip parts are installed on both surfaces of the printed board. A through hole is formed at the center of the printed board so that the semiconductor device is located at the center. The heat diffusing plate on which the semiconductor device has been installed and the surface installing printed board are connected and integrated.
摘要翻译：半导体装置包括热扩散板和表面安装印刷板。在散热板上安装有高发热的半导体装置。表面安装封装和芯片部件安装在印刷电路板的两个表面上。在印刷电路板的中心形成通孔，使得半导体器件位于中心。已经安装了半导体器件的散热板和表面安装印刷板连接并整合。

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