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1. 发明授权

US5353866A Heat transfer fins and heat exchanger 失效
标题翻译：换热片和热交换器
公开(公告)号：US5353866A
公开(公告)日：1994-10-11
申请号：US038190
申请日：1993-03-29
申请人： Hironobu Ueda , Toshio Hatada , Yoshifumi Kunugi , Tomihisa Oouchi , Sigeo Sugimoto , Tamio Shimizu , Kyoji Kohno
发明人： Hironobu Ueda , Toshio Hatada , Yoshifumi Kunugi , Tomihisa Oouchi , Sigeo Sugimoto , Tamio Shimizu , Kyoji Kohno
IPC分类号： F25B15/00 , F28F1/32 , F28D9/00
CPC分类号： F28F1/325 , F25B15/008
摘要： Louver segments of a heat transfer fin each have a longitudinal central portion disposed at the center of the louver segment in a direction crossing the flow of a fluid and longitudinal end portions each disposed on either side of the longitudinal central portion and sectioned into parts. Each louver segment has a configuration such that an area of the longitudinal central portion projected in the direction of the flow of the fluid is larger than an area of each of the longitudinal end portions projected in the direction of the flow of the fluid, with respect to the same width of the passage of the fluid.
摘要翻译：传热翅片的百叶窗段具有纵向中心部分，该纵向中心部分沿着与流体纵向端部交叉的方向设置在百叶窗部分的中心，纵向端部分别设置在纵向中心部分的任一侧并且被分成多个部分。每个百叶窗段具有这样的构造，使得沿着流体的流动方向突出的纵向中心部分的面积大于沿着流体的流动方向突出的每个纵向端部的面积，相对于到流体通道的相同宽度。

2. 发明授权

US4841744A Double effect air cooled absorption refrigerating machine 失效
标题翻译：双效空冷吸收式制冷机
公开(公告)号：US4841744A
公开(公告)日：1989-06-27
申请号：US145316
申请日：1988-01-19
申请人： Shigekichi Kurosawa , Yoshikazu Nagaoka , Shinichi Kannoh , Sadatoshi Takemoto , Shigeo Sugimoto , Tomihisa Oouchi , Toshio Hatada , Yoshifumi Kunugi , Hironobu Kawamura , Kyoji Kohno , Kenzi Machizawa
发明人： Shigekichi Kurosawa , Yoshikazu Nagaoka , Shinichi Kannoh , Sadatoshi Takemoto , Shigeo Sugimoto , Tomihisa Oouchi , Toshio Hatada , Yoshifumi Kunugi , Hironobu Kawamura , Kyoji Kohno , Kenzi Machizawa
IPC分类号： F25B15/00 , F25B43/04
CPC分类号： F25B15/008 , F25B43/046 , Y02B30/62
摘要： A double effect air cooled absorption refrigerating machine consisting of fans provided on one side frame member out of the upper, lower and four side frame members which constitute a frame of a machine body, an air cooled heat exchanger provided on the remaining three side frame members and composed of an air cooled absorber and an air cooled condenser, and an evaporator, a high-temperature regenerator, a low-temperature regenerator, a solution heat exchanger and some other parts, all of which are provided on the inner side so as to be surrounded by the side frame members, the machine having a small installation area.
摘要翻译：一种双效空气冷却吸收式制冷机，由构成机体框架的上，下和四个侧框架构件的一个侧框架构件上的风扇组成，设置在剩余的三个侧框架构件上的空气冷却热交换器并且由空气冷却吸收器和空气冷却冷凝器组成，以及蒸发器，高温再生器，低温再生器，溶液热交换器等一部分，其全部设置在内侧，从而被侧框架构件包围，该机器具有小的安装面积。

3. 发明授权

US4791984A Heat transfer fin 失效
标题翻译：换热片
公开(公告)号：US4791984A
公开(公告)日：1988-12-20
申请号：US42253
申请日：1987-04-24
申请人： Toshio Hatada , Tomihisa Oouchi , Yoshifumi Kunugi , Shigeo Sugimoto , Junichi Kaneko
发明人： Toshio Hatada , Tomihisa Oouchi , Yoshifumi Kunugi , Shigeo Sugimoto , Junichi Kaneko
IPC分类号： F28F1/32 , F28D1/04
CPC分类号： F28F1/32
摘要： The present invention relates to a louvered heat transfer fin in which the air-passing resistance of the louver is varied so as to increase the overall heat exchange quantity, and thereby to greatly enhance the heat transfer performance of the fin. The arrangement of each louver is such that the projection area in the vicinity of the longitudinal central portion of the louver projected in the direction in which air passes is larger than the projection area of each of the longitudinal end sides of the louver projected in the same direction.
摘要翻译：本发明涉及一种百叶窗传热翅片，其中改变百叶窗的通气阻力以增加总热交换量，从而大大提高翅片的传热性能。每个百叶窗的布置使得沿着空气通过的方向投影的百叶窗的纵向中心部分附近的投影面积大于投影在其中的百叶窗的每个纵向端侧的投影面积方向。

4. 发明授权

US5705850A Semiconductor module 失效
标题翻译：半导体模块
公开(公告)号：US5705850A
公开(公告)日：1998-01-06
申请号：US290155
申请日：1994-08-15
申请人： Noriyuki Ashiwake , Takahiro Daikoku , Kenichi Kasai , Keizou Kawamura , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Toshiki Iino
发明人： Noriyuki Ashiwake , Takahiro Daikoku , Kenichi Kasai , Keizou Kawamura , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Toshiki Iino
IPC分类号： H01L23/36 , H01L23/433 , H01L23/473 , H01L21/10 , H01L23/34 , H02B1/00 , H02B1/01
CPC分类号： H01L23/4338 , H01L2224/16 , H01L2224/73253
摘要： The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.
摘要翻译：所公开的发明的目的在于提供一种具有高吸收热变形能力的半导体模块结构，散热能力优异，能够容易地进行维护操作。为此，在本发明的半导体模块中，提供了热导体构件，其各自具有与半导体器件或壳体的内表面接触的区域并且具有相对的传热表面。散热器一体地形成在壳体上。利用这种结构，可以吸收由高的发热密度设计引起的大的热变形，并且同时可以有效地辐射来自半导体器件的热量。

5. 发明授权

US5558493A Forced air cooling apparatus having blower and air current regulating plate that reduces eddy air current at inlet of blower 失效
标题翻译：具有鼓风机和气流调节板的强制空气冷却装置可减少鼓风机入口的涡流
公开(公告)号：US5558493A
公开(公告)日：1996-09-24
申请号：US477653
申请日：1995-06-07
申请人： Yutaka Hayashi , Mitsuo Miyamoto , Michihito Watarai , Takayuki Atarashi , Tetsuya Tanaka , Toshio Hatada , Yoshihiro Takada , Takahiro Daikoku
发明人： Yutaka Hayashi , Mitsuo Miyamoto , Michihito Watarai , Takayuki Atarashi , Tetsuya Tanaka , Toshio Hatada , Yoshihiro Takada , Takahiro Daikoku
IPC分类号： F25D1/00 , C04B28/18 , F04D29/42 , H05K7/20 , F04D29/66
CPC分类号： F04D29/4213
摘要： A forced air cooling apparatus having a blower for blowing air taken in from an intake surface or inlet of the blower to be blown against an electronic device in an installation wherein the blower is mounted for operation on a casing or a rack, and in which the apparatus has a flow regulating plate vertically intersecting the intake surface that is installed immediately before the intake surface. With this construction, eddy air current flow in the vicinity of the intake surface is prevented and the cooling ability obtained from the blower is optimized to thereby attain the effect that the electronic devices can be efficiently cooled without requiring the same separation distance between an intake surface of the blower and a wall surface of the frame or casing in which the blower is installed, as compared with a conventional installation of the same equipment in the same casing without the flow regulating plate.
摘要翻译：一种强制用空气冷却装置，其特征在于，具有鼓风机，所述鼓风机用于将鼓风机从壳体或机架上进行操作的设备中，从鼓风机的进气表面或进气口吸入的空气吹向电子设备，其中，装置具有垂直于入口表面垂直相交的流动调节板，其紧靠在进气表面之前安装。通过这种结构，可以防止在进气表面附近的涡流流动，从鼓风机获得的冷却能力最优化，从而达到能够有效地冷却电子设备的效果，而不需要在进气表面的鼓风机和安装有鼓风机的框架或壳体的壁面相比，与同一设备的常规安装相比，在没有流量调节板的情况下。

6. 发明授权

US5406807A Apparatus for cooling semiconductor device and computer having the same 失效
标题翻译：用于冷却半导体器件的设备和具有该器件的计算机
公开(公告)号：US5406807A
公开(公告)日：1995-04-18
申请号：US77109
申请日：1993-06-16
申请人： Noriyuki Ashiwake , Tadakatsu Nakajima , Shigeyuki Sasaki , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Kenichi Kasai , Akio Idei
发明人： Noriyuki Ashiwake , Tadakatsu Nakajima , Shigeyuki Sasaki , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Kenichi Kasai , Akio Idei
IPC分类号： H01L23/427 , F25D17/02
CPC分类号： H01L23/427 , H01L2924/0002 , Y10S165/908
摘要： An apparatus for cooling semiconductor devices includes a module for cooling semiconductor devices; a refrigerant cooling device for receiving via an outlet pipe the refrigerant discharged through an outlet port of the module to cool the refrigerant; a refrigerant circulation pump for receiving, via a suction pipe, the refrigerant cooled by the refrigerant cooling device and sending the refrigerant to the module via an inlet pipe; and a refrigerant-flow stabilizing mechanism for stabilizing a refrigerant circulation flow discharged from the refrigerant circulation pump to be returned to the refrigerant circulation pump via the module and the refrigerant cooling device. Since the refrigerant-flow stabilizing mechanism stabilize the refrigerant flow, the refrigerant flow can be stably circulated so that the semiconductor devices in the module are stably cooled.
摘要翻译：一种用于冷却半导体器件的设备包括用于冷却半导体器件的模块; 制冷剂冷却装置，用于经由出口管接收通过模块的出口排出的制冷剂以冷却制冷剂; 制冷剂循环泵，其经由吸入管接收由所述制冷剂冷却装置冷却的制冷剂，并且经由入口管将所述制冷剂输送到所述组件; 以及制冷剂流量稳定机构，其使从制冷剂循环泵排出的制冷剂循环流量稳定化，经由模块和制冷剂冷却装置返回到制冷剂循环泵。由于制冷剂流动稳定机构使制冷剂流动稳定，所以可以稳定地循环制冷剂流，使得模块中的半导体器件稳定地冷却。

7. 发明授权

US5270572A Liquid impingement cooling module for semiconductor devices 失效
标题翻译：用于半导体器件的液体冲击冷却模块
公开(公告)号：US5270572A
公开(公告)日：1993-12-14
申请号：US903458
申请日：1992-06-24
申请人： Tadakatsu Nakajima , Shigeo Ohashi , Heikichi Kuwahara , Noriyuki Ashiwake , Motohiro Sato , Toshio Hatsuda , Takahiro Daikoku , Toshio Hatada , Shigeyuki Sasaki , Hiroshi Inouye , Atsuo Nishihara , Kenichi Kasai
发明人： Tadakatsu Nakajima , Shigeo Ohashi , Heikichi Kuwahara , Noriyuki Ashiwake , Motohiro Sato , Toshio Hatsuda , Takahiro Daikoku , Toshio Hatada , Shigeyuki Sasaki , Hiroshi Inouye , Atsuo Nishihara , Kenichi Kasai
IPC分类号： H01L23/44 , H01L23/473 , H05K7/20 , H01L23/02 , H01L25/04
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/12044
摘要： A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.
摘要翻译：一种半导体冷却单元，用于将冷却介质直接喷射到用于高速计算机等的半导体器件的表面上，以有效地从半导体器件移除热量，其中用于将空间分隔成半导体器件放置的区域的分隔构件。每个分隔区域在其顶侧具有开口，并且通过所述开口供给或排出冷却介质的管设置成朝向每个半导体器件的背面的中心部分突出。该管也用于将冷却介质供应集管或冷却介质返回集管分成一部分，从而可以平滑地去除从半导体器件表面产生的气泡，从而冷却介质可以顺利地流动到半导体器件上。

8. 发明授权

US6101837A Ice thermal storage type air-conditioner and ice thermal storage tank 失效
标题翻译：冰蓄冷型空调和冰蓄冷箱
公开(公告)号：US6101837A
公开(公告)日：2000-08-15
申请号：US264871
申请日：1999-03-09
申请人： Masao Imanari , Toshihiko Fukushima , Toshio Hatada , Katsumi Matsubara , Naoto Katsumata
发明人： Masao Imanari , Toshihiko Fukushima , Toshio Hatada , Katsumi Matsubara , Naoto Katsumata
IPC分类号： F24F5/00 , F28D20/02 , F25D17/02
CPC分类号： F24F5/0017 , F28D20/021 , Y02E60/145 , Y02E60/147
摘要： An ice thermal storage type air-conditioner and an ice thermal storage tank, in which unused portions in the ice thermal storage tank is reduced to enhance an ice filling rate in the ice thermal storage tank or to prevent excessive icing from damaging a heat transfer unit. An ice thermal storage type air-conditioner in which heat exchangers are installed in the ice thermal storage tank 1, the heat exchangers having a heightwise size extending from a bottom of the ice thermal storage tank 1 to near a top of a container, and comprising a plurality of flat-shaped plate-type heat transfer units 14 arranged therein in layered manner in a thicknesswise direction
摘要翻译：一种冰蓄热型空调机和冰蓄热箱，其中冰蓄热箱中的未使用部分被减少以提高冰蓄热箱中的冰填充率或防止过度结冰损坏传热单元。一种冰蓄热型空调器，其中热交换器安装在冰蓄热箱1中，该热交换器的高度尺寸从冰蓄热箱1的底部延伸到容器的顶部附近，并且包括多个在厚度方向上以分层方式布置的扁平板式传热单元14

9. 发明授权

US5764483A Cooling unit for electronic equipment 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5764483A
公开(公告)日：1998-06-09
申请号：US730441
申请日：1996-10-15
申请人： Shigeo Ohashi , Toshio Hatada , Shinji Tanaka
发明人： Shigeo Ohashi , Toshio Hatada , Shinji Tanaka
IPC分类号： H05K7/20 , G06F1/20 , H01L23/427 , H01L23/433 , H01L23/473
CPC分类号： G06F1/203 , H01L23/427 , H01L23/433 , H01L23/473 , H01L2924/0002
摘要： Heat generated at heat generating components is efficiently transported to a wall of a metal box serving as a heat dissipation section to cool the heat generating components even in an apparatus, in which box the heat generating components together with other components are mounted. The heat generating components and the heat dissipation section are connected to each other through a thermal transport device having a flexible structure. The heat generating components and the box are readily connected to each other irrespective of the arrangement of components, and heat is efficiently transported by driving the liquid. In the heat dissipation section, because the heat generating components and the wall of the metal box are thermally connected to each other, a high heat dissipation capacity is obtained as heat is diffused extensively into the wall due to a high thermal conductivity of the metal box.
摘要翻译：在发热部件中产生的热量即使在其中安装有发热部件的装置中也能有效地输送到用作散热部分的金属盒的壁上，以冷却发热部件。发热部件和散热部通过具有柔性结构的热传输装置相互连接。不管组件的布置如何，发热部件和箱体彼此容易地连接，并且通过驱动液体而有效地输送热量。在散热部中，由于发热部件和金属盒的壁彼此热连接，因为由于金属盒的高导热性而热量扩散到壁中，所以获得高的散热能力。

10. 发明授权

US5488255A Cooling device for semiconductor packages, having flexible film heat expulsion means 失效
标题翻译：用于半导体封装的冷却装置，具有柔性膜散热装置
公开(公告)号：US5488255A
公开(公告)日：1996-01-30
申请号：US162265
申请日：1993-12-07
申请人： Kazuo Sato , Mitsuhiro Shikida , Shigeo Ohashi , Toshio Hatada , Noriyuki Ashiwake , Shinji Tanaka , Takeshi Harada , Yukio Honda
发明人： Kazuo Sato , Mitsuhiro Shikida , Shigeo Ohashi , Toshio Hatada , Noriyuki Ashiwake , Shinji Tanaka , Takeshi Harada , Yukio Honda
IPC分类号： F04B43/04 , F04B45/047 , H01L23/467 , H02N1/00 , H01L23/34
CPC分类号： H01L23/467 , F04B43/043 , F04B45/047 , H02K99/20 , H02N1/006 , H01L2924/0002 , H01L2924/15192
摘要： A cooling device according to the present invention, in which a space is formed by means of flat electrodes and side plates disposed on the ends of the flat electrodes, and a flexible film fastened in that space in a shape of the letter S, is fixed to a semiconductor package so that one of the flat electrodes is fitted on the semiconductor package. The respective flat electrodes are alternately powered to move the S shaped section of the flexible film.
摘要翻译：根据本发明的冷却装置，其中通过平面电极和设置在平坦电极的端部上的侧板形成空间，并且固定在该空间中的具有字母S的形状的柔性膜被固定到半导体封装，使得一个平板电极安装在半导体封装上。各个扁平电极交替供电以移动柔性膜的S形部分。

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