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1. 发明授权

US08473108B2 Information apparatus and method of optimizing cooling efficiency of air conditioner 失效
标题翻译：优化空调冷却效率的信息装置及方法
公开(公告)号：US08473108B2
公开(公告)日：2013-06-25
申请号：US12993148
申请日：2010-11-09
申请人： Jun Mizuno , Kiyokazu Saigo , Tadakatsu Nakajima , Jun Okitsu
发明人： Jun Mizuno , Kiyokazu Saigo , Tadakatsu Nakajima , Jun Okitsu
IPC分类号： G05B13/00
CPC分类号： H05K7/20836
摘要： An air conditioner that cools inside a room wherein a plurality of server apparatuses is arranged, is driven with high efficiency. An information apparatus is communicatively coupled to a plurality of server apparatuses each capable of implementing a virtual server, stores a relation between a cooling performance and a cooling efficiency of an air conditioner that cools a room wherein the server apparatuses are arranged stores a history of load on each of the server apparatuses, the load being generated by a virtual server implemented in the server apparatus, creates a plurality of virtual server allocation patterns having varying allocations of virtual servers to be implemented by the server apparatuses, simulates, for each of the created allocation patterns, an amount of heat generation of each of the server apparatuses on the basis of the history of load on the server apparatus, seeks a cooling performance required to be offered by the air conditioner on a basis of the simulated amount of heat generation, and identifies the allocation pattern with which the cooling efficiency corresponding to the sought cooling performance is not less than a threshold set in advance.
摘要翻译：驱动多个服务器装置的房间内部进行冷却的空调机被高效率地驱动。信息装置通信地耦合到能够实现虚拟服务器的多个服务器装置，存储冷却服务器装置所在的房间的冷却性能和冷却效率之间的关系存储负载历史在每个服务器设备上，由在服务器设备中实现的虚拟服务器生成的负载创建具有由服务器设备实现的具有不同虚拟服务器分配的多个虚拟服务器分配模式，针对所创建的每个分配模式，基于服务器装置上的负载历史的每个服务器装置的发热量寻求基于模拟发热量由空调提供的冷却性能，并且识别与所寻求的冷却相对应的冷却效率的分配模式性能不低于提前设定的阈值。

2. 发明授权

US08345425B2 Cooling system and electronic apparatus applying the same therein 有权
标题翻译：冷却系统和电子设备
公开(公告)号：US08345425B2
公开(公告)日：2013-01-01
申请号：US12852556
申请日：2010-08-09
申请人： Hiroyuki Toyoda , Tadakatsu Nakajima , Yoshihiro Kondo , Shigeyuki Sasaki , Akio Idei , Shigemasa Satoh
发明人： Hiroyuki Toyoda , Tadakatsu Nakajima , Yoshihiro Kondo , Shigeyuki Sasaki , Akio Idei , Shigemasa Satoh
IPC分类号： H05K7/20
CPC分类号： F28D15/0266 , F28D1/05366 , F28D15/046 , F28F1/325 , F28F13/187 , F28F2215/12 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A cooling system for cooling a CPU 200 mounted on a printed circuit board 100 within a housing thereof, has a heat-receiving jacket 310, being thermally connected with a surface of the CPU generating heat therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof. A condenser 320 receives refrigerant vapor from the heat-receiving jacket for condensing the refrigerant vapor into a liquid by transferring the heat into an outside of the apparatus. A thermo siphon is used for circulating the refrigerant due to phase change thereof, and the condenser has fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also formed flat in a cross-section thereof, for cooling the refrigerant vapor from the heat-receiving jacket on the inner wall surface thereof, efficiently.
摘要翻译：用于冷却安装在其外壳内的印刷电路板100上的CPU 200的冷却系统具有与在其中产生热量的CPU的表面热连接的热接收套310，并且用于蒸发存储在压力中的液体制冷剂 - 减少内部空间的发热。冷凝器320从热接收套管接收制冷剂蒸汽，用于通过将热量传递到设备的外部将制冷剂蒸汽冷凝成液体。热虹吸由于其相变而使制冷剂循环，并且冷凝器沿着制冷剂的流动方向在其内壁表面上具有细槽，并且在其横截面上也形成为平坦的，用于冷却来自受热套的内壁面上的制冷剂蒸气有效。

3. 发明授权

US08155793B2 System and method for controlling air conditioning facilities, and system and method for power management of computer room 有权
标题翻译：控制空调设备的系统和方法，计算机房电源管理系统及方法
公开(公告)号：US08155793B2
公开(公告)日：2012-04-10
申请号：US12544143
申请日：2009-08-19
申请人： Tadakatsu Nakajima , Takeshi Kato , Yoko Shiga , Hitoshi Matsushima
发明人： Tadakatsu Nakajima , Takeshi Kato , Yoko Shiga , Hitoshi Matsushima
IPC分类号： G06F19/00
CPC分类号： G05B19/042 , G05B2219/25387 , G05B2219/2614 , G05B2219/2638
摘要： The present invention relates to a system and method for controlling air conditioning facilities, and a system and method for power management of a computer room. In an air-conditioning facility control system of a computer room (cooling room) equipped with air-conditioning facilities for air-cooling the computer room in which a large number of information processing units are installed, an air-conditioner monitoring and controlling unit calculates a temperature sensitivity coefficient of each information processing unit, and that of each air conditioner, and then determines discharge air temperature of each air conditioner by use of the temperature sensitivity coefficients in such a manner that the sum of squares of a deviation of a change in discharge air temperature of each information processing unit becomes the smallest, and in such a manner that the sum total of the power consumption of the individual air conditioners becomes the smallest.
摘要翻译：本发明涉及一种用于控制空调设备的系统和方法，以及一种用于计算机室的电源管理的系统和方法。在安装有大量信息处理单元的计算机室的空气冷却装置的计算机室（冷却室）的空调设备控制系统中，空调监视控制单元计算每个信息处理单元的温度敏感系数和每个空调的温度敏感度系数，然后通过使用温度敏感度系数来确定每个空调的排出空气温度，使得变化的偏差的平方和每个信息处理单元的排出空气温度变得最小，并且使得各个空调的功率消耗的总和变得最小。

4. 发明授权

US08145927B2 Operation management method of information processing system 有权
标题翻译：信息处理系统的运行管理方法
公开(公告)号：US08145927B2
公开(公告)日：2012-03-27
申请号：US13003687
申请日：2009-03-09
申请人： Jun Okitsu , Takeshi Kato , Tatsuya Saito , Tadakatsu Nakajima
发明人： Jun Okitsu , Takeshi Kato , Tatsuya Saito , Tadakatsu Nakajima
IPC分类号： G06F1/26 , G05D23/19
CPC分类号： G06F1/206 , G06F1/3203 , G06F9/5027 , G06F9/5094 , Y02D10/16 , Y02D10/22
摘要： In a computer room including information processing devices and air conditioners, power saving of the computer room by means of optimization of workload allocation to the information processing devices is achieved in a short time. There, a coefficient of air conditioner performance with respect to the information processing device (device-specific COP) is calculated for each air conditioner. Further, a device-associated power consumption expression representing a total of device power and air conditioner power is created for each information processing device. Also, power consumption of the entire computer room is calculated from the device-associated power consumption expression of the information processing devices. Also, workload allocation is determined by using power saving performance evaluation indexes based on the device-associated power consumption expression of the information processing devices. Further, output of the air conditioner is controlled based on a result of the air conditioner power calculation.
摘要翻译：在包括信息处理装置和空调的计算机室中，通过优化在信息处理装置中的工作量分配来实现计算机室的省电在短时间内。在此，针对各空调器计算出相对于信息处理装置（装置专用COP）的空调机性能系数。此外，为每个信息处理设备创建表示设备功率和空调功率的总和的与设备相关联的功耗表达式。而且，根据信息处理设备的设备相关功耗表达式计算整个计算机房的功耗。此外，通过使用基于信息处理装置的与设备相关联的功耗表达式的节电性能评估指标来确定工作负荷分配。此外，基于空调机功率计算的结果来控制空调的输出。

5. 发明授权

US07836712B2 Air conditioning apparatus 有权
标题翻译：空调设备
公开(公告)号：US07836712B2
公开(公告)日：2010-11-23
申请号：US11528653
申请日：2006-09-28
申请人： Keiji Sasao , Tadakatsu Nakajima
发明人： Keiji Sasao , Tadakatsu Nakajima
IPC分类号： F25B49/00
CPC分类号： F24F11/0008 , F24F11/30 , F24F2110/12 , F24F2110/20
摘要： An air conditioning apparatus comprises an air-conditioning unit including at least a cooling coil as a heat exchanger, a blower, a chiller, and a coolant pump for conducting air-conditioning, wherein the coolant pump pumps the coolant cooled by the chiller to the cooling coil, the cooling coil cools the air through heat exchange of the coolant and the air, the blower supplies the cooled air into a room. Coolant temperature of the chiller, the coolant flow rate of the coolant pump, and the air flow rate of the blower are calculated in accordance with the set points of the indoor temperature and the indoor humidity, and the chiller, coolant pump, and blower are controlled on the basis of the arithmetic calculation results. Thereby, the indoor temperature and indoor humidity are independently controlled in the central air-conditioning system.
摘要翻译：空调装置包括至少包括作为热交换器的冷却盘管，鼓风机，冷却器和用于进行空调的冷却水泵的空调单元，其中，冷却剂泵将由冷却器冷却的冷却剂泵送到冷却盘管，冷却盘管通过冷却剂和空气的热交换冷却空气，鼓风机将冷却的空气送入房间。根据室内温度和室内湿度的设定点计算冷却器的冷却液温度，冷却水泵的冷却剂流量和鼓风机的空气流量，制冷机，冷却水泵和鼓风机均为在算术计算结果的基础上进行控制。因此，室内温度和室内湿度在中央空调系统中独立控制。

6. 发明申请

US20100106988A1 CONTROL METHOD WITH MANAGEMENT SERVER APPARATUS FOR STORAGE DEVICE AND AIR CONDITIONER AND STORAGE SYSTEM 失效
标题翻译：用于存储设备和空调和存储系统的管理服务器设备的控制方法
公开(公告)号：US20100106988A1
公开(公告)日：2010-04-29
申请号：US12361816
申请日：2009-01-29
申请人： Shinichi Hayashi , Yuichi Taguchi , Katsumi Ouchi , Yoko Shiga , Takeshi Kato , Jun Okitsu , Tadakatsu Nakajima
发明人： Shinichi Hayashi , Yuichi Taguchi , Katsumi Ouchi , Yoko Shiga , Takeshi Kato , Jun Okitsu , Tadakatsu Nakajima
IPC分类号： G06F1/32 , G06F15/173
CPC分类号： G06F1/206 , G06F1/3221 , G06F1/3268 , G06F3/0625 , G06F3/0647 , G06F3/067 , G06F9/5011 , G06F9/5094 , G06F2206/1012 , H05K7/20836 , Y02D10/154 , Y02D10/16 , Y02D10/22
摘要： To provide a system that can reduce the power consumption of an air conditioner and the power consumption of a storage device. A control method with a management server apparatus for a plurality of storage devices and an air conditioner includes calculating plural combinations of allocating the work amount to the plurality of storage devices, calculating the heating value of each storage device included in the plurality of storage devices for each of the plural combinations, calculating the quantity of heat conducted to the air conditioner, based on the heating value and positional information of the plurality of storage devices and the air conditioner, calculating the power consumption to cool the quantity of heat conducted to the air conditioner, selecting a combination included in the plural combinations based on the power consumption of the air conditioner, and issuing a move instruction of moving the data stored in a first storage device to a second storage device to the plurality of storage devices, based on the selected combination.
摘要翻译：提供能够降低空调机的功耗和存储装置的功耗的系统。一种具有用于多个存储装置的管理服务器装置和空调的控制方法，包括：计算向多个存储装置分配工作量的多个组合，计算包含在多个存储装置中的各个存储装置的发热量，以供根据多个存储装置和空调机的发热值和位置信息，计算向空调机传导的热量的计算多个组合中的每一个，计算用于冷却传导到空气的热量的功率消耗调节器，基于空调的功率消耗来选择包含在多个组合中的组合，并且基于所述第一存储装置向所述多个存储装置发出将存储在第一存储装置中的数据移动到所述第二存储装置的移动指令选择组合。

7. 发明申请

US20100073866A1 COOLING DEVICE AND ELECTRONIC EQUIPMENT INCLUDING COOLING DEVICE 有权
标题翻译：冷却装置和包括冷却装置的电子设备
公开(公告)号：US20100073866A1
公开(公告)日：2010-03-25
申请号：US12544166
申请日：2009-08-19
申请人： Hiroyuki TOYODA , Akio Idei , Shigeyasu Tsubaki , Tadakatsu Nakajima , Yoshihiro Kondo , Tomoo Hayashi
发明人： Hiroyuki TOYODA , Akio Idei , Shigeyasu Tsubaki , Tadakatsu Nakajima , Yoshihiro Kondo , Tomoo Hayashi
IPC分类号： H05K7/20 , F28F13/00
CPC分类号： F28D15/043 , F28D15/046 , H01L2924/0002 , H05K7/20809 , H01L2924/00
摘要： A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.
摘要翻译：提供了包括具有高性能CPU的冷却结构的刀片服务器。为了提高滞留在翅片之间的冷凝工作流体的排水性能，使用蒸气冷凝管，在上述管内表面上沿与管轴方向大致平行的方向形成有槽，上述散热片的一排在上述槽的侧面露出，当上述槽位于上述的蒸汽冷凝管的管轴方向的中心线时，上述槽沿垂直方向配置在下侧将上述凹槽安装在上述蒸汽冷凝管中，并且将具有小于上述翅片排的翅片空间的线空间的芯填充在上述凹槽内。

8. 发明申请

US20100073863A1 ELECTRONIC APPARATUS 有权
标题翻译：电子设备
公开(公告)号：US20100073863A1
公开(公告)日：2010-03-25
申请号：US12544153
申请日：2009-08-19
申请人： Hitoshi MATSUSHIMA , Tadakatsu Nakajima , Takayuki Atarashi , Yoshihiro Kondo , Hiroyuki Toyoda , Tomoo Hayashi , Akio Idei , Shigeyasu Tsubaki , Takumi Sugiura , Yasuhiro Kashirajima
发明人： Hitoshi MATSUSHIMA , Tadakatsu Nakajima , Takayuki Atarashi , Yoshihiro Kondo , Hiroyuki Toyoda , Tomoo Hayashi , Akio Idei , Shigeyasu Tsubaki , Takumi Sugiura , Yasuhiro Kashirajima
IPC分类号： H05K7/20
CPC分类号： H05K7/20809 , H05K7/20245
摘要： An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.
摘要翻译：诸如刀片服务器等的电子设备具有冷却系统，用于有效地冷却安装在自由放置和取出的叶片上的诸如CPU的多个发热半导体器件。冷却系统包括将来自具有较高发热量的装置（例如CPU等）的热量传递到设备外部的热虹吸管，将热发生相对低的装置的热传递到热虹吸管的热管，其通过将叶片安装到壳体中而热耦合到热虹吸管并且收集和传递来自热虹吸管和热管的热量，以及冷凝器，其将由热力公路收集和传送的热量传送到壳体外部。

9. 发明申请

US20100027216A1 Cooling Systems and Electronic Apparatus 有权
标题翻译：冷却系统和电子设备
公开(公告)号：US20100027216A1
公开(公告)日：2010-02-04
申请号：US12370651
申请日：2009-02-13
申请人： Hitoshi MATSUSHIMA , Hiroshi Fukuda , Tadakatsu Nakajima
发明人： Hitoshi MATSUSHIMA , Hiroshi Fukuda , Tadakatsu Nakajima
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： H05K7/20745
摘要： Temperature variation among electronic apparatuses installed in the data center is reduced, enhancement in reliability of the electronic apparatuses, and increase in service life are achieved, and efficient cooling of an electronic apparatus group is realized. Further, an electronic apparatus with low noise is provided. A front cover is provided on a front surface of an electronic apparatus, and a back cover is provided on a rear surface of it. A supplied air opening is formed at a lower side of the front cover, and an exhaust air opening is formed at an upper side of the back cover. The supplied air opening is connected to a blowing in opening from below the floor level, and the exhaust air opening is connected to a ceiling air duct. The ceiling air duct is provided with a heat exchanger, and indirect heat exchange is performed with external air.
摘要翻译：安装在数据中心的电子设备之间的温度变化减小，电子设备的可靠性提高，使用寿命延长，实现电子设备组的有效冷却。此外，提供了具有低噪声的电子设备。前盖设置在电子设备的前表面上，后盖设置在其后表面上。在前盖的下侧形成供气口，在后盖的上侧形成有排气开口。所供给的空气开口与地板下方的开口连通，排气口与天花板导风管连接。天花板风管设有热交换器，并且用外部空气进行间接热交换。

10. 发明申请

US20090154104A1 Cooling Device and Electronic Apparatus Using the Same 有权
标题翻译：冷却装置及其使用的电子设备
公开(公告)号：US20090154104A1
公开(公告)日：2009-06-18
申请号：US12328967
申请日：2008-12-05
申请人： Yoshihiro Kondo , Akio Idei , Shigeyasu Tsubaki , Hitoshi Matsushima , Tadakatsu Nakajima , Hiroyuki Toyoda , Tomoo Hayashi , Tatsuya Saito , Takeshi Kato , Kenji Ogiro
发明人： Yoshihiro Kondo , Akio Idei , Shigeyasu Tsubaki , Hitoshi Matsushima , Tadakatsu Nakajima , Hiroyuki Toyoda , Tomoo Hayashi , Tatsuya Saito , Takeshi Kato , Kenji Ogiro
IPC分类号： H05K7/20
CPC分类号： H05K7/20809 , G06F1/20 , G06F2200/201 , H05K7/20781
摘要： It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.
摘要翻译：本发明的目的是提供一种用于最佳地冷却CPU刀片上的半导体器件的冷却装置，该刀片使用具有紧凑结构的冷却装置相对于电子设备可拆卸，以降低功耗。一种用于冷却设置在电子设备的壳体中的电子电路基板上的半导体器件的冷却装置，包括：第一冷却单元，包括第一吸热部分和第一放热部分;第二冷却单元，包括第二吸热部分部分和第二散热部分，其中第一吸热部分设置成与半导体器件接触，第二吸热部分可拆卸地设置成与第一散热部分接触，相变制冷剂包含在第一散热部分中冷却单元，第二散热部设置在壳体的外部。

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