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1. 发明授权

US5361188A Cooling apparatus of electronic equipment 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5361188A
公开(公告)日：1994-11-01
申请号：US115669
申请日：1993-09-02
申请人： Yoshihiro Kondou , Hitoshi Matsushima , Toshio Hatada , Hiroshi Inouye , Toshihiro Komatsu , Takao Ohba , Akira Yamagiwa
发明人： Yoshihiro Kondou , Hitoshi Matsushima , Toshio Hatada , Hiroshi Inouye , Toshihiro Komatsu , Takao Ohba , Akira Yamagiwa
IPC分类号： H05K7/20 , H01L23/467
CPC分类号： H01L23/467 , H05K7/20563 , H01L2224/32 , H01L2224/73253 , Y10S165/908
摘要： In a cooling apparatus of an electronic equipment, a plurality each of integrated circuit devices and large-scale integrated circuit devices are mounted onto a plurality of substrates, respectively, and a cooling fan supplies cooling air from outside to each of these integrated circuit devices. A duct having a comb-tooth shape suitable for encompassing each substrate and defining flow paths along the substrates introduces the cooling air supplied by the cooling fan to each of the integrated circuit devices. The duct includes a plurality of small holes disposed at positions corresponding to the positions of the integrated circuit devices on the substrates and having open areas corresponding to the heating values of the integrated circuit devices. The small holes flow the cooling air supplied by the cooling fan as jet streams to the integrated circuit devices. This jet stream cooling improves cooling performance and can make uniform the temperature distribution of the integrated circuit devices.
摘要翻译：在电子设备的冷却装置中，分别将多个集成电路装置和大型集成电路装置安装在多个基板上，并且冷却风扇从外部向这些集成电路装置中的每一个提供冷却空气。具有适于包围每个基板并且沿着基板限定流动路径的梳齿形状的管道将由冷却风扇供应的冷却空气引入到每个集成电路装置。导管包括多个小孔，其设置在与基板上的集成电路器件的位置对应的位置处，并且具有与集成电路器件的发热值对应的开放区域。这些小孔将作为喷射流的冷却风扇供给的冷却空气流向集成电路装置。这种喷射流冷却改善了冷却性能，并且可以使集成电路器件的温度分布均匀。

2. 发明授权

US5195576A LSI cooling apparatus and computer cooling apparatus 失效
标题翻译： LSI冷却装置和计算机冷却装置
公开(公告)号：US5195576A
公开(公告)日：1993-03-23
申请号：US659671
申请日：1991-02-25
申请人： Toshio Hatada , Hitoshi Matsushima , Yoshihiro Kondou , Hiroshi Inoue , Kanji Otsuka , Yuji Shirai , Takao Ohba , Akira Yamagiwa
发明人： Toshio Hatada , Hitoshi Matsushima , Yoshihiro Kondou , Hiroshi Inoue , Kanji Otsuka , Yuji Shirai , Takao Ohba , Akira Yamagiwa
IPC分类号： H01L23/473 , F28F3/02 , H01L23/367 , H01L23/467 , H05K7/10 , H05K7/20
CPC分类号： F28F3/022 , H01L23/3672 , H01L23/3677 , H01L23/467 , H05K7/1015 , H01L2224/45015 , H01L2224/49109 , H01L24/49 , H01L2924/00014 , H01L2924/01014 , H01L2924/01068 , H01L2924/16195
摘要： An LSI cooling apparatus having various structures is used in electronic devices such as computer systems. In particular, the LSI cooling of apparatus is suitable for cooling of LSIs having high heat generating densities. In a cooling apparatus of the present invention, a heat sink is constructed to be small in pressure loss and excellent in cooling performance. This is because the heat sink comprises thin wire fins so set that the Reynold's number may not exceed 40. As a result, LSIs generating a large amount of heat can be cooled. Further, a heat sink having rigidity can be obtained by disposing wide-width wire drawn substances in thin wires or by using supports. Further, a computer comprising LSIs equipped with heat sinks can cope with various cooling air sending methods and it can be cooled with low noises.
摘要翻译：具有各种结构的LSI冷却装置用于诸如计算机系统的电子设备中。特别地，装置的LSI冷却适用于具有高发热密度的LSI的冷却。在本发明的冷却装置中，散热器的压力损失小，冷却性能优异。这是因为散热器包括细线散热片，使得雷诺数不得超过40个。结果，可以冷却产生大量热量的LSI。此外，通过将宽幅拉丝物质设置在细线中或通过使用支撑体，可以获得具有刚性的散热器。此外，包括散热器的LSI的计算机可以应对各种冷却空气送出方法，并且可以以低噪声进行冷却。

3. 发明授权

US5504924A Cooling system of electronic computer using flexible members in contact with semiconductor devices on boards 失效
标题翻译：使用与板上的半导体器件接触的柔性部件的电子计算机的冷却系统
公开(公告)号：US5504924A
公开(公告)日：1996-04-02
申请号：US317621
申请日：1994-09-26
申请人： Shingeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Toshio Hatada , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa
发明人： Shingeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Toshio Hatada , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa
IPC分类号： G06F1/00 , F28D15/02 , G06F1/20 , H05K7/20 , G06F9/00
CPC分类号： H05K7/208 , F28D15/0233 , F28D15/0275 , G06F1/20 , G06F1/206 , H05K7/20809 , G06F2200/201
摘要： An electronic computer cooling system having a cooling apparatus to cool an electronic computer and cooling members for thermally connecting semiconductor devices whose operating speeds are raised by cooling to a low temperature source of the cooling apparatus. Circuit boards onto which the semiconductor devices and the like constructing the electronic computer are mounted and the cooling apparatus such as a refrigerating apparatus and the like are compactly enclosed in a single casing. Or, the circuit boards and the cooling apparatus are compactly enclosed in separate detachable casings, respectively. Thus, a structure in which desired semiconductor devices can be certainly cooled by using the cooling members is obtained.
摘要翻译：一种电子计算机冷却系统，其具有用于冷却电子计算机的冷却装置和用于热连接半导体装置的冷却构件，所述冷却构件的工作速度通过冷却而升高到所述冷却装置的低温源。安装构成电子计算机的半导体装置等的电路板被紧凑地封闭在一个壳体中，诸如制冷装置等的冷却装置。或者，电路板和冷却装置分别紧密地封闭在分离的可拆卸的外壳中。因此，可以获得通过使用冷却部件可靠地冷却期望的半导体器件的结构。

4. 发明授权

US5365402A Cooling apparatus of electronic device 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5365402A
公开(公告)日：1994-11-15
申请号：US800268
申请日：1991-11-29
申请人： Toshio Hatada , Shigeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa , Kanji Otsuka , Yuuji Shirai
发明人： Toshio Hatada , Shigeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa , Kanji Otsuka , Yuuji Shirai
IPC分类号： H01L23/36 , H01L23/367 , H01L23/40 , H01L23/433 , H05K7/20
CPC分类号： H01L23/433 , H01L23/3677 , H01L23/4006 , H01L2023/405 , H01L2224/32188 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/15312 , H01L2924/1532 , H01L2924/16195
摘要： A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer may also be in close contact with a large number of semiconductor chips having various configurations which are mounted on a board, so that the elastomer is thermally connected with them, whereby the elastomer absorbs thermal deformations.
摘要翻译：一种用于高热密度的电子装置的冷却装置，包括插入在半导体芯片和散热片之间的弹性体，以便将它们热连接。弹性体还可以与安装在板上的具有各种构造的大量半导体芯片紧密接触，使得弹性体与它们热连接，由此弹性体吸收热变形。

5. 发明授权

US5428503A Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon 失效
标题翻译：用于冷却电子设备的喷射冷却装置和安装在其上的计算机
公开(公告)号：US5428503A
公开(公告)日：1995-06-27
申请号：US317614
申请日：1994-09-26
申请人： Hitoshi Matsushima , Toshihiro Komatu , Yoshihiro Kondou , Toshio Hatada , Susumu Iwai , Tetsuro Honma , Toshiki Iino , Takao Ohba , Akira Yamagiwa
发明人： Hitoshi Matsushima , Toshihiro Komatu , Yoshihiro Kondou , Toshio Hatada , Susumu Iwai , Tetsuro Honma , Toshiki Iino , Takao Ohba , Akira Yamagiwa
IPC分类号： H05K7/20
CPC分类号： H05K7/20154 , Y10S165/908
摘要： A cooling apparatus for electronic equipment for improving the reliability of the equipment by making uniform the temperature distribution of heat generating devices mounted on the electronic equipment, more particularly on a computer and for reducing the working process required at the time of performing a maintenance of a printed circuit board in the electronic equipment by stacking, in a frame, the electronic printed circuit boards on which the heat generating devices, such as a CPU and memories, are mounted at predetermined intervals. The cooling apparatus has a fan fastened to one wall surface of a chamber and a plurality of jet cooling devices formed on the surface opposing the wall surface. The jet cooling devices are formed in parallel to the printed circuit boards. The jet cooling devices are slits, or nozzles or jet stream ducts extending among the printed circuit boards and are so formed as to supply cooling air in a jet stream state to each heat generating device. Therefore, the cooling air can be concentrated to locally cool the printed circuit board including the device that generates heat of a large heating value. Hence, the temperature rise in the heat generating devices can be made uniform.
摘要翻译：一种用于电子设备的冷却装置，用于通过使安装在电子设备上的发热装置的温度分布均匀，更具体地在计算机上，并且为了减少进行维护时所需的工作过程而提高设备的可靠性电子设备中的印刷电路板通过在框架中堆叠以预定间隔安装诸如CPU和存储器的发热装置的电子印刷电路板。冷却装置具有固定在室的一个壁表面上的风扇和形成在与壁表面相对的表面上的多个喷射冷却装置。喷射冷却装置与印刷电路板平行地形成。喷射冷却装置是在印刷电路板之间延伸的狭缝或喷嘴或喷射流管道，并且形成为将喷射流状态的冷却空气供应到每个发热装置。因此，冷却空气可以集中以局部冷却印刷电路板，包括产生大热值的热的装置。因此，能够使发热元件的温度上升均匀。

6. 发明授权

US5796580A Air-cooled information processing apparatus having cooling air fan, sub-fan, and plural separated cooling air flow channels 失效
标题翻译：具有冷却风扇，副风扇和多个分离的冷却空气流动通道的风冷信息处理设备
公开(公告)号：US5796580A
公开(公告)日：1998-08-18
申请号：US226824
申请日：1994-04-13
申请人： Toshihiro Komatsu , Hitoshi Matsushima , Toshio Hatada , Susumu Iwai , Tetsuro Homma , Yoshihiro Kondo , Shouhei Fuse , Hiroshi Yamada , Kazuo Morita , Hiroshi Ito , Akiyoshi Iida , Kenta Kumagai , Shinichi Shimode
发明人： Toshihiro Komatsu , Hitoshi Matsushima , Toshio Hatada , Susumu Iwai , Tetsuro Homma , Yoshihiro Kondo , Shouhei Fuse , Hiroshi Yamada , Kazuo Morita , Hiroshi Ito , Akiyoshi Iida , Kenta Kumagai , Shinichi Shimode
IPC分类号： G06F1/20 , H05K7/20 , G06F1/16
CPC分类号： H05K7/20727 , G06F1/20
摘要： An air-cooled information processing apparatus has a plurality of units and a casing accommodating the units. At least one cooling air supply section and at least one cooling air discharge section are provided in the casing, for supplying cooling air into the apparatus and for discharging the air therefrom. A partition member divides the space inside the casing so as to define at least two cooling air flow channels between the cooling air supply section and the cooling air discharge section. At least one main fan unit is disposed in each of the cooling air flow channels. The cooling air flow channels include at least one first cooling air flow channel in which at least two units from among the plurality of units are disposed in parallel with each other with respect to the direction of flow of cooling air, and at least one second cooling air flow channel in which at least two units from among the plurality of units are arranged in series to each other along the flow of cooling air. This cooling arrangement ensures optimum cooling for different types of units in the apparatus, without being accompanied by rise in the noise level, rate of discharge of air, power consumption and production cost.
摘要翻译：风冷信息处理装置具有多个单元和容纳该单元的壳体。至少一个冷却空气供应部分和至少一个冷却空气排放部分设置在壳体中，用于将冷却空气供给到设备中并从中排出空气。分隔构件将壳体内的空间分隔开，以便在冷却空气供应部分和冷却空气排放部分之间限定至少两个冷却空气流动通道。至少一个主风扇单元设置在每个冷却空气流动通道中。冷却空气流动通道包括至少一个第一冷却空气流动通道，其中多个单元中的至少两个单元相对于冷却空气的流动方向彼此平行地设置，并且至少一个第二冷却空气流动通道，其中来自多个单元中的至少两个单元沿着冷却空气的流动彼此串联布置。该冷却装置确保了设备中不同类型单元的最佳冷却，而不伴随着噪声水平，空气排放速率，功率消耗和生产成本的上升。

7. 发明授权

US08292323B2 Knee airbag device for vehicle 有权
标题翻译：膝盖安全气囊装置
公开(公告)号：US08292323B2
公开(公告)日：2012-10-23
申请号：US13057509
申请日：2009-07-24
申请人： Hitoshi Matsushima , Osamu Fukawatase
发明人： Hitoshi Matsushima , Osamu Fukawatase
IPC分类号： B60R21/16
CPC分类号： B60R21/233 , B60R21/206 , B60R21/231 , B60R21/2338 , B60R21/2346 , B60R2021/23169 , B60R2021/23324 , B60R2021/23382
摘要： A load on the shins when a knee airbag is deployed by inflating in a state in which the knees of an occupant are proximate to an airbag door or suchlike is moderated. Inside a knee airbag, an upper tether and a lower tether are disposed to sandwich an inflator from above and below. First opening portions and second opening portions for letting gas flow through up and down are alternatingly formed in the upper tether and the lower tether. The second opening portions are formed as circular holes with smaller diameters than the first opening portions. The second opening portions are disposed at positions opposing the knees of a small occupant in a sitting state.
摘要翻译：膝盖安全气囊在乘客的膝盖靠近安全气囊门等的状态下通过充气而展开时的负载被缓和。在膝盖安全气囊内部，设置有上部系绳和下部系绳以将充气器从上方和下方夹住。用于使气体上下流动的第一开口部分和第二开口部分交替地形成在上部系绳和下部系绳中。第二开口部形成为具有比第一开口部小的直径的圆形孔。第二开口部配置在与坐着状态的小乘员的膝盖相对的位置。

8. 发明授权

US08215666B2 Knee air bag device for vehicle 失效
标题翻译：车载气囊装置
公开(公告)号：US08215666B2
公开(公告)日：2012-07-10
申请号：US12678902
申请日：2008-09-17
申请人： Osamu Fukawatase , Hitoshi Matsushima
发明人： Osamu Fukawatase , Hitoshi Matsushima
IPC分类号： B60R21/206 , B60R21/2165
CPC分类号： B60R21/206 , B60R21/205 , B60R21/2165 , B60R2021/0051 , B60R2021/23169
摘要： An air bag door is developed quickly even if the clearance between the grab door outer and the knee of a crew or passenger is narrow when a tier type air bag door is employed in a knee air bag device for vehicle. A fracture portion (50) consisting of a lateral fracture portion (50A) and longitudinal fracture portions (50B, 50C) is formed in the grab door outer general portion (24A). Thus, an air bag door (52) consisting of total six doors, i.e. an upper central air bag door (52A), an upper left side air bag door (52B), an upper right side air bag door (52C), a lower central air bag door (52D), a lower left side air bag door (52E), and a lower right side air bag door (52F), is formed. Even if both knees of the crewman or passenger of a small-sized build are arranged in proximity to or in contact with the lower left side air bag door (52E) and the lower right side air bag door (52F), the lower central air bag door (52D) opens smoothly between both the knees in addition to the upper side air bag doors in the initial stage of development of the air bag door (52).
摘要翻译：即使当车辆的膝盖气囊装置中使用层状气囊门时，即使机组人员或乘客的抓斗外部和膝盖之间的间隙较窄，气囊门也迅速发展。在抓斗门外通用部分（24A）中形成有由侧向断裂部分（50A）和纵向断裂部分（50B，50C）构成的断裂部分（50）。因此，由总共六个门组成的气囊门（52），即上部中央气囊门（52A），左上侧气囊门（52B），右上侧气囊门（52C），下部形成中央气囊门（52D），左下侧气囊门（52E）和右下侧气囊门（52F）。即使小型建筑物的乘员或乘客的膝盖都布置在左下方安全气囊门52E和下右侧气囊门52f附近或接触处，下部中央空气在安全气囊门（52）的初始阶段，除了上侧气囊门之外，袋子门52D也平滑地打开。

9. 发明授权

US08186707B2 Knee airbag device for a vehicle 有权
标题翻译：膝盖安全气囊装置
公开(公告)号：US08186707B2
公开(公告)日：2012-05-29
申请号：US12676958
申请日：2008-12-18
申请人： Hitoshi Matsushima , Osamu Fukawatase
发明人： Hitoshi Matsushima , Osamu Fukawatase
IPC分类号： B60R21/206 , B60R21/2338
CPC分类号： B60R21/206 , B60R21/2338 , B60R21/2346 , B60R2021/23169 , B60R2021/23382
摘要： In a knee airbag device for a vehicle, which has upper and lower tethers that extend in a vehicle width direction and regulate a bag thickness of an airbag, and in which gas from an inflator is supplied between the upper and lower tethers, it is aimed to make a flow of the gas toward an upper portion and a lower portion from between the upper and lower tethers at the inside of the knee airbag smoother, and to improve deployability of the knee airbag in a vehicle vertical direction.Upper and lower tethers 16 and 18 are arranged to be separated from each other in the vehicle vertical direction and are formed so that a vertical clearance therebetween increases approaching both vehicle width direction end portions 16A and 18A thereof. When the gas is supplied between the upper and lower tethers 16 and 18, the gas spreads to both vehicle width direction sides along the tethers 16 and 18 and smoothly moves around into an upper portion 14A and a lower portion 14B of a knee airbag 14 from both of the end portions 16A and 18A of the tethers 16 and 18.
摘要翻译：在车辆用膝部安全气囊装置中，其具有在车辆宽度方向上延伸并且调节气囊的袋厚度的上部和下部系绳，并且其中来自充气器的气体供应在上部和下部系绳之间，其被瞄准使得气囊朝向膝盖内侧的上部和下部系绳之间的上部和下部流动更平滑，并且提高了膝部安全气囊在车辆垂直方向上的展开能力。上部和下部系绳16和18布置成在车辆垂直方向上彼此分离，并且形成为使得它们之间的垂直间隙增加接近其车辆宽度方向端部16A和18A。当气体供应在上部和下部系绳16和18之间时，气体沿着系绳16和18扩展到两个车辆宽度方向侧，并且平稳地从膝部安全气囊14的上部14A和下部14B移动到系绳16和18的端部16A和18A两者。

10. 发明授权

US08164902B2 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US08164902B2
公开(公告)日：2012-04-24
申请号：US12544153
申请日：2009-08-19
申请人： Hitoshi Matsushima , Tadakatsu Nakajima , Takayuki Atarashi , Yoshihiro Kondo , Hiroyuki Toyoda , Tomoo Hayashi , Akio Idei , Shigeyasu Tsubaki , Takumi Sugiura , Yasuhiro Kashirajima
发明人： Hitoshi Matsushima , Tadakatsu Nakajima , Takayuki Atarashi , Yoshihiro Kondo , Hiroyuki Toyoda , Tomoo Hayashi , Akio Idei , Shigeyasu Tsubaki , Takumi Sugiura , Yasuhiro Kashirajima
IPC分类号： H05K7/20
CPC分类号： H05K7/20809 , H05K7/20245
摘要： An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.
摘要翻译：诸如刀片服务器等的电子设备具有冷却系统，用于有效地冷却安装在自由放置和取出的叶片上的诸如CPU的多个发热半导体器件。冷却系统包括将来自具有较高发热量的装置（例如CPU等）的热量传递到设备外部的热虹吸管，将热发生相对低的装置的热传递到热虹吸管的热管，其通过将叶片安装到壳体中而热耦合到热虹吸管并且收集和传递来自热虹吸管和热管的热量，以及冷凝器，其将由热力公路收集和传送的热量传送到壳体外部。

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