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    • 25. 发明授权
    • Method of manufacturing shallow trench isolation
    • 制造浅沟槽隔离的方法
    • US06251783B1
    • 2001-06-26
    • US09189847
    • 1998-11-12
    • Tri-Rung YewKuo-Tai HuangGwo-Shii YangWater Lur
    • Tri-Rung YewKuo-Tai HuangGwo-Shii YangWater Lur
    • H01L21302
    • H01L21/31053H01L21/76229
    • A method of manufacturing shallow trench isolation structures. The method includes the steps of depositing insulating material into the trench of a substrate to form an insulation layer. The substrate has a plurality of active regions, each occupying a different area and having different sizes. In addition, there is a silicon nitride layer on top of each active region. Thereafter, a photoresist layer is then deposited over the insulation layer. Next, a portion of the photoresist layer is etched back to expose a portion of the oxide layer so that the remaining photoresist material forms a cap layer over the recessed area of the insulation layer. Subsequently, using the photoresist cap layer as a mask, the insulation layer is etched to remove a portion of the exposed oxide layer, thereby forming trenches within the oxide layer. After that, the photoresist cap layer is removed. Finally, a chemical-mechanical polishing operation is carried out to polish the insulation layer until the silicon nitride layer is exposed.
    • 制造浅沟槽隔离结构的方法。 该方法包括以下步骤:将绝缘材料沉积到衬底的沟槽中以形成绝缘层。 基板具有多个活性区域,每个活性区域占据不同的区域并且具有不同的尺寸。 此外,在每个有源区的顶部有一个氮化硅层。 此后,然后将光致抗蚀剂层沉积在绝缘层上。 接下来,将光致抗蚀剂层的一部分回蚀刻以暴露氧化物层的一部分,使得剩余的光致抗蚀剂材料在绝缘层的凹陷区域上形成覆盖层。 随后,使用光致抗蚀剂覆盖层作为掩模,蚀刻绝缘层以去除暴露的氧化物层的一部分,从而在氧化物层内形成沟槽。 之后,去除光致抗蚀剂覆盖层。 最后,进行化学机械抛光操作以抛光绝缘层,直到暴露氮化硅层。
    • 28. 发明授权
    • Method of fabricating DRAM capacitor
    • 制造DRAM电容的方法
    • US06218238B1
    • 2001-04-17
    • US09172458
    • 1998-10-14
    • Kuo-Tai HuangWen-Yi HsiehTri-Rung Yew
    • Kuo-Tai HuangWen-Yi HsiehTri-Rung Yew
    • H01L218242
    • H01L28/75H01L21/28568H01L21/3211H01L27/10852H01L28/55
    • A method of fabricating a DRAM capacitor uses tungsten nitride in the process of forming a capacitor. The structure of the capacitor is simple and the process is easily executed. Furthermore, the invention provides a method of forming tungsten nitride, comprising a step of implanting nitrogen into a tungsten silicide layer and a step of executing a rapid thermal process under ammonia gas to form a tungsten nitride layer on the surface of the tungsten silicide layer. The method of fabricating a DRAM capacitor comprises forming the tungsten silicide layer after forming a part smaller than a bottom electrode of the capacitor from doped polysilicon and forming tungsten nitride on the surface of the tungsten nitride layer.
    • 制造DRAM电容器的方法在形成电容器的过程中使用氮化钨。 电容器的结构简单,易于执行。 此外,本发明提供了一种形成氮化钨的方法,包括将氮气注入到硅化钨层中的步骤以及在氨气下执行快速热处理以在硅化钨层的表面上形成氮化钨层的步骤。 制造DRAM电容器的方法包括在从掺杂多晶硅形成小于电容器的底部电极的部分之后形成硅化钨层,并在氮化钨层的表面上形成氮化钨。