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21. 发明授权

US08779582B2 Compliant heat spreader for flip chip packaging having thermally-conductive element with different metal material areas 有权
标题翻译：适用于倒装芯片封装的散热器，具有不同金属材料区域的导热元件
公开(公告)号：US08779582B2
公开(公告)日：2014-07-15
申请号：US13015831
申请日：2011-01-28
申请人： Wen-Yi Lin , Po-Yao Lin
发明人： Wen-Yi Lin , Po-Yao Lin
IPC分类号： H01L23/34 , H01L23/10
CPC分类号： H01L23/10 , H01L21/563 , H01L23/36 , H01L23/3736 , H01L23/4006 , H01L23/433 , H01L23/562 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/00
摘要： An integrated circuit chip package is described. The integrated circuit package comprises a substrate, a chip attached to the substrate, and a heat spreader mounted over the chip for sealing the chip therein. The heat spreader includes a thermally-conductive element having a side opposed to the top of the chip for transmitting heat away from the chip to the heat spreader, and a compliant element having a first portion attached to and positioned around the periphery of the thermally-conductive element and a second portion affixed to a surface of the substrate.
摘要翻译：描述了集成电路芯片封装。集成电路封装包括基板，附着到基板的芯片和安装在芯片上的散热器，用于将芯片密封在芯片上。散热器包括导热元件，其具有与芯片的顶部相对的一侧，用于将热量从芯片传递到散热器;以及顺应元件，其具有附接到热交换器的周边并围绕热交换器的周边定位，导电元件和固定到基底表面的第二部分。

22. 发明授权

US08399891B2 Active device array substrate and method for fabricating the same 有权
标题翻译：有源器件阵列衬底及其制造方法
公开(公告)号：US08399891B2
公开(公告)日：2013-03-19
申请号：US12943933
申请日：2010-11-11
申请人： Po-Lin Lai , Ying-Fa Huang , Chun-Ming Yang , Wen-Bin Wu , Wen-Yi Lin
发明人： Po-Lin Lai , Ying-Fa Huang , Chun-Ming Yang , Wen-Bin Wu , Wen-Yi Lin
IPC分类号： H01L29/72
CPC分类号： H01L22/20 , H01L22/14
摘要： An active device array substrate and a fabricating method thereof are provided. A first patterned conductive layer including separated scan line patterns is formed on a substrate. Each scan line pattern includes a first and second scan lines adjacent to each other. Both the first and the second scan lines have first and second contacts. An open inspection on the scan line patterns is performed. Channel layers are formed on the substrate. A second patterned conductive layer including data lines interlaced with the first and second scan lines, sources and drains located above the channel layers, and connectors is formed on the substrate. The sources electrically connect the data lines correspondingly. At least one of the connectors electrically connects the first and second scan lines, so as to form a loop in each scan line pattern. Pixel electrodes electrically connected to the drains are formed.
摘要翻译：提供一种有源器件阵列衬底及其制造方法。在衬底上形成包括分离的扫描线图案的第一图案化导电层。每个扫描线图案包括彼此相邻的第一和第二扫描线。第一和第二扫描线都具有第一和第二触点。执行对扫描线图案的公开检查。沟道层形成在衬底上。包括与第一和第二扫描线隔开的数据线，位于沟道层上方的源极和漏极以及连接器的第二图案化导电层形成在衬底上。电源相应地电连接数据线。至少一个连接器电连接第一和第二扫描线，以便在每个扫描线图案中形成环。形成与漏极电连接的像素电极。

23. 发明申请

US20120043558A1 ACTIVE DEVICE ARRAY SUBSTRATE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：主动装置阵列基板及其制造方法
公开(公告)号：US20120043558A1
公开(公告)日：2012-02-23
申请号：US12943933
申请日：2010-11-11
申请人： Po-Lin Lai , Ying-Fa Huang , Chun-Ming Yang , Wen-Bin Wu , Wen-Yi Lin
发明人： Po-Lin Lai , Ying-Fa Huang , Chun-Ming Yang , Wen-Bin Wu , Wen-Yi Lin
IPC分类号： H01L27/15 , H01L21/66
CPC分类号： H01L22/20 , H01L22/14
摘要： An active device array substrate and a fabricating method thereof are provided. A first patterned conductive layer including separated scan line patterns is formed on a substrate. Each scan line pattern includes a first and second scan lines adjacent to each other. Both the first and the second scan lines have first and second contacts. An open inspection on the scan line patterns is performed. Channel layers are formed on the substrate. A second patterned conductive layer including data lines interlaced with the first and second scan lines, sources and drains located above the channel layers, and connectors is formed on the substrate. The sources electrically connect the data lines correspondingly. At least one of the connectors electrically connects the first and second scan lines, so as to form a loop in each scan line pattern. Pixel electrodes electrically connected to the drains are formed.
摘要翻译：提供一种有源器件阵列衬底及其制造方法。在衬底上形成包括分离的扫描线图案的第一图案化导电层。每个扫描线图案包括彼此相邻的第一和第二扫描线。第一和第二扫描线都具有第一和第二触点。执行对扫描线图案的公开检查。沟道层形成在衬底上。包括与第一和第二扫描线隔开的数据线，位于沟道层上方的源极和漏极以及连接器的第二图案化导电层形成在衬底上。电源相应地电连接数据线。至少一个连接器电连接第一和第二扫描线，以便在每个扫描线图案中形成环。形成与漏极电连接的像素电极。

24. 发明授权

US07766260B2 Showerhead 失效
标题翻译：淋浴头
公开(公告)号：US07766260B2
公开(公告)日：2010-08-03
申请号：US12029891
申请日：2008-02-12
申请人： Wen-Yi Lin
发明人： Wen-Yi Lin
IPC分类号： A62C31/00 , A62C31/02 , B05B1/34 , B05B7/02 , B05B1/30 , B05B1/00
CPC分类号： B05B1/1618 , B05B1/18
摘要： A switchable showerhead has a body, a switching device, a water-spraying device and an operating device. The body has a mounting recess, a front through hole, a rear through hole, a mounting chamber, a connecting frame, an inserting hole and an inner tube. The switching device is mounted in the body and has a holding element, a front guide base, a rear guide base and a valve stem. The valve stem is movably mounted in the guide bases. The water-spraying device is mounted in the body, communicates with the switching device and has a shell and a cover. The shell is mounted in the mounting recess. The cover is mounted on the shell and has an inserting tube and multiple spouts. The operating device is mounted on the body, is connected to the switching device and has an operating panel connected to the valve stem.
摘要翻译：可切换的喷头具有主体，开关装置，喷水装置和操作装置。主体具有安装凹部，前通孔，后通孔，安装室，连接框架，插入孔和内管。开关装置安装在主体中，并且具有保持元件，前引导基座，后引导基座和阀杆。阀杆可移动地安装在导向底座中。喷水装置安装在本体中，与开关装置连通并具有外壳和盖。外壳安装在安装凹槽中。盖子安装在外壳上，并有一个插入管和多个喷口。操作装置安装在主体上，连接到开关装置，并具有连接到阀杆的操作面板。

25. 发明申请

US20060068517A1 Optical device and method for making the same 有权
公开(公告)号：US20060068517A1
公开(公告)日：2006-03-30
申请号：US11075499
申请日：2005-03-09
申请人： Tsai-An Yu , Pi-Sung Lin , Chih-Jen Chen , Chiu-Fang Huang , Wen-Yi Lin
发明人： Tsai-An Yu , Pi-Sung Lin , Chih-Jen Chen , Chiu-Fang Huang , Wen-Yi Lin
IPC分类号： H01L21/00
CPC分类号： G02B5/3016
摘要： A method for making an optical device includes the steps of: rubbing an orienting film so as to stretch the molecular structure thereof and so as to permit the molecular units of the molecular structure to be aligned along a first axis and to permit the orienting space between each adjacent pair of the molecular units of the molecular structure to be oriented in a direction parallel to a second axis; and forming an optical anisotropical layer on the orienting film by applying a liquid crystal film of rod-like molecules on the orienting film which orients the rod-like molecules by virtue of spatial effect of the molecular units and the orienting spaces.

26. 发明申请

US20060055854A1 Optical compensator for a liquid crystal display 有权
标题翻译：用于液晶显示器的光学补偿器
公开(公告)号：US20060055854A1
公开(公告)日：2006-03-16
申请号：US11043308
申请日：2005-01-27
申请人： Tsai-An Yu , Pi-Sung Lin , Chih-Jen Chen , Chiu-Fang Huang , Wen-Yi Lin
发明人： Tsai-An Yu , Pi-Sung Lin , Chih-Jen Chen , Chiu-Fang Huang , Wen-Yi Lin
IPC分类号： G02F1/1335
CPC分类号： G02F1/133634 , G02B27/286 , G02F2413/15 , Y10T428/10
摘要： An optical compensator includes a C-plate adapted to be coupled to a liquid crystal cell and made from a polymer. The C-plate has a layer thickness ranging from 5 to 60 μm. The polymer is polyvinyl alcohol, has a polymerization degree greater than 2000 and less than 5000, and is cross-linked so that the C-plate has an optical axis substantially parallel to the direction of normally incident light, and so that the C-plate has a plate retardation, along the layer thickness of the C-plate, greater than 60 nm.
摘要翻译：光学补偿器包括适于耦合到液晶单元并由聚合物制成的C板。 C板具有5至60μm的层厚度。聚合物是聚乙烯醇，聚合度大于2000且小于5000，并且是交联的，使得C板具有基本上平行于正常入射光的方向的光轴，并且使得C板沿着C板的层厚度具有大于60nm的板延迟。

27. 发明授权

US08847369B2 Packaging structures and methods for semiconductor devices 有权
标题翻译：半导体器件的封装结构和方法
公开(公告)号：US08847369B2
公开(公告)日：2014-09-30
申请号：US13554839
申请日：2012-07-20
申请人： Ming-Chih Yew , Wen-Yi Lin , Jiun Yi Wu , Po-Yao Lin
发明人： Ming-Chih Yew , Wen-Yi Lin , Jiun Yi Wu , Po-Yao Lin
IPC分类号： H01L23/495 , H01L23/48 , H01L23/52 , H01L29/40 , H01L21/44 , H05K1/11 , H05K3/02 , H05K3/10
CPC分类号： H01L23/49811 , H01L21/563 , H01L23/147 , H01L23/3128 , H01L23/3142 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/562 , H01L24/16 , H01L24/73 , H01L24/81 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L2224/10152 , H01L2224/13099 , H01L2224/13147 , H01L2224/16227 , H01L2224/16237 , H01L2224/26175 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/81191 , H01L2224/81193 , H01L2225/0651 , H01L2225/06517 , H01L2225/06558 , H01L2225/1023 , H01L2225/1058 , H01L2924/00011 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H05K1/0271 , H05K2201/0989 , Y10T29/49155 , H01L2924/00014 , H01L2924/00012 , H01L2224/16225 , H01L2924/00 , H01L2224/81805
摘要： Packaging structures and methods for semiconductor devices are disclosed. In one embodiment, a substrate for packaging a semiconductor device includes a core substrate, an insulating material disposed over the core substrate, and conductive lines disposed in the insulating material. Contact pads are disposed over the insulating material and the conductive lines. The contact pads are disposed in an integrated circuit mounting region of the core substrate. A solder mask define (SMD) material is disposed over the insulating material. Portions of the contact pads are exposed through openings in the SMD material. A stress-relief structure (SRS) is disposed in the SMD material proximate the contact pads. The SRS is disposed entirely in the integrated circuit mounting region of the core substrate.
摘要翻译：公开了用于半导体器件的封装结构和方法。在一个实施例中，用于封装半导体器件的衬底包括芯衬底，设置在芯衬底上的绝缘材料以及设置在绝缘材料中的导线。接触垫设置在绝缘材料和导电线之上。接触垫设置在芯基板的集成电路安装区域中。在绝缘材料上设置焊接掩模限定（SMD）材料。接触垫的一部分通过SMD材料的开口露出。应力消除结构（SRS）被布置在靠近接触垫的SMD材料中。 SRS完全设置在芯基板的集成电路安装区域中。

28. 发明申请

US20120182694A1 Lid Design for Reliability Enhancement in Flip Chip Package 有权
标题翻译：倒装芯片封装可靠性增强的盖设计
公开(公告)号：US20120182694A1
公开(公告)日：2012-07-19
申请号：US13007249
申请日：2011-01-14
申请人： Wen-Yi Lin , Po-Yao Lin , Tsung-Shu Lin , Kuo-Chin Chang , Shou-Yi Wang
发明人： Wen-Yi Lin , Po-Yao Lin , Tsung-Shu Lin , Kuo-Chin Chang , Shou-Yi Wang
IPC分类号： H05K7/20 , B65D6/28 , H01L21/60 , H05K7/00
CPC分类号： H01L23/16 , H01L23/055 , H01L23/562 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/3511 , H01L2924/00
摘要： In a package structure, a stiffener ring is over and bonded to a top surface of a first package component. A second package component is over and bonded to the top surface of the first package component, and is encircled by the stiffener ring. A metal lid is over and bonded to the stiffener ring. The metal lid has a through-opening.
摘要翻译：在包装结构中，加强环在第一包装部件的顶表面上结合并结合。第二包装部件在第一包装部件的顶部表面上结合并且被加强环环绕。金属盖已经结合到加强环上。金属盖具有通孔。

29. 发明授权

US07956964B2 Optical device and method for making the same 失效
标题翻译：光学装置及其制造方法
公开(公告)号：US07956964B2
公开(公告)日：2011-06-07
申请号：US12419712
申请日：2009-04-07
申请人： Tsai-An Yu , Pi-Sung Lin , Chih-Jen Chen , Chiu-Fang Huang , Wen-Yi Lin
发明人： Tsai-An Yu , Pi-Sung Lin , Chih-Jen Chen , Chiu-Fang Huang , Wen-Yi Lin
IPC分类号： G02F1/1335
CPC分类号： G02B5/3016
摘要： A method for making an optical device includes the steps of: rubbing an orienting film so as to stretch the molecular structure thereof and so as to permit the molecular units of the molecular structure to be aligned along a first axis and to permit the orienting space between each adjacent pair of the molecular units of the molecular structure to be oriented in a direction parallel to a second axis; and forming an optical anisotropical layer on the orienting film by applying a liquid crystal film of rod-like molecules on the orienting film which orients the rod-like molecules by virtue of spatial effect of the molecular units and the orienting spaces.
摘要翻译：一种制造光学器件的方法包括以下步骤：摩擦定向膜以拉伸其分子结构，以使分子结构的分子单元沿着第一轴线排列并允许定向膜间的定向空间每个相邻的分子结构的分子单元对沿着平行于第二轴线的方向取向; 并通过在取向膜上施加杆状分子的液晶膜，借助于分子单元和取向空间的空间效应来定向棒状分子，在取向膜上形成光学各向异性层。

30. 发明授权

US07532284B2 Optical device and method for making the same 有权
标题翻译：光学装置及其制造方法
公开(公告)号：US07532284B2
公开(公告)日：2009-05-12
申请号：US11075499
申请日：2005-03-09
申请人： Tsai-An Yu , Pi-Sung Lin , Chih-Jen Chen , Chiu-Fang Huang , Wen-Yi Lin
发明人： Tsai-An Yu , Pi-Sung Lin , Chih-Jen Chen , Chiu-Fang Huang , Wen-Yi Lin
IPC分类号： G02F1/1335
CPC分类号： G02B5/3016
摘要： A method for making an optical device includes the steps of: rubbing an orienting film so as to stretch the molecular structure thereof and so as to permit the molecular units of the molecular structure to be aligned along a first axis and to permit the orienting space between each adjacent pair of the molecular units of the molecular structure to be oriented in a direction parallel to a second axis; and forming an optical anisotropical layer on the orienting film by applying a liquid crystal film of rod-like molecules on the orienting film which orients the rod-like molecules by virtue of spatial effect of the molecular units and the orienting spaces.
摘要翻译：一种制造光学器件的方法包括以下步骤：摩擦定向膜以拉伸其分子结构，以使分子结构的分子单元沿着第一轴线排列并允许定向膜间的定向空间每个相邻的分子结构的分子单元对沿着平行于第二轴线的方向取向; 并通过在取向膜上施加杆状分子的液晶膜，借助于分子单元和取向空间的空间效应来定向棒状分子，在取向膜上形成光学各向异性层。

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