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    • 1. 发明授权
    • Active device array substrate and method for fabricating the same
    • 有源器件阵列衬底及其制造方法
    • US08399891B2
    • 2013-03-19
    • US12943933
    • 2010-11-11
    • Po-Lin LaiYing-Fa HuangChun-Ming YangWen-Bin WuWen-Yi Lin
    • Po-Lin LaiYing-Fa HuangChun-Ming YangWen-Bin WuWen-Yi Lin
    • H01L29/72
    • H01L22/20H01L22/14
    • An active device array substrate and a fabricating method thereof are provided. A first patterned conductive layer including separated scan line patterns is formed on a substrate. Each scan line pattern includes a first and second scan lines adjacent to each other. Both the first and the second scan lines have first and second contacts. An open inspection on the scan line patterns is performed. Channel layers are formed on the substrate. A second patterned conductive layer including data lines interlaced with the first and second scan lines, sources and drains located above the channel layers, and connectors is formed on the substrate. The sources electrically connect the data lines correspondingly. At least one of the connectors electrically connects the first and second scan lines, so as to form a loop in each scan line pattern. Pixel electrodes electrically connected to the drains are formed.
    • 提供一种有源器件阵列衬底及其制造方法。 在衬底上形成包括分离的扫描线图案的第一图案化导电层。 每个扫描线图案包括彼此相邻的第一和第二扫描线。 第一和第二扫描线都具有第一和第二触点。 执行对扫描线图案的公开检查。 沟道层形成在衬底上。 包括与第一和第二扫描线隔开的数据线,位于沟道层上方的源极和漏极以及连接器的第二图案化导电层形成在衬底上。 电源相应地电连接数据线。 至少一个连接器电连接第一和第二扫描线,以便在每个扫描线图案中形成环。 形成与漏极电连接的像素电极。
    • 2. 发明申请
    • ACTIVE DEVICE ARRAY SUBSTRATE AND METHOD FOR FABRICATING THE SAME
    • 主动装置阵列基板及其制造方法
    • US20120043558A1
    • 2012-02-23
    • US12943933
    • 2010-11-11
    • Po-Lin LaiYing-Fa HuangChun-Ming YangWen-Bin WuWen-Yi Lin
    • Po-Lin LaiYing-Fa HuangChun-Ming YangWen-Bin WuWen-Yi Lin
    • H01L27/15H01L21/66
    • H01L22/20H01L22/14
    • An active device array substrate and a fabricating method thereof are provided. A first patterned conductive layer including separated scan line patterns is formed on a substrate. Each scan line pattern includes a first and second scan lines adjacent to each other. Both the first and the second scan lines have first and second contacts. An open inspection on the scan line patterns is performed. Channel layers are formed on the substrate. A second patterned conductive layer including data lines interlaced with the first and second scan lines, sources and drains located above the channel layers, and connectors is formed on the substrate. The sources electrically connect the data lines correspondingly. At least one of the connectors electrically connects the first and second scan lines, so as to form a loop in each scan line pattern. Pixel electrodes electrically connected to the drains are formed.
    • 提供一种有源器件阵列衬底及其制造方法。 在衬底上形成包括分离的扫描线图案的第一图案化导电层。 每个扫描线图案包括彼此相邻的第一和第二扫描线。 第一和第二扫描线都具有第一和第二触点。 执行对扫描线图案的公开检查。 沟道层形成在衬底上。 包括与第一和第二扫描线隔开的数据线,位于沟道层上方的源极和漏极以及连接器的第二图案化导电层形成在衬底上。 电源相应地电连接数据线。 至少一个连接器电连接第一和第二扫描线,以便在每个扫描线图案中形成环。 形成与漏极电连接的像素电极。
    • 7. 发明申请
    • BRIDGING SOLAR CELL AND SOLAR ENERGY SYSTEM
    • BRIDGING太阳能电池和太阳能发电系统
    • US20130312807A1
    • 2013-11-28
    • US13659114
    • 2012-10-24
    • Huang-Chi TSENGChun-Ming Yang
    • Huang-Chi TSENGChun-Ming Yang
    • H01L31/0224H01L31/042
    • H01L31/022433H01L31/0201H01L31/0504H01L31/0508H02S40/36Y02E10/50
    • A bridging solar cell includes a substrate, first, second, and third sets of bus bar electrodes, a first welding member, a first insulation film, and a second welding member. The first set of bus bar electrodes is disposed on the front surface of the substrate along a first direction. The second set of bus bar electrodes is disposed on the back surface of the substrate along a second direction and electrically connected to the first set of bus bar electrodes. The first welding member is electrically connected to the second set of bus bar electrodes. The first insulation film is disposed on the back surface. The third set of bus bar electrodes is disposed on the first insulation film along the second direction. The second welding member is disposed on the first insulation film and electrically connected to the third set of bus bar electrodes.
    • 桥接太阳能电池包括基板,第一,第二和第三组母线电极,第一焊接构件,第一绝缘膜和第二焊接构件。 第一组汇流条电极沿着第一方向设置在基板的前表面上。 第二组汇流条电极沿着第二方向设置在基板的背面,并电连接到第一组母线电极。 第一焊接构件电连接到第二组汇流条电极。 第一绝缘膜设置在背面。 第三组母线电极沿着第二方向设置在第一绝缘膜上。 第二焊接构件设置在第一绝缘膜上并电连接到第三组汇流条电极。