专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20140021594A1 Packaging Structures and Methods for Semiconductor Devices 有权
标题翻译：半导体器件的封装结构和方法
公开(公告)号：US20140021594A1
公开(公告)日：2014-01-23
申请号：US13554839
申请日：2012-07-20
申请人： Ming-Chih Yew , Wen-Yi Lin , Jiun Yi Wu , Po-Yao Lin
发明人： Ming-Chih Yew , Wen-Yi Lin , Jiun Yi Wu , Po-Yao Lin
IPC分类号： H01L23/495 , H05K3/10 , H05K1/11
CPC分类号： H01L23/49811 , H01L21/563 , H01L23/147 , H01L23/3128 , H01L23/3142 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/562 , H01L24/16 , H01L24/73 , H01L24/81 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L2224/10152 , H01L2224/13099 , H01L2224/13147 , H01L2224/16227 , H01L2224/16237 , H01L2224/26175 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/81191 , H01L2224/81193 , H01L2225/0651 , H01L2225/06517 , H01L2225/06558 , H01L2225/1023 , H01L2225/1058 , H01L2924/00011 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H05K1/0271 , H05K2201/0989 , Y10T29/49155 , H01L2924/00014 , H01L2924/00012 , H01L2224/16225 , H01L2924/00 , H01L2224/81805
摘要： Packaging structures and methods for semiconductor devices are disclosed. In one embodiment, a substrate for packaging a semiconductor device includes a core substrate, an insulating material disposed over the core substrate, and conductive lines disposed in the insulating material. Contact pads are disposed over the insulating material and the conductive lines. The contact pads are disposed in an integrated circuit mounting region of the core substrate. A solder mask define (SMD) material is disposed over the insulating material. Portions of the contact pads are exposed through openings in the SMD material. A stress-relief structure (SRS) is disposed in the SMD material proximate the contact pads. The SRS is disposed entirely in the integrated circuit mounting region of the core substrate.
摘要翻译：公开了用于半导体器件的封装结构和方法。在一个实施例中，用于封装半导体器件的衬底包括芯衬底，设置在芯衬底上的绝缘材料以及设置在绝缘材料中的导线。接触垫设置在绝缘材料和导电线之上。接触垫设置在芯基板的集成电路安装区域中。在绝缘材料上设置焊接掩模限定（SMD）材料。接触垫的一部分通过SMD材料的开口露出。应力消除结构（SRS）被布置在靠近接触垫的SMD材料中。 SRS完全设置在芯基板的集成电路安装区域中。

2. 发明申请

US20130082372A1 Package on Packaging Structure and Methods of Making Same 有权
公开(公告)号：US20130082372A1
公开(公告)日：2013-04-04
申请号：US13250606
申请日：2011-09-30
申请人： Wen-Yi Lin , Ming-Chih Yew , Po-Yao Lin , Jing Ruei Lu , Jiun Yi Wu
发明人： Wen-Yi Lin , Ming-Chih Yew , Po-Yao Lin , Jing Ruei Lu , Jiun Yi Wu
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： H01L25/50 , H01L23/36 , H01L23/3675 , H01L23/3677 , H01L23/42 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/105 , H01L2224/16146 , H01L2224/16225 , H01L2224/16235 , H01L2224/17519 , H01L2224/291 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73253 , H01L2224/73265 , H01L2224/81801 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/00014 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package on packaging structure provides for improved thermal conduction and mechanical strength by the introduction of a sold thermal coupler between the first and second packages. The first package has a first substrate and through vias through the first substrate. A first set of conductive elements is aligned with and coupled to the through vias of the first substrate. A solid thermal coupler is coupled to the first set of conductive elements and to a die of the second package. A second set of conductive elements is coupled to the die and a bottom substrate is coupled to the second set of conductive elements. The thermal coupler may be, e.g., an interposer, a heat spreader, or a thermal conductive layer.

3. 发明授权

US08847369B2 Packaging structures and methods for semiconductor devices 有权
标题翻译：半导体器件的封装结构和方法
公开(公告)号：US08847369B2
公开(公告)日：2014-09-30
申请号：US13554839
申请日：2012-07-20
申请人： Ming-Chih Yew , Wen-Yi Lin , Jiun Yi Wu , Po-Yao Lin
发明人： Ming-Chih Yew , Wen-Yi Lin , Jiun Yi Wu , Po-Yao Lin
IPC分类号： H01L23/495 , H01L23/48 , H01L23/52 , H01L29/40 , H01L21/44 , H05K1/11 , H05K3/02 , H05K3/10
CPC分类号： H01L23/49811 , H01L21/563 , H01L23/147 , H01L23/3128 , H01L23/3142 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/562 , H01L24/16 , H01L24/73 , H01L24/81 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L2224/10152 , H01L2224/13099 , H01L2224/13147 , H01L2224/16227 , H01L2224/16237 , H01L2224/26175 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/81191 , H01L2224/81193 , H01L2225/0651 , H01L2225/06517 , H01L2225/06558 , H01L2225/1023 , H01L2225/1058 , H01L2924/00011 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H05K1/0271 , H05K2201/0989 , Y10T29/49155 , H01L2924/00014 , H01L2924/00012 , H01L2224/16225 , H01L2924/00 , H01L2224/81805
摘要： Packaging structures and methods for semiconductor devices are disclosed. In one embodiment, a substrate for packaging a semiconductor device includes a core substrate, an insulating material disposed over the core substrate, and conductive lines disposed in the insulating material. Contact pads are disposed over the insulating material and the conductive lines. The contact pads are disposed in an integrated circuit mounting region of the core substrate. A solder mask define (SMD) material is disposed over the insulating material. Portions of the contact pads are exposed through openings in the SMD material. A stress-relief structure (SRS) is disposed in the SMD material proximate the contact pads. The SRS is disposed entirely in the integrated circuit mounting region of the core substrate.
摘要翻译：公开了用于半导体器件的封装结构和方法。在一个实施例中，用于封装半导体器件的衬底包括芯衬底，设置在芯衬底上的绝缘材料以及设置在绝缘材料中的导线。接触垫设置在绝缘材料和导电线之上。接触垫设置在芯基板的集成电路安装区域中。在绝缘材料上设置焊接掩模限定（SMD）材料。接触垫的一部分通过SMD材料的开口露出。应力消除结构（SRS）被布置在靠近接触垫的SMD材料中。 SRS完全设置在芯基板的集成电路安装区域中。

4. 发明授权

US08946888B2 Package on packaging structure and methods of making same 有权
标题翻译：包装结构及其制作方法
公开(公告)号：US08946888B2
公开(公告)日：2015-02-03
申请号：US13250606
申请日：2011-09-30
申请人： Wen-Yi Lin , Ming-Chih Yew , Po-Yao Lin , Jing Ruei Lu , Jiun Yi Wu
发明人： Wen-Yi Lin , Ming-Chih Yew , Po-Yao Lin , Jing Ruei Lu , Jiun Yi Wu
IPC分类号： H01L23/10 , H01L25/10 , H01L23/36 , H01L23/367 , H01L23/42 , H01L23/498 , H01L23/00
CPC分类号： H01L25/50 , H01L23/36 , H01L23/3675 , H01L23/3677 , H01L23/42 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/105 , H01L2224/16146 , H01L2224/16225 , H01L2224/16235 , H01L2224/17519 , H01L2224/291 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73253 , H01L2224/73265 , H01L2224/81801 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/00014 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package on packaging structure provides for improved thermal conduction and mechanical strength by the introduction of a sold thermal coupler between the first and second packages. The first package has a first substrate and through vias through the first substrate. A first set of conductive elements is aligned with and coupled to the through vias of the first substrate. A solid thermal coupler is coupled to the first set of conductive elements and to a die of the second package. A second set of conductive elements is coupled to the die and a bottom substrate is coupled to the second set of conductive elements. The thermal coupler may be, e.g., an interposer, a heat spreader, or a thermal conductive layer.
摘要翻译：包装结构上的包装通过在第一和第二包装之间引入销售的热耦合器来提供改善的热传导和机械强度。第一封装具有第一衬底和穿过第一衬底的通孔。第一组导电元件与第一衬底的通孔对准并耦合到第一衬底的通孔。固体热耦合器耦合到第一组导电元件和第二封装的管芯。第二组导电元件耦合到管芯，并且底部衬底耦合到第二组导电元件。热耦合器可以是例如插入件，散热器或导热层。

5. 发明授权

US09548281B2 Electrical connection for chip scale packaging 有权
标题翻译：电子连接用于芯片级封装
公开(公告)号：US09548281B2
公开(公告)日：2017-01-17
申请号：US13269310
申请日：2011-10-07
申请人： Ming-Chih Yew , Wen-Yi Lin , Fu-Jen Li , Po-Yao Lin
发明人： Ming-Chih Yew , Wen-Yi Lin , Fu-Jen Li , Po-Yao Lin
IPC分类号： H01L23/48 , H01L21/28 , H01L23/00 , H01L23/488 , H01L23/31 , H01L23/525
CPC分类号： H01L24/06 , H01L23/3157 , H01L23/525 , H01L24/05 , H01L24/13 , H01L2224/0401 , H01L2224/05008 , H01L2224/05012 , H01L2224/05022 , H01L2224/05541 , H01L2224/05552 , H01L2224/05555 , H01L2224/05569 , H01L2224/05572 , H01L2224/061 , H01L2224/06137 , H01L2224/06179 , H01L2924/00014 , H01L2924/00012 , H01L2924/206
摘要： A system and method for providing a post-passivation opening and undercontact metallization is provided. An embodiment comprises an opening through the post-passivation which has a first dimension longer than a second dimension, wherein the first dimension is aligned perpendicular to a chip's direction of coefficient of thermal expansion mismatch. By shaping and aligning the opening through the post-passivation layer in this fashion, the post-passivation layer helps to shield the underlying layers from stresses generated from mismatches of the materials' coefficient of thermal expansion.
摘要翻译：提供了一种用于提供后钝化开口和未接触金属化的系统和方法。实施例包括通过后钝化的开口，其具有比第二尺寸长的第一尺寸，其中第一尺寸垂直于芯片的热膨胀失配系数的方向排列。通过以这种方式通过后钝化层成形和对准开口，后钝化层有助于屏蔽下层，避免由材料的热膨胀系数的错配产生的应力。

6. 发明申请

US20130087892A1 Electrical Connection for Chip Scale Packaging 有权
标题翻译：电子连接用于芯片级封装
公开(公告)号：US20130087892A1
公开(公告)日：2013-04-11
申请号：US13269310
申请日：2011-10-07
申请人： Ming-Chih Yew , Wen-Yi Lin , Fu-Jen Li , Po-Yao Lin
发明人： Ming-Chih Yew , Wen-Yi Lin , Fu-Jen Li , Po-Yao Lin
IPC分类号： H01L29/41 , H01L21/28 , H01L23/58
CPC分类号： H01L24/06 , H01L23/3157 , H01L23/525 , H01L24/05 , H01L24/13 , H01L2224/0401 , H01L2224/05008 , H01L2224/05012 , H01L2224/05022 , H01L2224/05541 , H01L2224/05552 , H01L2224/05555 , H01L2224/05569 , H01L2224/05572 , H01L2224/061 , H01L2224/06137 , H01L2224/06179 , H01L2924/00014 , H01L2924/00012 , H01L2924/206
摘要： A system and method for providing a post-passivation opening and undercontact metallization is provided. An embodiment comprises an opening through the post-passivation which has a first dimension longer than a second dimension, wherein the first dimension is aligned perpendicular to a chip's direction of coefficient of thermal expansion mismatch. By shaping and aligning the opening through the post-passivation layer in this fashion, the post-passivation layer helps to shield the underlying layers from stresses generated from mismatches of the materials' coefficient of thermal expansion.
摘要翻译：提供了一种用于提供后钝化开口和未接触金属化的系统和方法。实施例包括通过后钝化的开口，其具有比第二尺寸长的第一尺寸，其中第一尺寸垂直于芯片的热膨胀失配系数的方向排列。通过以这种方式通过后钝化层成形和对准开口，后钝化层有助于屏蔽下层，避免由材料的热膨胀系数的错配产生的应力。

7. 发明授权

US08624392B2 Electrical connection for chip scale packaging 有权
标题翻译：电子连接用于芯片级包装
公开(公告)号：US08624392B2
公开(公告)日：2014-01-07
申请号：US13152734
申请日：2011-06-03
申请人： Ming-Chih Yew , Fu-Jen Li , Po-Yao Lin , Chia-Jen Cheng , Hsiu-Mei Yu
发明人： Ming-Chih Yew , Fu-Jen Li , Po-Yao Lin , Chia-Jen Cheng , Hsiu-Mei Yu
IPC分类号： H01L23/485
CPC分类号： H01L24/13 , H01L21/76885 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L24/82 , H01L2224/02235 , H01L2224/02255 , H01L2224/0235 , H01L2224/02375 , H01L2224/0401 , H01L2224/05005 , H01L2224/05008 , H01L2224/05022 , H01L2224/05541 , H01L2224/05569 , H01L2224/05572 , H01L2224/10155 , H01L2224/13005 , H01L2224/13006 , H01L2224/13007 , H01L2224/13024 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2924/00014 , H01L2924/01029 , H01L2924/351 , H01L2924/35121 , H01L2924/207 , H01L2924/2076 , H01L2224/05552
摘要： A system and method for providing a post-passivation and underbump metallization is provided. An embodiment comprises a post-passivation layer that is larger than an overlying underbump metallization. The post-passivation layer extending beyond the underbump metallization shields the underlying layers from stresses generated from mismatches of the materials' coefficient of thermal expansion.
摘要翻译：提供了一种用于提供后钝化和欠掺杂金属化的系统和方法。一个实施例包括大于上覆下凸点金属化的后钝化层。延伸超过下凸块金属化的后钝化层屏蔽下层不受材料的热膨胀系数的不匹配产生的应力。

8. 发明申请

US20120306070A1 Electrical Connection for Chip Scale Packaging 有权
标题翻译：电子连接用于芯片级封装
公开(公告)号：US20120306070A1
公开(公告)日：2012-12-06
申请号：US13152734
申请日：2011-06-03
申请人： Ming-Chih Yew , Fu-Jen Li , Po-Yao Lin , Chia-Jen Cheng , Hsiu-Mei Yu
发明人： Ming-Chih Yew , Fu-Jen Li , Po-Yao Lin , Chia-Jen Cheng , Hsiu-Mei Yu
IPC分类号： H01L23/485
CPC分类号： H01L24/13 , H01L21/76885 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L24/82 , H01L2224/02235 , H01L2224/02255 , H01L2224/0235 , H01L2224/02375 , H01L2224/0401 , H01L2224/05005 , H01L2224/05008 , H01L2224/05022 , H01L2224/05541 , H01L2224/05569 , H01L2224/05572 , H01L2224/10155 , H01L2224/13005 , H01L2224/13006 , H01L2224/13007 , H01L2224/13024 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2924/00014 , H01L2924/01029 , H01L2924/351 , H01L2924/35121 , H01L2924/207 , H01L2924/2076 , H01L2224/05552
摘要： A system and method for providing a post-passivation and underbump metallization is provided. An embodiment comprises a post-passivation layer that is larger than an overlying underbump metallization. The post-passivation layer extending beyond the underbump metallization shields the underlying layers from stresses generated from mismatches of the materials' coefficient of thermal expansion.
摘要翻译：提供了一种用于提供后钝化和欠掺杂金属化的系统和方法。一个实施例包括大于上覆下凸点金属化的后钝化层。延伸超过下凸块金属化的后钝化层屏蔽下层不受材料的热膨胀系数的不匹配产生的应力。

9. 发明授权

US09887144B2 Ring structure for chip packaging 有权
公开(公告)号：US09887144B2
公开(公告)日：2018-02-06
申请号：US13227983
申请日：2011-09-08
申请人： Wen-Yi Lin , Yu-Chih Liu , Ming-Chih Yew , Tsung-Shu Lin , Bor-Rung Su , Jing Ruei Lu , Wei-Ting Lin
发明人： Wen-Yi Lin , Yu-Chih Liu , Ming-Chih Yew , Tsung-Shu Lin , Bor-Rung Su , Jing Ruei Lu , Wei-Ting Lin
IPC分类号： H01L23/10 , H01L23/16 , H01L23/36 , H01L21/56 , H01L23/00
CPC分类号： H01L23/10 , H01L21/563 , H01L23/16 , H01L23/36 , H01L24/16 , H01L24/32 , H01L24/33 , H01L2224/131 , H01L2224/16225 , H01L2224/29099 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2924/014 , H01L2924/00014
摘要： A ring structure for chip packaging comprises a frame portion adaptable to bond to a substrate and at least one corner portion. The frame portion surrounds a semiconductor chip and defines an inside opening, and the inside opening exposes a portion of a surface of the substrate. The at least one corner portion extends from a corner of the frame portion toward the chip, and the corner portion is free of a sharp corner.

10. 发明授权

US4781364A Elastic beam-torsion rod connection 失效
标题翻译：弹性梁 - 扭力杆连接
公开(公告)号：US4781364A
公开(公告)日：1988-11-01
申请号：US541862
申请日：1983-10-14
申请人： Bernard J. Finn , Ming-Chih Yew
发明人： Bernard J. Finn , Ming-Chih Yew
IPC分类号： B60G11/18 , B60G21/05 , F16F1/368 , F16F1/18 , B60G19/00 , F16F1/14
CPC分类号： F16F1/3686 , B60G11/181 , B60G21/05 , B60G2202/132 , B60G2204/4307 , B60G2204/82 , B60G2204/8302
摘要： A twist isolating connection between a distal end of an elastic beam disposed transversely of a vehicle sprung mass and an adjacent end of a torsion rod disposed longitudinally of the sprung mass between a suspension control arm and the elastic beam distal end, the connection including a yoke rigidly attached to the end of the torsion rod with a pair of legs straddling a platform member on the distal end of the elastic beam, and a pair of protuberances on the legs engaging opposite sides of the platform member in a common transverse plane of the sprung mass but at laterally spaced locations. The elastic beam is thus clamped between the protuberances which transfer torsional moments to the elastic beam for resistance in bending modes but which isolate the elastic beam from the torsion rod with respect to twisting of the beam due to beam bending of the torsion rod.
摘要翻译：弹性梁的远端设置在横向于车辆弹簧质量的远端之间的扭转隔离连接以及设置在悬挂控制臂与弹性梁远端之间的簧上质量纵向的扭转杆的相邻端，该连接包括轭刚性地连接到扭力杆的端部，一对腿跨过弹性梁的远端上的平台构件，并且腿上的一对突起，在弹簧的共同横向平面中接合平台构件的相对侧但在横向间隔的位置。因此，弹性梁被夹紧在突起之间，该突起将扭转力矩传递到弹性梁以抵抗弯曲模式，但是由于扭杆的梁弯曲，弹性梁相对于梁的扭转而与扭转杆隔离。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式