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21. 发明授权

US06961995B2 Method of making an electronic package 失效
公开(公告)号：US06961995B2
公开(公告)日：2005-11-08
申请号：US10251072
申请日：2002-09-19
申请人： Lisa J. Jimarez , Miguel A. Jimarez , Voya R. Markovich , Cynthia S. Milkovich , Charles H. Perry , Brenda L. Peterson
发明人： Lisa J. Jimarez , Miguel A. Jimarez , Voya R. Markovich , Cynthia S. Milkovich , Charles H. Perry , Brenda L. Peterson
IPC分类号： H01L21/44 , H01L21/48 , H01L23/498 , H05K1/02 , H05K1/03 , H05K1/11 , H05K3/34 , H05K3/40 , H05K3/46 , H01K3/10 , B44C1/22 , C03C15/00 , H05K7/12 , C23E1/00
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/15 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L2924/0002 , H05K1/0271 , H05K1/0306 , H05K1/113 , H05K3/3436 , H05K3/3457 , H05K3/4053 , H05K3/4069 , H05K3/4605 , H05K3/4644 , H05K3/4688 , H05K2201/0133 , H05K2201/015 , H05K2201/09436 , H05K2201/09509 , H05K2201/10734 , H05K2203/061 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49165 , H01L2924/00
摘要： An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

22. 发明授权

US06529021B1 Self-scrub buckling beam probe 失效
标题翻译：自清洗屈曲光束探头
公开(公告)号：US06529021B1
公开(公告)日：2003-03-04
申请号：US09558428
申请日：2000-04-25
申请人： Yuet-Ying Yu , Daniel G Berger , Camille Proietti Bowne , Scott Langenthal , Charles H Perry , Terence Spoor , Thomas Weiss
发明人： Yuet-Ying Yu , Daniel G Berger , Camille Proietti Bowne , Scott Langenthal , Charles H Perry , Terence Spoor , Thomas Weiss
IPC分类号： G01R1067
CPC分类号： G01R1/07357 , G01R1/07314
摘要： A self scrubbing buckling beam contactor for contacting an array of pads positioned on a device under test is described. The contactor consists of three insulating dies: a top, an offset and a lower die separated from each other by an insulated spacer of variable thickness. Each die is provided with holes. The buckling beam has an array of flexible wires positioned substantially perpendicular to the dies, each of the flexible wires crossing a corresponding hole in each of the top, offset and lower dies to allow each wire respectively contact a pad of the device under test. By shifting the center of the hole of the lower die relative to the center of the offset die, the tip of the wire exits from the lower die at an angle with respect to the plane formed by the pads of the device under test. The exit angle of the wire tip is controlled by the relative displacement of the offset die relative to the bottom die, such that the exit angle of the tip of the wire at the bottom die changes when the probe wire is under compression. By applying a reciprocating motion to the tip of the wire contacting the surface of the device under test, a scrubbing motion is achieved that lowers the resistance between the pad of the device under test. In this manner, the tip of the wire cleans the surface of the pads and prevents contaminants from adhering to the tip of the wire.
摘要翻译：描述了用于接触位于被测器件上的焊盘阵列的自擦洗屈曲光束接触器。接触器由三个绝缘模具组成：一个顶部，一个偏移部分和一个下模具，通过可变厚度的绝缘垫片相互分离。每个模具都有孔。屈曲梁具有基本上垂直于模具定位的柔性线阵列，每个柔性线与顶部，偏移和下模中的每一个中的相应孔交叉，以允许每根线分别接触被测器件的焊盘。通过相对于偏移模具的中心移动下模的孔的中心，线的尖端相对于由被测器件的焊盘形成的平面以一定角度从下模出射。线尖的出射角由偏移模具相对于底模的相对位移控制，使得当探针线处于压缩状态时，底模处的线的尖端的出射角改变。通过向接触被测器件表面的电线的尖端施加往复运动，实现了降低被测器件的焊盘之间的电阻的擦洗运动。以这种方式，电线的尖端清洁焊盘的表面，并防止污染物粘附到电线的尖端。

23. 发明授权

US06458623B1 Conductive adhesive interconnection with insulating polymer carrier 有权
标题翻译：与绝缘聚合物载体的导电胶粘剂互连
公开(公告)号：US06458623B1
公开(公告)日：2002-10-01
申请号：US09765030
申请日：2001-01-17
申请人： Lewis S. Goldmann , Mario J. Interrante , Raymond A. Jackson , Amy B. Ostrander , Charles H. Perry , Brenda L. Peterson
发明人： Lewis S. Goldmann , Mario J. Interrante , Raymond A. Jackson , Amy B. Ostrander , Charles H. Perry , Brenda L. Peterson
IPC分类号： H01L2144
CPC分类号： H01L24/83 , H01L23/49827 , H01L24/29 , H01L24/81 , H01L2224/13111 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29298 , H01L2224/81801 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/09701 , H01L2924/12042 , H01L2924/30107 , H05K3/321 , H05K3/3436 , H05K2201/09472 , H05K2201/10992 , H05K2203/041 , H05K2203/0415 , Y02P70/613 , H01L2924/00 , H01L2924/01083 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A method and apparatus is provided for forming an electronic assembly whereby an insulating polymer matrix having a plurality of conductor holes is attached to a first substrate wherein the conductor holes align with a corresponding contact array on the first substrate. Subsequently, a flexible, electrically conductive adhesive is provided within the plurality of conductor holes and a solid conductive material, preferably having a high melting temperature, is attached to at least one end thereof. The insulating polymer matrix with the electrically conductive adhesive and the solid conductive material is then cured at a temperature sufficient to completely cure the matrix to completely surround the electrically conductive adhesive, as well as permanently attaching the matrix and conductive adhesive to the first substrate and permanently attaching the solid conductive material to the conductive adhesive. A second substrate may then be attached to the conductive matrix structure secured to the first substrate by providing a low melting temperature attachment means to the solid conductive material attached to the matrix and subsequently reflowing the assembly to form an electronic assembly adapted with the capability of reworkability.
摘要翻译：提供了一种用于形成电子组件的方法和装置，由此具有多个导体孔的绝缘聚合物基体附接到第一基底，其中导体孔与第一基底上的对应的接触阵列对准。随后，在多个导体孔内提供柔性的导电粘合剂，并且其至少一端连接有优选具有高熔融温度的固体导电材料。然后将具有导电粘合剂和固体导电材料的绝缘聚合物基质在足以完全固化基质以完全包围导电粘合剂的温度下固化，以及将基质和导电粘合剂永久地附着到第一基材上并永久地将固体导电材料附着到导电粘合剂上。然后可以通过向连接到基质的固体导电材料提供低熔点温度的附着装置，随后回流组件以形成适于具有再加工性能的电子组件，然后将第二衬底附接到固定到第一衬底的导电矩阵结构。

24. 发明授权

US06275051B1 Segmented architecture for wafer test and burn-in 有权
标题翻译：用于晶圆测试和老化的分段架构
公开(公告)号：US06275051B1
公开(公告)日：2001-08-14
申请号：US09240121
申请日：1999-01-29
申请人： Thomas W. Bachelder , Dennis R. Barringer , Dennis R. Conti , James M. Crafts , David L. Gardell , Paul M. Gaschke , Mark R. Laforce , Charles H. Perry , Roger R. Schmidt , Joseph J. Van Horn , Wade H. White
发明人： Thomas W. Bachelder , Dennis R. Barringer , Dennis R. Conti , James M. Crafts , David L. Gardell , Paul M. Gaschke , Mark R. Laforce , Charles H. Perry , Roger R. Schmidt , Joseph J. Van Horn , Wade H. White
IPC分类号： G01R1073
CPC分类号： G01R31/2863
摘要： An apparatus for simultaneously testing or burning in a large number of the integrated circuit chips on a product wafer includes probes mounted on a first board and tester chips mounted on a second board, there being electrical connectors connecting the two boards. The tester chips are for distributing power to the product chips or for testing the product chips. The probes and thin film wiring to which they are attached are personalized for the pad footprint of the particular wafer being probed. The base of the first board and the second board both remain the same for all wafers in a product family. The use of two boards provides that the tester chip is kept at a substantially lower temperature than the product chips during burning to extend the lifetime of tester chips. A gap can be used as thermal insulation between the boards, and the gap sealed and evacuated for further thermal insulation. Evacuation also provides atmospheric pressure augmentation of contact for connection between boards and contact to wafer. Probes for parallel testing of chips are arranged in crescent shaped stripes to significantly increase tester throughput as compared with probes arranged in an area array.
摘要翻译：用于在产品晶片上同时测试或燃烧大量集成电路芯片的装置包括安装在第一板上的探针和安装在第二板上的测试器芯片，连接两个板的电连接器。测试器芯片用于向产品芯片分配电力或用于测试产品芯片。其所附接的探针和薄膜布线被个性化以用于被探测的特定晶片的焊盘覆盖区。第一板和第二板的基座对于产品系列中的所有晶片都保持不变。使用两个电路板提供了测试器芯片在燃烧期间保持在比产品芯片基本上更低的温度，以延长测试器芯片的寿命。间隙可以用作板之间的绝热，并将间隙密封并抽真空以进行进一步的隔热。疏散还提供大气压力增加的接触，用于连接板和与晶片的接触。用于平行测试芯片的探针被布置成月牙形条纹，以便与布置在区域阵列中的探针相比显着增加测试仪的吞吐量。

25. 发明授权

US06227943B1 Method and system for pre-cleaning and post-cleaning deposited metal 失效
标题翻译：沉积金属预清洗和后处理的方法和系统
公开(公告)号：US06227943B1
公开(公告)日：2001-05-08
申请号：US09071411
申请日：1998-05-01
申请人： John J. Garant , Charles H. Perry , Srinivasa S. N. Reddy , Donald R. Wall
发明人： John J. Garant , Charles H. Perry , Srinivasa S. N. Reddy , Donald R. Wall
IPC分类号： B24C104
CPC分类号： B24C11/00 , B24C3/12
摘要： A method and system for cleaning an object containing a metal surface, includes pre-cleaning the object to prepare the object for a metal plating thereover, and post-cleaning the object after the object has been plated with the metal plating. The pre-cleaning step and the post-cleaning step each include blasting the object with a media.
摘要翻译：一种用于清洁含有金属表面的物体的方法和系统，包括预清洁物体以准备用于其上的金属镀覆的物体，以及在物体镀覆金属电镀之后对物体进行后清洁。预清洁步骤和后清洗步骤各自包括用介质喷射物体。

26. 发明授权

US06221269B1 Method of etching molybdenum metal from substrates 失效
标题翻译：从基材上蚀刻钼金属的方法
公开(公告)号：US06221269B1
公开(公告)日：2001-04-24
申请号：US09233384
申请日：1999-01-19
申请人： Krishna G. Sachdev , Umar M. Ahmad , Hsing H. Chen , Lawrence D. David , Charles H. Perry , Donald R. Wall
发明人： Krishna G. Sachdev , Umar M. Ahmad , Hsing H. Chen , Lawrence D. David , Charles H. Perry , Donald R. Wall
IPC分类号： C03C1500
CPC分类号： C04B41/009 , C04B41/5353 , C04B2111/00844 , H05K1/092 , H05K3/067 , H05K3/26 , H05K2201/0761 , H05K2203/0789
摘要： A method is provided for etching and removing extraneous molybdenum or debris on ceramic substrates such as semiconductor devices and also for molybdenum etching in the fabrication of molybdenum photomasks. The method employs a multi-step process using an acidic aqueous solution of a ferric salt to remove (etch) the molybdenum debris followed by contacting the treated substrate with an organic quaternary ammonium hydroxide to remove any molybdenum black oxides which may have formed on the exposed surface of treated molybdenum features in ceramic substrates. The method is environmentally safe and the waste solutions may be easily waste treated for example by precipitating the ferric salts as ferric hydroxide and removing anions such as sulfate by precipitation with lime. The method replaces the currently used method of employing ferricyanide salts which create serious hazardous waste disposal and environmental problems.
摘要翻译：提供了一种用于在陶瓷衬底（例如半导体器件）上蚀刻和去除外来的钼或碎片以及在钼光掩模的制造中用于钼蚀刻的方法。该方法采用多步法，使用酸式的铁盐水溶液去除（蚀刻）钼碎片，随后将经处理的底物与有机季铵氢氧化物接触以除去可能形成于暴露的钼黑氧化物处理的钼特征在陶瓷衬底中的表面。该方法是环境安全的，并且废溶液可以容易地被废物处理，例如通过将铁盐沉淀为氢氧化铁并通过用石灰沉淀除去诸如硫酸盐的阴离子。该方法取代了目前使用的铁氰化物盐的方法，造成严重的危险废物处理和环境问题。

27. 发明授权

US5759320A Method of forming cavity substrates using compressive pads 失效
标题翻译：使用压缩垫形成空腔基板的方法
公开(公告)号：US5759320A
公开(公告)日：1998-06-02
申请号：US834302
申请日：1997-04-13
申请人： Govindarajan Natarajan , Robert W. Pasco , Charles H. Perry , Vincent P. Peterson
发明人： Govindarajan Natarajan , Robert W. Pasco , Charles H. Perry , Vincent P. Peterson
IPC分类号： H01L21/48 , B32B31/20
CPC分类号： B32B37/26 , B32B37/0023 , H01L21/4807 , Y10T156/10
摘要： The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a cured thick compressible elastic pad is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves or corners during the lamination process. After the lamination process, the cured thick compressible elastic pad is conveniently removed from the cavity area without causing any damage to the cavity shelves or corners or having any paste pull-outs. This pad can be reused multiple number of times to form these MLC cavity substrates.
摘要翻译：本发明一般涉及一种用于在半导体衬底中形成空腔的新装置和方法，而不需要使用插入件。更具体地说，本发明包括一种用于在半导体衬底中制造空腔的装置和方法，其中在层压之前将固化的厚的可压缩弹性垫放置在空腔上方并使其符合空腔的轮廓，从而防止破坏或损坏到层压过程中的腔架或角落。在层压处理之后，固化的厚的可压缩弹性垫可以方便地从空腔区域移除，而不会对腔架或角落造成任何损坏或具有任何糊状物抽出。该垫可以重复使用多次以形成这些MLC空腔衬底。

28. 发明授权

US5629631A Interface card for a probe card assembly 失效
标题翻译：用于探针卡组件的接口卡
公开(公告)号：US5629631A
公开(公告)日：1997-05-13
申请号：US427395
申请日：1995-04-24
申请人： Charles H. Perry , Tibor L. Bauer , David C. Long , Bruce C. Pickering , Pierre C. Vittori
发明人： Charles H. Perry , Tibor L. Bauer , David C. Long , Bruce C. Pickering , Pierre C. Vittori
IPC分类号： G01R31/26 , G01R1/073 , H01L21/66 , G01R31/02
CPC分类号： G01R1/07378
摘要： Disclosed is a probe card assembly which includes an interface card having a plurality of contact pads on at least one surface thereof, a probe card having a plurality of contact pads on at least one surface thereof, and a carousel interposed between the interface card and the probe card having a plurality of connecting means for making contact between the interface card contact pads and probe card contact pads.Also disclosed are the probe card, interface card and carousel as separate articles of manufacture.
摘要翻译：公开了一种探针卡组件，其包括在其至少一个表面上具有多个接触焊盘的接口卡，在其至少一个表面上具有多个接触焊盘的探针卡，以及插入在接口卡和接口卡之间的转盘探针卡具有用于在接口卡接触垫和探针卡接触垫之间接触的多个连接装置。还公开了探针卡，接口卡和转盘作为单独的制造商品。

29. 发明授权

US5530371A Probe card assembly 失效
标题翻译：探头卡组合
公开(公告)号：US5530371A
公开(公告)日：1996-06-25
申请号：US427397
申请日：1995-04-24
申请人： Charles H. Perry , Tibor L. Bauer , David C. Long , Bruce C. Pickering , Pierre C. Vittori
发明人： Charles H. Perry , Tibor L. Bauer , David C. Long , Bruce C. Pickering , Pierre C. Vittori
IPC分类号： G01R31/26 , G01R1/073 , H01L21/66 , G01R31/02
CPC分类号： G01R1/07378
摘要： A carousel for a probe card assembly which includes opposed planar rings supported and spaced apart by flexible supports. The flexible supports, while supporting the planar rings, also allow the planar rings to rotate with respect to each other. Also included are a plurality of connecting means which pass through perforations in the planar rings so as to thereby make interconnection between a probe card and an interface card in a semiconductor test system.
摘要翻译：用于探针卡组件的转盘，其包括由柔性支撑件支撑并间隔开的相对的平面环。柔性支撑件在支撑平面环的同时也允许平面环相对于彼此旋转。还包括通过平面环中的穿孔的多个连接装置，从而在半导体测试系统中进行探针卡和接口卡之间的互连。

30. 发明授权

US5293504A Multilayer ceramic substrate with capped vias 失效
标题翻译：多层陶瓷基板带有通孔
公开(公告)号：US5293504A
公开(公告)日：1994-03-08
申请号：US949598
申请日：1992-09-23
申请人： John U. Knickerbocker , Charles H. Perry , Donald R. Wall
发明人： John U. Knickerbocker , Charles H. Perry , Donald R. Wall
IPC分类号： H01L23/12 , H01L23/498 , H01L23/538 , H05K1/03 , H05K1/11 , H05K3/40 , H05K3/46 , H05K1/00
CPC分类号： H05K3/4061 , H01L23/49866 , H01L23/5384 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2201/0269 , H05K2201/0352 , H05K2201/096 , H05K3/4611 , H05K3/4629
摘要： Disclosed is a multilayer ceramic substrate for electronic applications including:(a) at least one internal layer having vias at least partially filled with a metallic material;(b) at least one sealing layer having vias at least partially filled with a composite material that is a mixture of ceramic and metallic materials wherein at least one via from the internal layer is aligned with at least one via from the sealing layer; and(c) a cap of material interposed between the aligned vias.Also disclosed is a method of forming the multilayer ceramic substrate.
摘要翻译：公开了一种用于电子应用的多层陶瓷基板，包括：（a）至少一个内部层，其具有至少部分地填充有金属材料的通孔; （b）至少一个密封层，其具有至少部分填充有陶瓷和金属材料的混合物的复合材料的通孔，其中来自内层的至少一个通孔与来自密封层的至少一个通孔对准; 和（c）插入在对齐的通孔之间的材料盖。还公开了形成多层陶瓷基板的方法。

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