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    • 11. 发明授权
    • Toughened thermoplastic molding material
    • 增韧热塑性成型材料
    • US5266638A
    • 1993-11-30
    • US975730
    • 1992-11-13
    • Norbert NiessnerKlaus MuehlbachFriedrich Seitz
    • Norbert NiessnerKlaus MuehlbachFriedrich Seitz
    • C08L23/02C08L25/08C08L25/12C08L39/04C08L35/00
    • C08L23/02C08L25/12C08L25/08
    • A thermoplastic molding material which is made up of components A, B, C, and D. Component A comprises 10-90% of the composition and is a copolymer made up of 30-95% styrene; 4-40% (meth)acrylonitrile, methyl methacrylate, or maleic anhydride; 1-30% of a monomer described by formula in the specification, N-vinylimidazole or N-vinylcarbazole; and up to 40% of a copolymerizable ethylenically unsaturated monomer. Component B comprises 10-90% of the composition and is a copolymer made up of 50-99.9% of an alpha-olefin; 0.1-50% of a monomer containing acid groups; and up to 40% of a copolymerizable ethylenically unsaturated monomer. Component C comprises up to 80% of the composition and is a copolymer made up of 50-95% styrene and 5-50% (meth)acrylonitrile, methyl methacrylate or maleic anhydride. Component D comprises up to 80% of the composition and is made up of a polycarbonate. All percentages are by weight.
    • 由A,B,C和D组分组成的热塑性成型材料。组分A占组合物的10-90%,是由30-95%苯乙烯组成的共聚物; 4-40%(甲基)丙烯腈,甲基丙烯酸甲酯或马来酸酐; 1-30%的说明书中由式表示的单体,N-乙烯基咪唑或N-乙烯基咔唑; 和高达40%的可共聚烯属不饱和单体。 组分B包含10-90%的组合物,并且是由50-99.9%的α-烯烃组成的共聚物; 0.1-50%含酸基团的单体; 和高达40%的可共聚烯属不饱和单体。 组分C包含至多80%的组合物,并且是由50-95%苯乙烯和5-50%(甲基)丙烯腈,甲基丙烯酸甲酯或马来酸酐组成的共聚物。 组分D包含至多80%的组合物,并由聚碳酸酯制成。 所有百分比均以重量计。
    • 13. 发明授权
    • Halogen-free flameproofed thermoplastic molding materials based on
polyphenylene ethers and polystyrene
    • 基于聚苯醚和聚苯乙烯的无卤阻燃热塑性成型材料
    • US5444123A
    • 1995-08-22
    • US203512
    • 1994-02-28
    • Doris ZeltnerNorbert NiessnerFriedrich SeitzRanier NeumannStefan Seelert
    • Doris ZeltnerNorbert NiessnerFriedrich SeitzRanier NeumannStefan Seelert
    • C08K5/523C08L25/02C08L43/02C08L51/04C08L71/12C08F30/02C08F230/02
    • C08L25/02C08K5/523C08L71/123C08L43/02C08L51/04C08L71/12
    • Halogen-free flameproofed thermoplastic molding materials based on polyphenylene ethers and polystyrene containing, as essential components,A) from 5 to 92% by weight of one or more polyphenylene ethers,B) from 5 to 92% by weight of a vinylaromatic polymer andC) from 3 to 25% by weight of a flameproofing agent based onC1) from 20 to 100% by weight (based on the total amount of C) of a polymeric phosphorus compound which is obtained by polymerizing or copolymerizing one or more compounds of the following structure: ##STR1## where ##STR2## R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.10 and R.sup.11 are each hydrogen, alkyl, cycloalkyl, aralkyl or aryl,R.sup.7, R.sup.8 and R.sup.9 are each alkylidene, cycloalkylidene, aralkylidene or arylidene,m, p, q, r, s, t, u and v are each 0 or 1,n is 0, 1 or 2,U is COO, O, S or NR.sup.9,V, W, X and Y are each O, S or NR.sup.9 andZ is O, S or NR.sup.10 R.sup.11, andC2) from 0 to 80% by weight (based on the total amount of C) of a low molecular weight phosphorus compound selected from the group consisting of the phosphine oxides, phosphates, phosphinic acids and salts and esters thereof, phosphonic acids and salts and esters thereof and red phosphorus.
    • 基于聚苯醚和聚苯乙烯的无卤阻燃热塑性成型材料,作为必要成分A)5〜92重量%的一种或多种聚苯醚,B)5〜92重量%的乙烯基芳族聚合物和C )3至25重量%的基于C1)的阻燃剂,其为通过聚合或共聚一种或多种化合物而获得的聚合磷化合物的20至100重量%(基于C的总量) 其中,R1,R2,R3,R4,R5,R10和R11各自为氢,烷基,环烷基,芳烷基或芳基,R7,R8和R9分别为亚烷基,亚环烷基,亚烷基或亚芳基, m,p,q,r,s,t,u和v各自为0或1,n为0,1或2,U为COO,O,S或NR9,V,W,X和Y各自为O, S或NR 9,Z为O,S或NR 10 R 11和C 2)0至80重量%(基于C的总量)选自组中的低分子量磷化合物 磷化氢,磷酸盐,次膦酸及其盐和酯,膦酸及其盐和酯以及红磷。
    • 20. 发明授权
    • Photopolymerizable laminating material
    • 光聚合层压材料
    • US5114831A
    • 1992-05-19
    • US562568
    • 1990-08-02
    • Friedrich SeitzGerhard HoffmannGerhard Bauer
    • Friedrich SeitzGerhard HoffmannGerhard Bauer
    • C08F2/48G03F7/085
    • G03F7/085
    • These photopolymerizable laminating materials consist of at least one film-forming polymer as a binder, at least one organic compound which is compatible with the binder, has at least two double bonds capable of addition polymerization and may be partially replaced by an organic compound having only one double bond capable of addition polymerization, a photoinitiator or photoinitiator system and an adhesion promoter, with or without conventional additives and assistants, the adhesion promoter used being a tricyclic heteroaromatic compound which is soluble in aqueous alkaline solutions.The said laminating materials are suitable for the production of printed circuits.
    • 这些可光聚合层压材料由至少一种作为粘合剂的成膜聚合物组成,至少一种与粘合剂相容的有机化合物具有至少两个能够加成聚合的双键,并且可以部分地被仅具有有机化合物的化合物 一种能够加成聚合的双键,光引发剂或光引发剂体系和粘合促进剂,具有或不具有常规添加剂和辅助剂的粘合促进剂,所述粘合促进剂是可溶于碱性水溶液的三环杂芳族化合物。 所述层压材料适用于生产印刷电路。