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    • 12. 发明授权
    • Target body position measuring method for charged particle beam fine
pattern exposure system
    • 带电粒子束精细图案曝光系统的目标体位置测量方法
    • US4558225A
    • 1985-12-10
    • US527486
    • 1983-08-29
    • Mineo GotouRyoichi YoshikawaToru TojoHirotsugu Wada
    • Mineo GotouRyoichi YoshikawaToru TojoHirotsugu Wada
    • G01B15/00H01J37/304H01L21/027H01L21/30G03F9/00
    • H01J37/3045H01L21/30
    • Disclosed is a method for measuring the position of a silicon wafer as a workpiece to be exposed. The method is suitably used in an electron beam exposure system. A wafer has a plurality of chip alignment marks which respectively designate a plurality of chip field areas, included in a dicing line area. When the wafer is contained ion a holder and is fixed in the exposure system, edge portions of the wafer are partially scanned with the electron beam to roughly measure the position of the wafer. In accordance with this wafer position data, a wafer surface portion required for detecting only the marks is defined within the dicing line area. In the mark detection with the electron beam, the electron beam irradiates only the defined wafer surface portion of the wafer surface, thereby providing highly precise measurement of the wafer position and avoiding undesirable irritation of the circuit formation area.
    • 公开了一种用于测量作为待曝光的工件的硅晶片的位置的方法。 该方法适用于电子束曝光系统。 晶片具有分别指定在切割线区域中的多个芯片场区域的多个芯片对准标记。 当晶片被包含在保持器上并固定在曝光系统中时,晶片的边缘部分被电子束部分地扫描以粗略地测量晶片的位置。 根据该晶片位置数据,在切割线区域内限定仅检测标记所需的晶片表面部分。 在用电子束进行的标记检测中,电子束仅照射晶片表面的限定的晶片表面部分,从而提供对晶片位置的高精度测量,并避免对电路形成区域的不期望的刺激。
    • 13. 发明授权
    • Pattern inspection apparatus
    • 图案检验仪
    • US07421109B2
    • 2008-09-02
    • US10642760
    • 2003-08-19
    • Hideo TsuchiyaKyoji YamashitaToshiyuki WatanabeIkunao IsomuraToru TojoYasushi Sanada
    • Hideo TsuchiyaKyoji YamashitaToshiyuki WatanabeIkunao IsomuraToru TojoYasushi Sanada
    • G06K9/00G01B11/00G01J1/10
    • G06T7/0004G06T2207/30148
    • A pattern inspecting method, comprising preparing a sample having a first and a second inspection regions and an imaging device having a plurality of pixels, scanning the first inspection region to a first direction using the imaging device to obtain a first measurement pattern representing at least parts of the first inspection region, scanning the second inspection region to the first direction using the imaging device to obtain a second measurement pattern representing at least parts of the second inspection region, comparing the first measurement pattern and the second measurement pattern with each other to determine presence or absence of a defect formed on the sample, and controlling a scanning condition for scanning a pattern of the second inspection region by the imaging device so as to keep the same with the scanning condition when the pattern of the first inspection region is scanned by the imaging device.
    • 一种图案检查方法,包括准备具有第一和第二检查区域的样本和具有多个像素的成像装置,使用成像装置将第一检查区域扫描到第一方向,以获得表示至少部分的第一测量图案 使用所述成像装置将所述第二检查区域扫描到所述第一方向,以获得表示所述第二检查区域的至少一部分的第二测量图案,将所述第一测量图案和所述第二测量图案彼此进行比较,以确定 存在或不存在形成在样品上的缺陷,以及控制用于通过成像装置扫描第二检查区域的图案的扫描条件,以便当第一检查区域的图案被扫描时与扫描条件保持相同 成像装置。
    • 14. 发明申请
    • Alignment method
    • 对齐方法
    • US20050128451A1
    • 2005-06-16
    • US11012257
    • 2004-12-16
    • Soichiro MitsuiToru TojoKiminobu Akeno
    • Soichiro MitsuiToru TojoKiminobu Akeno
    • G01B11/00G03F9/00H01L21/027H01L21/68G03B27/42
    • H01L21/681
    • An alignment apparatus for substrates comprises a first movement mechanism moving a substrate to be treated in a horizontal direction, a second movement mechanism moving the substrate in a vertical direction, a rotation mechanism rotating the substrate in a substrate plane, an illumination tool irradiating the substrate from a sidewise direction in a state where the substrate is held in a desired height position by the second movement mechanism, an image sensor picking up an image on a back surface of the substrate in an irradiated state, an edge position sensor sensing plural edge positions of the substrate from an image obtained by the image sensor, and a control computer obtaining a positional shift of the substrate based on the edge positions sensed by the edge position sensor and correcting a positional shift of the horizontal and rotation directions by the first movement and rotation mechanisms.
    • 基板对准装置包括:沿水平方向移动待处理基板的第一移动机构,沿垂直方向移动基板的第二移动机构,在基板平面内旋转基板的旋转机构,照射基板的照明工具 在通过第二移动机构将基板保持在期望的高度位置的状态下的侧面方向上,以照射状态在基板的背面拾取图像的图像传感器,感测多个边缘位置的边缘位置传感器 根据由图像传感器获得的图像获得基板的位置偏移;以及控制计算机,基于由边缘位置传感器感测的边缘位置获得基板的位置偏移,并且通过第一移动来校正水平和旋转方向的位置偏移,以及 旋转机制。
    • 15. 发明申请
    • Automatic focusing apparatus
    • 自动对焦装置
    • US20050052634A1
    • 2005-03-10
    • US10897120
    • 2004-07-23
    • Shinji SugiharaRiki OgawaToru Tojo
    • Shinji SugiharaRiki OgawaToru Tojo
    • G01B11/02G02B7/28G02B21/26G03B27/52G03F7/20G03F9/00H01L21/027
    • G03F9/7088G03F7/70725G03F9/7003G03F9/7026G03F9/7034
    • An automatic focusing apparatus comprises a stage holding a substrate, an objective lens disposed facing the substrate surface, an illumination optics illuminating the substrate surface with a spotted light beam from an oblique direction, a photodetector detecting reflected light from the substrate surface, a position detection circuit detecting a vertical position of the substrate surface from an electric signal obtained from the photodetector to output a position signal, a correction circuit monitoring the position signal in real time and subtracting a surplus exceeding a signal change corresponding to a surface shape change of the substrate from the position signal, when a change amount per unit time of the position signal exceeds a predetermined level and outputting a corrected position signal, and a stage control circuit controlling the vertical position of the stage based on the corrected position signal.
    • 一种自动对焦装置,包括:保持基板的台阶,与基板面对面配置的物镜;从倾斜方向用点状光束照射基板表面的照明光学元件;检测来自基板面的反射光的光电检测器;位置检测 检测从光电检测器获得的电信号的基板表面的垂直位置以输出位置信号,校正电路实时监控位置信号,并减去超过与基板的表面形状变化相对应的信号变化的剩余量 当位置信号的每单位时间的变化量超过预定值并输出校正的位置信号时,根据位置信号,以及基于校正位置信号控制舞台的垂直位置的舞台控制电路。
    • 17. 发明授权
    • Temperature measuring method in pattern drawing apparatus
    • 图案绘图装置中的温度测量方法
    • US06676289B2
    • 2004-01-13
    • US09933719
    • 2001-08-22
    • Ryoichi HiranoShusuke YoshitakeToru TojoShuichiro FukutomeTeruaki YamamotoMasaki Toriumi
    • Ryoichi HiranoShusuke YoshitakeToru TojoShuichiro FukutomeTeruaki YamamotoMasaki Toriumi
    • G01K1300
    • G01K7/42
    • According to one embodiment of the present invention, the present invention may provide a temperature measuring method in a pattern drawing apparatus having a drawing chamber for drawing a pattern on a substrate to be transferred inside, a stage installed inside the drawing chamber, a standby chamber connected to the drawing chamber, and a thermostatic device installed inside the standby chamber, characterized in that a dummy substrate having a temperature measuring device and a recording device for recording the temperature measured by the temperature measuring device is transferred to the thermostatic device, then transferred into the drawing chamber, and then put on the stage, thus the temperature history of the dummy substrate in the transfer route from the thermostatic device to the stage is measured by the temperature measuring device and recorded in the recording device.
    • 根据本发明的一个实施例,本发明可以提供一种图形绘制装置中的温度测量方法,该图形绘制装置具有用于在待传送内部的基板上绘制图案的拉伸室,安装在拉伸室内的台,备用室 连接到拉伸室,以及安装在备用室内的恒温装置,其特征在于,具有用于记录由温度测量装置测量的温度的温度测量装置和记录装置的虚拟基板被传送到恒温装置,然后转移 进入拉伸室,然后放在平台上,由温度测量装置测量从恒温装置到载物台的传输路径中的虚拟基板的温度历史记录在记录装置中。
    • 18. 发明授权
    • Method for aligning first and second objects relative to each other and
apparatus for practicing this method
    • 用于使第一和第二物体相对于彼此对准的方法以及用于实施该方法的装置
    • US4811062A
    • 1989-03-07
    • US214821
    • 1988-07-01
    • Mitsuo TabataToru TojoHiroaki Shimozono
    • Mitsuo TabataToru TojoHiroaki Shimozono
    • H01L21/00G03F9/00H01L21/027H01L21/30H01L21/67H01L21/68G01B11/26
    • G03F9/7049
    • In a method for aligning first and second objects relative to each other, according to this invention, the first and second objects are arranged opposite to each other, and are aligned in a direction perpendicular to their opposing direction. A grating pattern is formed, as an alignment mark, on the first object, and a checkerboard-like grating pattern is formed, also as an alignment mark, on the second object. A light beam emitted from an alignment light source is radiated onto the checkerboard-like grating pattern of the second object. The light beam diffracted by the checkerboard-like grating pattern is guided onto the grating pattern of the first object. The light beam diffracted by the grating pattern of the first object is detected by a detector. Since the light beam emitted from the light source is diffracted by the checkerboard-like grating pattern, a relative position of the first and second objects can be detected, irrespective of the distance therebetween. The first and second objects are accurately aligned, based on the detection result. This invention can be applied to a method for aligning a mask and a wafer when a circuit pattern pre-formed on the mask is to be transferred onto the wafer.
    • 在第一和第二物体相对于彼此对准的方法中,根据本发明,第一和第二物体彼此相对布置,并且在垂直于它们的相反方向的方向上对齐。 在第一物体上形成作为对准标记的光栅图案,并且在第二物体上形成棋盘状光栅图案,也作为对准标记。 从对准光源发射的光束被辐射到第二物体的棋盘状光栅图案上。 由棋盘状光栅图案衍射的光束被引导到第一物体的光栅图案上。 由第一物体的光栅图案衍射的光束由检测器检测。 由于从光源发射的光束被棋盘状光栅图案衍射,所以可以检测第一和第二物体的相对位置,而与它们之间的距离无关。 基于检测结果,第一和第二物体被精确对准。 当将掩模上预先形成的电路图案转印到晶片上时,本发明可以应用于将掩模和晶片对准的方法。