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11. 发明授权

US5545594A Semiconductor sensor anodic-bonding process, wherein bonding of corrugation is prevented 失效
标题翻译：半导体传感器阳极结合工艺，其中防止了波纹的接合
公开(公告)号：US5545594A
公开(公告)日：1996-08-13
申请号：US141054
申请日：1993-10-26
申请人： Sean S. Cahill
发明人： Sean S. Cahill
IPC分类号： G01L9/12 , G01L9/00 , H01L29/84 , H01L21/46 , H01G7/00
CPC分类号： G01L9/0073 , G01L9/0042
摘要： A method for bonding a silicon substrate and a glass substrate through an anodic-bonding process, including steps of: forming at least two holes in the glass substrate; forming a recess on the glass substrate, the recess confronting an undesired bonding portion defined in the silicon substrate; depositing a metal layer on the glass substrate with a predetermined pattern; depositing a dielectric layer on the metal layer, the insulating layer covering substantially the entire surface of the metal layer; and bonding the glass substrate and the semiconductor material.
摘要翻译：一种通过阳极结合工艺粘合硅衬底和玻璃衬底的方法，包括以下步骤：在玻璃衬底中形成至少两个孔; 在所述玻璃基板上形成凹部，所述凹部面对限定在所述硅基板中的不期望的结合部; 以预定图案在玻璃基板上沉积金属层; 在所述金属层上沉积介电层，所述绝缘层基本上覆盖所述金属层的整个表面; 并且接合玻璃基板和半导体材料。

12. 发明授权

US5528070A Semiconductor sensor manufactured through anodic-bonding process 失效
标题翻译：半导体传感器通过阳极结合工艺制造
公开(公告)号：US5528070A
公开(公告)日：1996-06-18
申请号：US321829
申请日：1994-10-06
申请人： Sean S. Cahill
发明人： Sean S. Cahill
IPC分类号： G01L9/12 , G01L9/00 , H01L29/84 , H01L29/82 , H01L23/58 , H01L29/06
CPC分类号： G01L9/0073 , G01L9/0042
摘要： A semiconductor sensor comprising a semiconductor substrate and a glass substrate. The semiconductor substrate includes a support member having an opening centrally defined therein, a diaphragm positioned in the opening of the support member, and a flexible supporting means for supporting and coupling the diaphragm and the support member. The glass substrate includes a portion facing the diaphragm and the supporting means and at least one recess defined in this portion which faces the entirety of the supporting means. The glass substrate also includes a metal layer deposited on a surface of the glass substrate and a dielectric layer deposited on the metal layer such that the dielectric layer faces the diaphragm.
摘要翻译：一种半导体传感器，包括半导体衬底和玻璃衬底。半导体衬底包括：具有中心限定在其中的开口的支撑构件，位于支撑构件的开口中的隔膜，以及用于支撑和联接隔膜和支撑构件的柔性支撑装置。玻璃基板包括面向隔膜的部分和支撑装置，以及限定在该部分中的面向整个支撑装置的至少一个凹部。玻璃基板还包括沉积在玻璃基板的表面上的金属层和沉积在金属层上的电介质层，使得电介质层面向隔膜。

13. 发明授权

US5444244A Piezoresistive cantilever with integral tip for scanning probe microscope 失效
标题翻译：用于扫描探针显微镜的压阻悬臂
公开(公告)号：US5444244A
公开(公告)日：1995-08-22
申请号：US073201
申请日：1993-06-03
申请人： Michael D. Kirk , Ian R. Smith , Marco Tortonese , Sean S. Cahill , Timothy G. Slater
发明人： Michael D. Kirk , Ian R. Smith , Marco Tortonese , Sean S. Cahill , Timothy G. Slater
IPC分类号： G01Q30/02 , G01Q20/04 , G01Q60/38 , H01J37/00
CPC分类号： G01Q20/04 , B82Y35/00 , G01Q60/38 , Y10S977/873
摘要： A cantilever for a scanning probe microscope is disclosed. The cantilever includes a piezoresistor for detecting the deflection of the cantilever, and a tip which is formed integrally with the cantilever. A process of fabricating such a cantilever is also disclosed, the process yielding a tip which has a high aspect ratio and a small radius of curvature at its apex. A combined atomic force/lateral force microscope including two or more piezoresistors responsive to both the bending and torsion of the cantilever is also disclosed.
摘要翻译：公开了一种用于扫描探针显微镜的悬臂。悬臂包括用于检测悬臂的偏转的压电电阻器和与悬臂一体形成的尖端。还公开了制造这种悬臂的方法，该方法产生在其顶点具有高纵横比和小曲率半径的尖端。还公开了包括响应于悬臂的弯曲和扭转的两个或更多个压敏电阻的组合的原子力/横向力显微镜。

14. 发明授权

US09275961B2 Low cost high frequency device package and methods 有权
公开(公告)号：US09275961B2
公开(公告)日：2016-03-01
申请号：US13485573
申请日：2012-05-31
申请人： Eric A. Sanjuan , Sean S. Cahill
发明人： Eric A. Sanjuan , Sean S. Cahill
IPC分类号： H05K1/11 , H01L23/66 , H01L23/047 , H01L23/00 , H05K1/02
CPC分类号： H01L23/66 , H01L23/047 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2223/6627 , H01L2224/05599 , H01L2224/32245 , H01L2224/45014 , H01L2224/45015 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48471 , H01L2224/4903 , H01L2224/73265 , H01L2224/8592 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/181 , H01L2924/1903 , H01L2924/19032 , H01L2924/19033 , H01L2924/19042 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H05K1/0243 , Y10T29/49002 , Y10T29/49018 , Y10T29/49121 , Y10T29/49126 , Y10T29/49144 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/45099 , H01L2924/20752
摘要： A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.

15. 发明申请

US20140070904A1 METALIZED MOLDED PLASTIC COMPONENTS FOR MILLIMETER WAVE ELECTRONICS AND METHOD FOR MANUFACTURE 有权
标题翻译：金属化模制塑料组件，用于制造毫米波电子及其制造方法
公开(公告)号：US20140070904A1
公开(公告)日：2014-03-13
申请号：US13607539
申请日：2012-09-07
申请人： Sean S. Cahill , Eric A. Sanjuan
发明人： Sean S. Cahill , Eric A. Sanjuan
IPC分类号： H01P11/00 , H01P5/12 , H01P3/12
CPC分类号： H01P1/208 , H01P1/207 , H01P1/213 , H01P1/2138 , H01P5/12 , H01P11/002 , Y10T29/49016
摘要： Waveguide components that have a high degree of performance accuracy over the temperature range of interest are provided. The components require no post-formation trimming steps, are light-weight, and dimensionally stable. In addition, a method for the manufacture of these millimeter wave components is provided.
摘要翻译：提供了在感兴趣的温度范围内具有高度性能精度的波导部件。这些部件不需要后部修整步骤，重量轻且尺寸稳定。另外，提供了制造这些毫米波部件的方法。

16. 发明授权

US5629243A Preloaded linear beam vibration sensor and its manufacturing method 失效
标题翻译：预载线束振动传感器及其制造方法
公开(公告)号：US5629243A
公开(公告)日：1997-05-13
申请号：US528043
申请日：1995-09-14
申请人： Sean S. Cahill , Walter Shoeys , Kenichi Nakamura
发明人： Sean S. Cahill , Walter Shoeys , Kenichi Nakamura
IPC分类号： G01P15/00 , B81B3/00 , B81C1/00 , G01H11/06 , G01P15/08 , G01P15/135 , H01G5/18
CPC分类号： G01P15/135 , G01P15/0802 , G01P2015/0814 , G01P2015/0831
摘要： A method is described for manufacturing a miniaturized accelerometer having a narrow bandwidth and behaving as a switch sensitive only to low frequencies such as are contained in earthquakes. The method includes provision of an unbalanced see-saw beam assembly composed of beams 2 and masses 3 at opposite ends of the beams 2. The beams 2 have their suspension at a location with slightly different distances from the masses 3 along a line parallel to and vertically offset from the line connecting centers of gravity of the masses 3.
摘要翻译：描述了一种用于制造具有窄带宽并且表现为仅对诸如包含在地震中的低频敏感的开关的小型化加速度计的方法。该方法包括在梁2的相对端处设置由梁2和质量块3组成的不平衡跷跷板组件。梁2具有悬挂在距物体3稍微不同的距离处的位置，沿着平行于垂直偏离连接质心重心的线3。

17. 发明申请

US20120234588A1 LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS 有权
标题翻译：低成本高频器件封装和方法
公开(公告)号：US20120234588A1
公开(公告)日：2012-09-20
申请号：US13485573
申请日：2012-05-31
申请人： Eric A. Sanjuan , Sean S. Cahill
发明人： Eric A. Sanjuan , Sean S. Cahill
IPC分类号： H05K1/16
CPC分类号： H01L23/66 , H01L23/047 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2223/6627 , H01L2224/05599 , H01L2224/32245 , H01L2224/45014 , H01L2224/45015 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48471 , H01L2224/4903 , H01L2224/73265 , H01L2224/8592 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/181 , H01L2924/1903 , H01L2924/19032 , H01L2924/19033 , H01L2924/19042 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H05K1/0243 , Y10T29/49002 , Y10T29/49018 , Y10T29/49121 , Y10T29/49126 , Y10T29/49144 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/45099 , H01L2924/20752
摘要： A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.
摘要翻译：描述了一种低成本高频电子器件封装和相关的制造方法，其中波导结构从高频器件形成为封装引线转变。封装引线转换优化，以利用波导互连结构。

18. 发明申请

US20090159320A1 Low Cost High Frequency Device Package and Methods 有权
标题翻译：低成本高频器件封装和方法
公开(公告)号：US20090159320A1
公开(公告)日：2009-06-25
申请号：US11960681
申请日：2007-12-19
申请人： Eric A. Sanjuan , Sean S. Cahill
发明人： Eric A. Sanjuan , Sean S. Cahill
IPC分类号： H05K1/16 , H05K3/34
CPC分类号： H01L23/66 , H01L23/047 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2223/6627 , H01L2224/05599 , H01L2224/32245 , H01L2224/45014 , H01L2224/45015 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48471 , H01L2224/4903 , H01L2224/73265 , H01L2224/8592 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/181 , H01L2924/1903 , H01L2924/19032 , H01L2924/19033 , H01L2924/19042 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H05K1/0243 , Y10T29/49002 , Y10T29/49018 , Y10T29/49121 , Y10T29/49126 , Y10T29/49144 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/45099 , H01L2924/20752
摘要： A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.
摘要翻译：描述了一种低成本高频电子器件封装和相关的制造方法，其中波导结构从高频器件形成为封装引线转变。封装引线转换优化，以利用波导互连结构。

19. 发明授权

US6058027A Micromachined circuit elements driven by micromachined DC-to-DC converter on a common substrate 失效
标题翻译：由微加工的DC-DC转换器在公共基板上驱动的微加工电路元件
公开(公告)号：US6058027A
公开(公告)日：2000-05-02
申请号：US251103
申请日：1999-02-16
申请人： Douglas A. Vargha , Sean S. Cahill
发明人： Douglas A. Vargha , Sean S. Cahill
IPC分类号： B81B3/00 , H01H59/00 , H02M3/38 , H02M3/42
CPC分类号： H02M3/38 , H02M3/44 , H01H59/0009
摘要： The present invention comprises the combination of one or more micromachined circuit elements and a micromachined DC-to-DC step-up converter on the same or different substrates, so as to allow the operation of the micromachined circuit element at a different voltage, typically a higher or a negative voltage, in comparison to the input power supply to the system. The micromachined structure of such a converter requires little chip area and is normally fully compatible with the micromachined structure of other micromachined circuit elements, such switches and resonators, providing obvious advantages when formed on the same substrate as such devices. Similarly, micromachined switches have the advantage of providing substantially greater isolation between the signal being switched and the signal doing the switching, and provide a much better ratio between the off resistance to the on resistance than can be achieved with transistor switching devices, such as by way of example, MOS switches. Micromachined resonators also offer many advantages, such as an equivalent of tuned circuits with very high Q factor, and do so without requiring inductors or active devices in oscillatory circuits having a risk of instability, and of allowing the realization of the equivalent of complicated tuned circuits in a small chip area.
摘要翻译：本发明包括在相同或不同的衬底上组合一个或多个微加工电路元件和微机械加工的DC-DC升压转换器，以便允许微加工电路元件的操作在不同的电压，通常为与系统的输入电源相比较高或负电压。这种转换器的微加工结构需要很少的芯片面积，并且通常完全与其它微加工电路元件（例如开关和谐振器）的微加工结构完全兼容，当与这种器件形成在相同的衬底上时，提供了明显的优点。类似地，微加工开关具有在被切换的信号和进行切换的信号之间提供显着更大的隔离的优点，并且提供比可以用晶体管开关器件实现的关断电阻与导通电阻之间更好的比例，例如通过例子，MOS开关。微加工谐振器还具有许多优点，例如等效于具有非常高Q因子的调谐电路，并且不需要在具有不稳定性的风险的振荡电路中的电感器或有源器件，并且允许实现等效于复杂调谐电路在一个小芯片领域。

20. 发明授权

US5604313A Varying apparent mass accelerometer 失效
标题翻译：不同的表观质量加速度计
公开(公告)号：US5604313A
公开(公告)日：1997-02-18
申请号：US346263
申请日：1994-11-23
申请人： Sean S. Cahill , Kenichi Nakamura
发明人： Sean S. Cahill , Kenichi Nakamura
IPC分类号： B81B3/00 , G01H11/06 , G01P15/08 , G01P15/125 , G01V1/00 , G01P15/00 , H01G7/00
CPC分类号： G01P15/0802 , G01P15/125 , G01V1/008 , G01P2015/0828
摘要： A varying apparent mass accelerometer 1 for detecting earthquake vibrations includes a frame 2 vibrating with an earthquake wave, a mass 51 supported on the frame 2 via a spring 52, electrodes 6 and 7 disposed above and below the mass 51, power sources 8 each applying a voltage across the electrodes 6 and 7, and a capacitance detector 9 for detecting changes in capacitance between the electrodes. The accelerometer 1 exerts a signal only when an acceleration exceeds a threshold.
摘要翻译：用于检测地震振动的变化的表观质量加速度计1包括用地震波振动的框架2，经由弹簧52支撑在框架2上的质量51，设置在质量块51上方和下方的电极6和7，每个施加的电源8 电极6和7两端的电压，以及用于检测电极间电容变化的电容检测器9。加速度计1仅在加速度超过阈值时施加信号。

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