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    • 15. 发明授权
    • Organic anti-reflective coating polymer, anti-reflective coating composition methods of preparation thereof
    • 有机抗反射涂料聚合物,抗反射涂料组合物的制备方法
    • US06486283B2
    • 2002-11-26
    • US09888893
    • 2001-06-25
    • Sung-eun HongMin-ho JungJae-chang JungGeun-su LeeKi-ho Baik
    • Sung-eun HongMin-ho JungJae-chang JungGeun-su LeeKi-ho Baik
    • C08F22010
    • C08F220/36G03F7/091
    • An organic anti-reflective polymer having the following Formula 1, its preparation method, an anti-reflective coating composition comprising the said organic anti-reflective polymer and a preparation method of an anti-reflective coating made therefrom. The anti-reflective coating comprising the polymer eliminates standing waves caused by the optical properties of lower layers on the wafer and by the thickness changes of the photoresist, prevents back reflection and CD alteration caused by the diffracted and reflected light from such lower layers. Such advantages enable the formation of stable ultrafine patterns suitable for 64M, 256M, 1G, 4G, and 16G DRAM semiconductor devices, improves production yields and enables control of the k value. Further, it is also possible to prevent undercutting due to an unbalanced acidity after finishing the coating.
    • 具有下列通式1的有机抗反射聚合物,其制备方法,包含所述有机抗反射聚合物的抗反射涂料组合物和由其制备的抗反射涂层的制备方法。 包含该聚合物的抗反射涂层消除了由晶片上的下层的光学性能引起的驻波以及光致抗蚀剂的厚度变化,从而防止由这种较低层衍射的和反射光引起的背反射和CD变化。 这样的优点使得能够形成适合于64M,256M,1G,4G和16G DRAM半导体器件的稳定超细格局,提高了生产成本并且能够控制k值。 此外,还可以防止在涂覆完成后由于不均衡的酸度引起的底切。
    • 16. 发明授权
    • Top anti-reflective coating polymer, its preparation method and top anti-reflective coating composition comprising the same
    • 顶级抗反射涂料聚合物,其制备方法和包含其的顶部抗反射涂料组合物
    • US07267924B2
    • 2007-09-11
    • US11099166
    • 2005-04-05
    • Jae-chang Jung
    • Jae-chang Jung
    • G03C1/825G03F7/30C08F222/02C08F221/10C08F118/02
    • G03F7/091
    • Disclosed herein are a top anti-reflective coating polymer used in a photolithography process, which is one of the fabrication processes for a semiconductor device, a method for preparing the anti-reflective coating polymer, and an anti-reflective coating composition comprising the anti-reflective coating polymer. Specifically, the top anti-reflective coating polymer is used in immersion lithography for the fabrication of a sub-50 nm semiconductor device. The top anti-reflective coating polymer is represented by Formula 1 below: wherein R1, R2 and R3 are independently hydrogen or a methyl group; and a, b and c represent the mole fraction of each monomer, and are in the range between about 0.05 and about 0.9. Since a top anti-reflective coating formed using the above anti-reflective coating polymer is not soluble in water, it can be applied to immersion lithography using water as the medium for a light source. In addition, since the top anti-reflective coating can reduce the reflectance from an underlayer, the uniformity of CD is improved, thus enabling the formation of an ultrafine pattern.
    • 本文公开了用于光刻工艺的顶部抗反射涂层聚合物,其是半导体器件的制造工艺之一,制备抗反射涂层聚合物的方法,以及抗反射涂层组合物, 反射涂层聚合物。 具体地说,顶部的抗反射涂层聚合物用于浸没式光刻以制造低于50nm的半导体器件。 顶部抗反射涂层聚合物由下式1表示:其中R1,R2和R3独立地是氢或甲基; 和a,b和c表示各单体的摩尔分数,并且在约0.05和约0.9之间的范围内。 由于使用上述抗反射涂层聚合物形成的顶部抗反射涂层不溶于水,因此可以使用水作为光源的介质进行浸渍光刻。 此外,由于顶部抗反射涂层可以降低来自底层的反射率,因此提高了CD的均匀性,从而能够形成超细图案。
    • 17. 发明申请
    • Top anti-reflective coating polymer, its preparation method and top anti-reflective coating composition comprising the same
    • 顶级抗反射涂料聚合物,其制备方法和包含其的顶部抗反射涂料组合物
    • US20060008732A1
    • 2006-01-12
    • US11081151
    • 2005-03-16
    • Jae-chang Jung
    • Jae-chang Jung
    • G03C1/492
    • C08F220/18G03F7/091
    • Disclosed herein are top anti-reflective coating polymers used in a photolithography process, methods for preparing the anti-reflective coating polymer, and anti-reflective coating compositions comprising the disclosed anti-reflective coating polymers. The top anti-reflective coating polymers are used in immersion lithography for the fabrication of a sub-50 nm semiconductor device. The top anti-reflective coating polymer is represented by Formula 1 below: wherein R1, R2 and R3 are independently hydrogen or a methyl group; and a, b and c represent the mole fraction of each monomer, and are independently in the range between about 0.05 and about 0.9. Because the disclosed top anti-reflective coatings are not soluble in water, they can be used in immersion lithography using water as a medium for the light source. In addition, since the top anti-reflective coatings can reduce the reflectance from an underlayer, the uniformity of CD is improved, thus enabling the formation of ultrafine patterns.
    • 本文公开了用于光刻工艺的顶部抗反射涂层聚合物,制备抗反射涂层聚合物的方法和包含所公开的抗反射涂层聚合物的抗反射涂层组合物。 顶级抗反射涂层聚合物用于浸没式光刻以制造低于50nm的半导体器件。 顶部抗反射涂层聚合物由下式1表示:其中R1,R2和R3独立地是氢或甲基; 和a,b和c表示各单体的摩尔分数,并且独立地在约0.05和约0.9之间的范围内。 因为所公开的顶部抗反射涂层不溶于水,所以它们可以用于使用水作为光源的介质的浸渍光刻中。 另外,由于顶部的抗反射涂层可以降低底层的反射率,所以提高了CD的均匀性,从而能够形成超细图案。
    • 20. 发明授权
    • Composition for an organic bottom anti-reflective coating and method for forming pattern using the same
    • 有机底部防反射涂层的组合物和使用其形成图案的方法
    • US07374868B2
    • 2008-05-20
    • US10910063
    • 2004-08-03
    • Jae-chang Jung
    • Jae-chang Jung
    • G03C1/835G03F7/30G03F7/38
    • G03F7/091G03F7/0382Y10S430/11Y10S430/124
    • Disclosed are a composition for an organic bottom anti-reflective coating able to improve the uniformity of a photoresist pattern with respect to an ultra-fine pattern formation process among processes for manufacturing semiconductor device, which prevents scattered reflection from the bottom film layer and eliminating the standing wave effect due to alteration of the thickness of the photoresist film itself resulting in increase of uniformity of the photoresist pattern. The composition for organic bottom anti-reflective coating is able to reduce amount of polyvinylphenol by introducing a specific light absorbent agent having an etching velocity higher than of the polyvinylphenol, thus notably improving the etching velocity for the organic anti-reflective coating by about 1.5 times, so that and the present composition prevents over-etching of the photoresist to make it possible to conduct a smooth etching process for a layer to be etched.
    • 公开了一种用于有机底部抗反射涂层的组合物,其能够在半导体器件的制造工艺之间相对于超细图案形成工艺提高光致抗蚀剂图案的均匀性,其防止来自底部薄膜层的散射反射并消除 由于光致抗蚀剂膜本身的厚度变化引起的驻波效应导致光致抗蚀剂图案的均匀性增加。 有机底部防反射涂层的组合物能够通过引入具有高于聚乙烯基苯酚的蚀刻速度的特定光吸收剂来减少聚乙烯基苯酚的量,从而显着地将有机抗反射涂层的蚀刻速度提高约1.5倍 ,因此和本发明的组合物防止光致抗蚀剂的过度蚀刻,使得可以对待蚀刻的层进行平滑的蚀刻工艺。