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11. 发明申请

US20080150029A1 MEMORY SYSTEM WITH FIN FET TECHNOLOGY 有权
标题翻译：具有FIN FET技术的存储系统
公开(公告)号：US20080150029A1
公开(公告)日：2008-06-26
申请号：US11614815
申请日：2006-12-21
申请人： Wei Zheng , Lei Xue , Kuo-Tung Chang
发明人： Wei Zheng , Lei Xue , Kuo-Tung Chang
IPC分类号： H01L29/78 , H01L21/336
CPC分类号： H01L27/11568 , H01L27/115 , H01L29/66833 , H01L29/7851
摘要： A method for manufacturing a memory system is provided including forming a charge-storage layer on a first insulator layer including insulating the charge-storage layer from a vertical fin, forming a second insulator layer from the charge-storage layer, and forming a gate over the second insulator includes forming a fin field effect transistor.
摘要翻译：提供了一种用于制造存储器系统的方法，包括在第一绝缘体层上形成电荷存储层，该第一绝缘体层包括从垂直鳍状物绝缘电荷存储层，从电荷存储层形成第二绝缘体层，并形成栅极第二绝缘体包括形成鳍状场效应晶体管。

12. 发明申请

US20080150005A1 MEMORY SYSTEM WITH DEPLETION GATE 审中-公开
标题翻译：带有隔离门的记忆系统
公开(公告)号：US20080150005A1
公开(公告)日：2008-06-26
申请号：US11694089
申请日：2007-03-30
申请人： Meng Ding , YouSeok Suh , Wei Zheng , Kuo-Tung Chang
发明人： Meng Ding , YouSeok Suh , Wei Zheng , Kuo-Tung Chang
IPC分类号： H01L29/792
CPC分类号： H01L27/11568 , H01L27/115 , H01L29/66833 , H01L29/792
摘要： A memory system includes a substrate, forming a first insulator layer over the substrate, forming a charge-storage layer over the first insulator layer, forming a second insulator layer over the charge-storage layer, and forming a depletion gate having a depletion phenomenon over the second insulator layer.
摘要翻译：存储器系统包括：衬底，在衬底上形成第一绝缘体层，在第一绝缘体层之上形成电荷存储层，在电荷存储层上形成第二绝缘体层，并形成具有耗尽现象的耗尽栅极第二绝缘体层。

13. 发明申请

US20080142874A1 INTEGRATED CIRCUIT SYSTEM WITH IMPLANT OXIDE 审中-公开
标题翻译：具有氧化铟的集成电路系统
公开(公告)号：US20080142874A1
公开(公告)日：2008-06-19
申请号：US11611860
申请日：2006-12-16
申请人： Shenqing Fang , Rinji Sugino , Jayendra Bhakta , Takashi Orimoto , Hiroyuki Nansei , Yukio Hayakawa , Hidehiko Shiraiwa , Takayuki Maruyama , Kuo-Tung Chang , YouSeok Suh , Amol Ramesh Joshi , Harpreet Sachar , Simon Siu-Sing Chan
发明人： Shenqing Fang , Rinji Sugino , Jayendra Bhakta , Takashi Orimoto , Hiroyuki Nansei , Yukio Hayakawa , Hidehiko Shiraiwa , Takayuki Maruyama , Kuo-Tung Chang , YouSeok Suh , Amol Ramesh Joshi , Harpreet Sachar , Simon Siu-Sing Chan
IPC分类号： H01L29/792 , H01L21/3205
CPC分类号： H01L29/792 , H01L29/66833
摘要： A method for forming an integrated circuit system is provided including forming a substrate; forming a stack over the substrate, the stack having a sidewall and formed from a charge trap layer and a semi-conducting layer; and slot plane antenna oxidizing the stack for forming a protection enclosure having a protection layer along the sidewall.
摘要翻译：提供一种用于形成集成电路系统的方法，包括：形成衬底; 在衬底上形成堆叠，所述堆叠具有侧壁并由电荷陷阱层和半导体层形成; 以及缝隙平面天线，用于氧化该叠层以形成具有沿该侧壁的保护层的保护罩。

14. 发明申请

US20080023751A1 INTEGRATED CIRCUIT MEMORY SYSTEM EMPLOYING SILICON RICH LAYERS 有权
标题翻译：集成电路记忆系统采用硅胶层
公开(公告)号：US20080023751A1
公开(公告)日：2008-01-31
申请号：US11461131
申请日：2006-07-31
申请人： Amol Ramesh Joshi , Harpreet Sachar , YouSeok Suh , Shenqing Fang , Chih-Yuh Yang , Lovejeet Singh , David H. Matsumoto , Hidehiko Shiraiwa , Kuo-Tung Chang , Scott A. Bell , Allison Holbrook , Satoshi Torii
发明人： Amol Ramesh Joshi , Harpreet Sachar , YouSeok Suh , Shenqing Fang , Chih-Yuh Yang , Lovejeet Singh , David H. Matsumoto , Hidehiko Shiraiwa , Kuo-Tung Chang , Scott A. Bell , Allison Holbrook , Satoshi Torii
IPC分类号： H01L29/792
CPC分类号： H01L27/11568 , H01L21/3081 , H01L21/76224 , H01L27/115 , H01L29/66833
摘要： An integrated circuit memory system that includes: providing a substrate; forming a silicon rich charge storage layer over the substrate; forming a first isolation trench through the silicon rich charge storage layer in a first direction; and forming a second isolation trench through the silicon rich charge storage layer in a second direction.
摘要翻译：一种集成电路存储器系统，包括：提供衬底; 在所述衬底上形成富硅电荷存储层; 通过富硅电荷存储层沿第一方向形成第一隔离沟槽; 以及在第二方向上通过富硅电荷存储层形成第二隔离沟槽。

15. 发明授权

US06927129B1 Narrow wide spacer 有权
标题翻译：狭窄的间距
公开(公告)号：US06927129B1
公开(公告)日：2005-08-09
申请号：US10821312
申请日：2004-04-08
申请人： Yu Sun , Kuo-Tung Chang , Angela T. Hui , Shenqing Fang
发明人： Yu Sun , Kuo-Tung Chang , Angela T. Hui , Shenqing Fang
IPC分类号： H01L21/336 , H01L21/8247 , H01L27/105
CPC分类号： H01L29/6656 , H01L27/105 , H01L27/11526 , H01L27/11534
摘要： A method for fabricating a semiconductor device. Specifically, A method of manufacturing a semiconductor device comprising: depositing a first oxide layer over a periphery transistor comprising a gate stack, a drain side sidewall and a source side sidewall and over a core transistor comprising a gate stack, a source side sidewall and a drain side sidewall; etching the first oxide layer wherein a portion of the first oxide layer remains on the source side sidewall and on the drain side sidewall of the periphery transistor and on the source side sidewall and on the drain side sidewall of the core transistor; etching the first oxide layer from the source side sidewall of the core transistor; depositing a second oxide layer over the periphery transistor and the core transistor; and etching the second oxide layer wherein a portion of the second oxide layer remains on the first oxide layer formed on the source side sidewall and on the drain side sidewall of the periphery transistor and wherein the second oxide layer remains on the source side sidewall and on the drain side sidewall of the core transistor.
摘要翻译：一种半导体器件的制造方法。具体地说，一种制造半导体器件的方法，包括：在包括栅极堆叠，漏极侧壁和源极侧壁的外围晶体管上沉积第一氧化物层，以及包括栅极堆叠，源极侧壁和排水侧壁蚀刻第一氧化物层，其中第一氧化物层的一部分保留在外围晶体管的源极侧壁和漏极侧壁上，并且在芯晶体管的源极侧壁和漏极侧侧壁上残留; 从芯晶体管的源极侧壁蚀刻第一氧化物层; 在外围晶体管和芯晶体管上沉积第二氧化物层; 以及蚀刻所述第二氧化物层，其中所述第二氧化物层的一部分保留在形成在所述外围晶体管的源极侧壁和漏极侧壁上的第一氧化物层上，并且其中所述第二氧化物层保留在所述源侧侧壁上，芯晶体管的漏极侧壁。

16. 发明授权

US06613657B1 BPSG, SA-CVD liner/P-HDP gap fill 有权
标题翻译： BPSG，SA-CVD衬垫/ P-HDP间隙填充
公开(公告)号：US06613657B1
公开(公告)日：2003-09-02
申请号：US10231133
申请日：2002-08-30
申请人： Minh Van Ngo , Dawn Hopper , Wenmei Li , Kelwin King Wai Ko , Kuo-Tung Chang , Tyagamohan Gottipati
发明人： Minh Van Ngo , Dawn Hopper , Wenmei Li , Kelwin King Wai Ko , Kuo-Tung Chang , Tyagamohan Gottipati
IPC分类号： H01L218247
CPC分类号： H01L27/11521 , H01L27/115
摘要： Device leakage due to spacer undercutting is remedied by depositing a BPSG, SA-CVD oxide liner and flowing it into the undercut regions, followed by gap filling with a P-doped HDP oxide layer. Embodiments include depositing a BPSG, SA-CVD oxide liner containing 4 to 6 wt.% boron, at a thickness of 1,000 Å to 1,800 Å, over closely spaced apart non-volatile transistors and heating during or subsequent to deposition to flow the BPSG, SA-CVD oxide liner into the undercut regions of the sidewall spacers of the gate stacks. Gap filling is then completed by depositing the layer of P-doped HDP at a thickness of 6,000 Å to 10,000 Å.
摘要翻译：通过沉积BPSG，SA-CVD氧化物衬垫并将其流入底切区域，随后用P掺杂的HDP氧化物层填充间隙来补救由间隔物底切造成的器件泄漏。实施方案包括在紧密间隔开的非易失性晶体管上沉积厚度为1,000至1,800的含有4至6重量％硼的BPSG，SA-CVD氧化物衬垫，并在沉积期间或之后加热以使BPSG流动， SA-CVD氧化物衬垫进入栅堆叠的侧壁间隔物的底切区域。然后通过沉积厚度为6,000至10,000的P掺杂HDP层完成间隙填充。

17. 发明授权

US5824584A Method of making and accessing split gate memory device 失效
标题翻译：制造和访问分闸门存储器件的方法
公开(公告)号：US5824584A
公开(公告)日：1998-10-20
申请号：US876326
申请日：1997-06-16
申请人： Wei-Ming Chen , Lee Z. Wang , Kuo-Tung Chang , Craig Swift
发明人： Wei-Ming Chen , Lee Z. Wang , Kuo-Tung Chang , Craig Swift
IPC分类号： H01L21/8239 , H01L27/105 , H01L21/336
CPC分类号： H01L27/105 , H01L27/1052 , Y10S438/933
摘要： A non-volatile memory having a control gate (14) and a sidewall select gate (28) is illustrated. The sidewall select gate (28) is formed in conjunction with a semiconductor doped oxide (20) to form a non-volatile memory cell (7). The semiconductor element used to dope the oxide layer (20) will generally include silicon or germanium. The non-volatile memory cell (7) is programmed by storing electrons in the doped oxide (20), and is erased using band-to-band tunneling.
摘要翻译：示出了具有控制栅极（14）和侧壁选择栅极（28）的非易失性存储器。侧壁选择栅极（28）与半导体掺杂氧化物（20）结合形成以形成非易失性存储单元（7）。用于掺杂氧化物层（20）的半导体元件通常将包括硅或锗。通过在掺杂氧化物（20）中存储电子来对非易失性存储单元（7）进行编程，并且使用带 - 带隧道进行擦除。

18. 发明授权

US5706228A Method for operating a memory array 失效
标题翻译：操作存储器阵列的方法
公开(公告)号：US5706228A
公开(公告)日：1998-01-06
申请号：US603939
申请日：1996-02-20
申请人： Kuo-Tung Chang , Craig A. Cavins , Ko-Min Chang , Bruce L. Morton , George L. Espinor
发明人： Kuo-Tung Chang , Craig A. Cavins , Ko-Min Chang , Bruce L. Morton , George L. Espinor
IPC分类号： G11C16/04 , G11C16/10 , G11C11/40
CPC分类号： G11C16/3427 , G11C16/0433 , G11C16/10
摘要： A memory array (25) having a selected memory cell (10) and an unselected memory cell (30) is programmed and read. Each memory cell in the memory array (25) contains an isolation transistor (22) and a floating gate transistor (23). To program the selected memory cell (10), programming voltages are applied to a control gate line (21), a drain line (14), an isolation line (19), and a source line (12). To reduce the effects of the drain disturb problem, a gate terminal (32) of the unselected memory cell (30) is held at a positive voltage. To read selected memory cell (10), a read voltage is applied to an isolation gate line (31) of unselected memory cell (30) which insures that the unselected memory cell (30) does not conduct or contribute to leakage current and power consumption during the read operation.
摘要翻译：具有选定的存储单元（10）和未选择的存储单元（30）的存储器阵列（25）被编程和读取。存储器阵列（25）中的每个存储单元包含隔离晶体管（22）和浮动栅极晶体管（23）。为了对所选择的存储单元（10）进行编程，将编程电压施加到控制栅极线（21），漏极线（14），隔离线（19）和源极线（12）。为了减小漏极干扰问题的影响，未选择的存储单元（30）的栅极端子（32）被保持在正电压。为了读取所选择的存储单元（10），读取电压被施加到未选择存储单元（30）的隔离栅极线（31），其确保未选择的存储单元（30）不导通或有助于漏电流和功耗在读操作期间。

19. 发明授权

US08183623B2 Dual charge storage node memory device and methods for fabricating such device 有权
标题翻译：双电荷存储节点存储器件及其制造方法
公开(公告)号：US08183623B2
公开(公告)日：2012-05-22
申请号：US13075047
申请日：2011-03-29
申请人： Chungho Lee , Hiroyuki Kinoshita , Kuo-Tung Chang , Amol Joshi , Kyunghoon Min , Chi Chang
发明人： Chungho Lee , Hiroyuki Kinoshita , Kuo-Tung Chang , Amol Joshi , Kyunghoon Min , Chi Chang
IPC分类号： H01L29/792 , H01L29/76 , H01L29/94 , H01L31/062 , H01L31/113 , H01L31/119
CPC分类号： H01L21/28273 , H01L21/28282 , H01L27/11521 , H01L27/11568 , H01L29/42332 , H01L29/42348 , H01L29/66825 , H01L29/66833 , H01L29/7883 , H01L29/792 , Y10S438/954
摘要： A dual node memory device and methods for fabricating the device are provided. In one embodiment the method comprises forming a layered structure with an insulator layer, a charge storage layer, a buffer layer, and a sacrificial layer on a semiconductor substrate. The layers are patterned to form two spaced apart stacks and an exposed substrate portion between the stacks. A gate insulator and a gate electrode are formed on the exposed substrate, and the sacrificial layer and buffer layer are removed. An additional insulator layer is deposited overlying the charge storage layer to form insulator-storage layer-insulator memory storage areas on each side of the gate electrode. Sidewall spacers are formed at the sidewalls of the gate electrode overlying the storage areas. Bit lines are formed in the substrate spaced apart from the gate electrode, and a word line is formed that contacts the gate electrode and the sidewall spacers.
摘要翻译：提供了一种双节点存储器件及其制造方法。在一个实施例中，该方法包括在半导体衬底上形成具有绝缘体层，电荷存储层，缓冲层和牺牲层的分层结构。这些层被图案化以形成两个间隔开的堆叠和在堆叠之间的暴露的衬底部分。在暴露的基板上形成栅极绝缘体和栅电极，去除牺牲层和缓冲层。沉积覆盖电荷存储层的另外的绝缘体层，以在栅电极的每一侧上形成绝缘体存储层 - 绝缘体存储器存储区域。侧壁间隔件形成在覆盖存储区域的栅电极的侧壁上。在与栅极间隔开的衬底中形成位线，并且形成与栅电极和侧壁间隔物接触的字线。

20. 发明授权

US08076712B2 Semiconductor memory comprising dual charge storage nodes and methods for its fabrication 有权
标题翻译：半导体存储器包括双电荷存储节点及其制造方法
公开(公告)号：US08076712B2
公开(公告)日：2011-12-13
申请号：US12840165
申请日：2010-07-20
申请人： Chungho Lee , Ashot Melik-Martirosian , Wei Zheng , Timothy Thurgate , Chi Chang , Hiroyuki Kinoshita , Kuo-Tung Chang , Unsoon Kim
发明人： Chungho Lee , Ashot Melik-Martirosian , Wei Zheng , Timothy Thurgate , Chi Chang , Hiroyuki Kinoshita , Kuo-Tung Chang , Unsoon Kim
IPC分类号： H01L29/788
CPC分类号： H01L29/42332 , H01L27/115 , H01L27/11521 , H01L27/11568 , H01L29/42348 , H01L29/7887 , H01L29/7923
摘要： A dual charge storage node memory device and methods for its fabrication are provided. In one embodiment a dielectric plug is formed comprising a first portion recessed into a semiconductor substrate and a second portion extending above the substrate. A layer of semiconductor material is formed overlying the second portion. A first layered structure is formed overlying a first side of the second portion of the dielectric plug, and a second layered structure is formed overlying a second side, each of the layered structures overlying the layer of semiconductor material and comprising a charge storage layer between first and second dielectric layers. Ions are implanted into the substrate to form a first bit line and second bit line, and a layer of conductive material is deposited and patterned to form a control gate overlying the dielectric plug and the first and second layered structures.
摘要翻译：提供了双电荷存储节点存储器件及其制造方法。在一个实施例中，形成包括凹入半导体衬底的第一部分和在衬底上延伸的第二部分的电介质插塞。在第二部分上形成一层半导体材料。第一层状结构形成在电介质塞的第二部分的第一侧上，并且第二层结构形成在第二侧上，每个层叠结构覆盖在半导体材料层上，并且包括第一和第二层之间的电荷存储层和第二电介质层。将离子注入到衬底中以形成第一位线和第二位线，并且沉积和图案化导电材料层以形成覆盖在电介质插塞和第一和第二分层结构上的控制栅极。

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