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11. 发明授权

US06822315B2 Apparatus and method for scribing semiconductor wafers using vision recognition 有权
标题翻译：使用视觉识别刻划半导体晶片的装置和方法
公开(公告)号：US06822315B2
公开(公告)日：2004-11-23
申请号：US10076818
申请日：2002-02-14
申请人： Nikhil V. Kelkar , Luu T. Nguyen
发明人： Nikhil V. Kelkar , Luu T. Nguyen
IPC分类号： H01L23544
CPC分类号： H01L21/3043 , H01L21/67092 , H01L21/681
摘要： An apparatus and method for scribing a semiconductor wafer coated with a substantially opaque material using vision recognition is disclosed. The apparatus includes a stage configured to hold a wafer, an imaging unit configured to generate an image of the wafer, and a computer configured to identify the coordinates of the scribe lines on the wafer from the image. During operation, the wafer is imaged using the imaging unit. The computer then identifies the coordinates of the scribe lines on the wafer from the image. Thereafter the coordinates are provided to a dicing machine which performs the dicing of the wafer. Accuracy is therefore improved since the dicing machine relies on the coordinates of the scribe lines as opposed to attempting to recognize the scribe lines through the opaque material. According to various embodiments of the invention, the imaging unit may use infrared, X-ray or ultrasound waves to generate the image of the wafer.
摘要翻译：公开了一种用于使用视觉识别来划刻涂有基本不透明材料的半导体晶片的装置和方法。该装置包括配置成保持晶片的台，被配置为产生晶片的图像的成像单元和被配置为从图像识别晶片上的划线的坐标的计算机。在操作期间，使用成像单元对晶片进行成像。然后，计算机从图像中识别晶片上划线的坐标。此后，将坐标提供给执行晶片切割的切割机。因此，由于切割机依赖于划痕线的坐标，而是试图通过不透明材料识别划线，因此精度得到改善。根据本发明的各种实施例，成像单元可以使用红外，X射线或超声波来产生晶片的图像。

12. 发明授权

US5130781A Dam for lead encapsulation 失效
标题翻译：大坝铅封装
公开(公告)号：US5130781A
公开(公告)日：1992-07-14
申请号：US593374
申请日：1990-10-01
申请人： Caroline A. Kovac , Peter G. Ledermann , Luu T. Nguyen
发明人： Caroline A. Kovac , Peter G. Ledermann , Luu T. Nguyen
IPC分类号： H01L21/56
CPC分类号： H01L21/56 , H01L2224/50
摘要： A method and apparatus to encapsulate a device and joints coupled to conductive leads with an encapsulating material. A fixture has a recess to hold via a vacuum the device in place. Conduits in the fixture supply air around the device to form an air dam that flows outward around the device and the leads. A nozzle supplies a metered amount of material to the surface of the device. By controlling the temperature of the fixture and/or the air forming the air dam, the flow of material can be confined to the surface of the device and the joints as it cures. The method can also provide encapsulant edge capping to reduce device stresses.
摘要翻译：一种用封装材料封装耦合到导电引线的器件和接头的方法和装置。固定装置具有通过真空将装置保持在适当位置的凹部。设备中的管道供应设备周围的空气，以形成围绕设备和引线向外流动的空气坝。喷嘴向设备的表面提供计量的材料。通过控制固定装置的温度和/或形成空气坝的空气，材料的流动可以在其固化时被限制在装置和接头的表面上。该方法还可以提供封装边缘封盖以减少器件应力。

13. 发明授权

US5049201A Method of inhibiting corrosion in an electronic package 失效
标题翻译：抑制电子封装中的腐蚀的方法
公开(公告)号：US5049201A
公开(公告)日：1991-09-17
申请号：US370355
申请日：1989-06-22
申请人： Shirley Cheng , Constance J. Araps , Allen J. Arnold , Jeffrey T. Coffin , Luu T. Nguyen
发明人： Shirley Cheng , Constance J. Araps , Allen J. Arnold , Jeffrey T. Coffin , Luu T. Nguyen
IPC分类号： C11D7/50 , C23F11/12 , C23F11/14 , C23F15/00 , H01L21/304 , H01L21/306 , H05K3/26
CPC分类号： H01L21/02052 , C23F11/12 , C23F11/14 , C23F15/00
摘要： Disclosed is a method of inhibiting corrosion on an electronic component. The method includes the steps of obtaining an electronic component and then cleaning the electronic component in a solution consisting of a complexing agent and a solvent in which the complexing agent is soluble. The complexing agent is a crown compound.

14. 发明申请

US20120032354A1 WIREBONDING METHOD AND DEVICE ENABLING HIGH-SPEED REVERSE WEDGE BONDING OF WIRE BONDS 审中-公开
标题翻译：绕线方法和装置启用高速反向楔形线束接线
公开(公告)号：US20120032354A1
公开(公告)日：2012-02-09
申请号：US13172622
申请日：2011-06-29
申请人： Ken Pham , Luu T. Nguyen
发明人： Ken Pham , Luu T. Nguyen
IPC分类号： H01L23/49 , B23K20/10 , B23K31/02
CPC分类号： H01L24/78 , B23K20/007 , B23K2101/40 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48095 , H01L2224/48247 , H01L2224/48624 , H01L2224/48724 , H01L2224/48824 , H01L2224/49171 , H01L2224/49175 , H01L2224/78301 , H01L2224/78302 , H01L2224/78621 , H01L2224/78631 , H01L2224/8218 , H01L2224/85099 , H01L2224/85186 , H01L2224/85205 , H01L2224/85207 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/20751 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00014 , H01L2924/20752 , H01L2924/00 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075
摘要： Methods and systems are described for enabling the efficient fabrication of wedge bonding of integrated circuit systems and electronic systems. In particular a reverse bonding approach can be employed.
摘要翻译：描述了用于实现集成电路系统和电子系统的楔形结合的有效制造的方法和系统。特别地，可以采用反向粘合方法。

15. 发明授权

US07808089B2 Leadframe having die attach pad with delamination and crack-arresting features 有权
标题翻译：引线框架具有带有分层和断裂特征的管芯附着垫
公开(公告)号：US07808089B2
公开(公告)日：2010-10-05
申请号：US11959412
申请日：2007-12-18
申请人： Luu T. Nguyen , Vijaylaxmi Gumaste
发明人： Luu T. Nguyen , Vijaylaxmi Gumaste
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/3107 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/97 , H01L2224/27013 , H01L2224/32014 , H01L2224/32057 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/83051 , H01L2224/83136 , H01L2224/83385 , H01L2224/8385 , H01L2224/85385 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： One aspect of the invention pertains to a semiconductor package having a die and a die attach pad with a plurality of spaced apart pedestals supported by a web. A die is mounted on the die attach pad such that the die is supported by at least a plurality of the pedestals. Selected edge regions of the die are arranged to overlie recessed regions of the die attach pad between adjacent pedestals. The die is electrically connected to at least some of the contact leads. An adhesive is arranged to secure the die to the die attach pad, with the thickness of the adhesive between the web of the die attach pad and the die being greater than the thickness of the adhesive between the die and the top surfaces of the pedestals that support the die. The die attach pad may have rounded peripheral corners between adjacent edge surfaces of the die attach pad. In another aspect of the invention, a method of packaging integrated circuits is described, wherein the resulting packages include at least some of the aforementioned leadframe structures.
摘要翻译：本发明的一个方面涉及具有管芯和管芯附接垫的半导体封装，其具有由幅材支撑的多个间隔开的基座。模具安装在管芯附接垫上，使得管芯由至少多个基座支撑。芯片的选定边缘区域被布置成覆盖在相邻基座之间的管芯附接焊盘的凹陷区域。模具电连接到至少一些接触引线。粘合剂被布置成将管芯固定到管芯附接垫上，其中管芯附接垫和管芯之间的粘合剂的厚度大于管芯和基座顶表面之间的粘合剂的厚度，支持死亡管芯附接垫可以在管芯附接垫的相邻边缘表面之间具有圆形的周边拐角。在本发明的另一方面，描述了封装集成电路的方法，其中所得到的封装包括至少一些上述引线框结构。

16. 发明授权

US06830382B1 Miniature form-factor connecter for fiber optic modules 有权
标题翻译：用于光纤模块的微型外形连接器
公开(公告)号：US06830382B1
公开(公告)日：2004-12-14
申请号：US10194586
申请日：2002-07-12
申请人： Peter Deane , Luu T. Nguyen , William P. Mazotti , Bruce C. Roberts , Christopher J. Smith , Janet E. Townsend , John P. Briant , Michael R. Nelson , Stephen Jacob
发明人： Peter Deane , Luu T. Nguyen , William P. Mazotti , Bruce C. Roberts , Christopher J. Smith , Janet E. Townsend , John P. Briant , Michael R. Nelson , Stephen Jacob
IPC分类号： G02B626
CPC分类号： G02B6/4292 , G02B6/3881 , G02B6/4249
摘要： An embodiment includes a connector element that comprises a connector body and a fiber optic ferrule slidably positioned inside the connector body. The ferrule holds at least one optical fiber. The connector element carries an optical sub-assembly including a photonic device and a spacer and includes a connector sleeve for receiving the connector element. The sleeve includes a ridge that operates as a first stop for the connector body and includes an alignment projection that coarsely aligns the fiber optic ferrule. The ferrule includes a pair of openings configured to receive a pair of alignment pins to provide fine alignment of optical fibers with corresponding photonic devices. The connector element is engaged with the connector sleeve to position the ferrule with respect to the optical sub-assembly such that the optical fiber is correctly positioned relative to a corresponding photonic device. Also, the invention teaches a method of using the described apparatus to position optical fibers relative to corresponding photonic devices of an optical sub-assembly.
摘要翻译：一个实施例包括连接器元件，其包括连接器主体和可滑动地定位在连接器主体内部的光纤套圈。套管保持至少一根光纤。连接器元件携带包括光子器件和间隔物的光学子组件，并且包括用于接收连接器元件的连接器套筒。套筒包括作为连接器主体的第一止动件的脊，并且包括使光纤套圈粗略对准的对准突起。套圈包括一对开口，其构造成接收一对对准销以提供光纤与对应的光子器件的精细对准。连接器元件与连接器套筒接合以相对于光学子组件定位套圈，使得光纤相对于相应的光子器件被正确定位。而且，本发明还教导了使用所描述的设备相对于光学子组件的相应光子器件定位光纤的方法。

17. 发明授权

US5328079A Method of and arrangement for bond wire connecting together certain integrated circuit components 失效
标题翻译：用于将某些集成电路部件连接在一起的接合线的方法和布置
公开(公告)号：US5328079A
公开(公告)日：1994-07-12
申请号：US34683
申请日：1993-03-19
申请人： Ranjan J. Mathew , Arnold Smith , Luu T. Nguyen
发明人： Ranjan J. Mathew , Arnold Smith , Luu T. Nguyen
IPC分类号： H01L21/607 , H01R43/02 , H01L21/60
CPC分类号： H01L24/85 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/4945 , H01L2224/78301 , H01L2224/85051 , H01L2224/85181 , H01L2224/85186 , H01L2224/85191 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85986 , H01L24/78 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/14
摘要： Certain components of an integrated circuit package are disclosed herein including one or more dies, each of which has an array of die output/input bond pads, and die support means, for example a substrate or leadframe, which includes an array of electrically conductive leads. There is also disclosed herein a technique for wire bond connecting the bond pads of a particular die to either the bond pads of a second die or to the electrically conductive leads of the substrate or leadframe using a thermosonic or thermocompression ball bonding tool. In accordance with this technique, where at least one die is involved, connections are made to the bond pads of that die by means of stitch bonding in a way which does not damage the die.
摘要翻译：本文公开了集成电路封装的某些部件，其包括一个或多个管芯，每个管芯具有管芯输出/输入接合焊盘的阵列，以及管芯支撑装置，例如衬底或引线框架，其包括导电引线阵列。本文还公开了一种用于使用热超声或热压球接合工具将特定管芯的接合焊盘连接到第二管芯的接合焊盘或基板或引线框架的导电引线之间的引线接合的技术。根据这种技术，在涉及至少一个管芯的情况下，通过以不损坏管芯的方式通过针脚接合而对该管芯的接合焊盘进行连接。

18. 发明授权

US5296743A Plastic encapsulated integrated circuit package and method of manufacturing the same 失效
标题翻译：塑料封装集成电路封装及其制造方法
公开(公告)号：US5296743A
公开(公告)日：1994-03-22
申请号：US058424
申请日：1993-05-07
申请人： Luu T. Nguyen , Hem P. Takiar
发明人： Luu T. Nguyen , Hem P. Takiar
IPC分类号： H01L23/50 , H01L21/56 , H01L23/495 , H01L29/48 , H01L29/44 , H01L29/52 , H01L29/60
CPC分类号： H01L23/49541 , H01L21/565 , H01L24/49 , H01L2224/05554 , H01L2224/48 , H01L2224/49171 , H01L2224/49175 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01076 , H01L2924/01082 , H01L2924/14 , Y10T29/49121
摘要： A method of making an integrated circuit package is disclosed herein along with the package itself, which package is encapsulated by plastic that is caused to flow in a given direction during the package's formation. The package itself includes an IC chip having an array of chip output/input terminals, and means for supporting the chip including an array of electrically conductive leads, all of which are provided for connection with the output/input terminals of the IC chip. In addition, the overall package includes bonding wires connecting the chip output/input terminals with respective ones of the leads such that each bonding wire extends in a direction that defines an acute angle of less than 45 degrees with the given flow direction of the plastic material used to encapsulate the IC chip, support means and bonding wires. In a preferred embodiment, at least a portion and most preferably substantially all of the bonding wires are substantially parallel with the given flow direction of the plastic material.
摘要翻译：本文公开了制造集成电路封装的方法以及封装本身，该封装本身由塑料封装，在封装的形成过程中，封装件被塑料封装，使其沿给定的方向流动。封装本身包括具有芯片输出/输入端子阵列的IC芯片，以及用于支撑芯片的装置，该芯片包括导电引线阵列，所有导电引线都设置用于与IC芯片的输出/输入端子连接。此外，整体封装包括将芯片输出/输入端子与相应的引线相连接的接合线，使得每个接合线沿塑料材料的给定流动方向沿着限定小于45度的锐角的方向延伸用于封装IC芯片，支撑装置和接合线。在优选实施例中，至少一部分，最优选基本上所有的接合线基本上与塑料材料的给定流动方向平行。

19. 发明授权

US07728399B2 Molded optical package with fiber coupling feature 有权
标题翻译：具有光纤耦合功能的模制光学封装
公开(公告)号：US07728399B2
公开(公告)日：2010-06-01
申请号：US12177677
申请日：2008-07-22
申请人： Randall L. Walberg , Luu T. Nguyen , Robert Dahlgren , James B. Wieser , Kenneth Pedrotti , Jacob A. Wysocki
发明人： Randall L. Walberg , Luu T. Nguyen , Robert Dahlgren , James B. Wieser , Kenneth Pedrotti , Jacob A. Wysocki
IPC分类号： H01L31/0203 , H01L31/0232 , H01L29/22 , H01L29/227 , H01L33/00 , H01L29/24 , H01L29/417 , H01L29/74 , H01L31/111
CPC分类号： G02B6/423 , G02B6/4206 , G02B6/4239 , G02B6/4249 , H01L24/97 , H01L31/0203 , H01L2224/48227 , H01L2224/8592 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： Apparatuses and methods directed to an integrated circuit package having an optical component are disclosed. The package may include an integrated circuit die having at least one light sensitive region disposed on a first surface thereof. By way of example, the die may be a laser diode that emits light through the light sensitive region, or a photodetector that receives and detects light through the light sensitive region. An optical concentrator may be positioned adjacent the first surface of the first die. The optical concentrator includes a lens portion positioned adjacent the light sensitive region and adapted to focus light.
摘要翻译：公开了涉及具有光学部件的集成电路封装的装置和方法。封装可以包括具有设置在其第一表面上的至少一个光敏区域的集成电路管芯。作为示例，芯片可以是通过光敏区域发射光的激光二极管，或者通过光敏区域接收和检测光的光电检测器。光集中器可以位于第一管芯的第一表面附近。光聚焦器包括位于光敏区域附近并适于聚焦光的透镜部分。

20. 发明授权

US07253078B1 Method and apparatus for forming an underfill adhesive layer 有权
标题翻译：用于形成底部填充粘合剂层的方法和装置
公开(公告)号：US07253078B1
公开(公告)日：2007-08-07
申请号：US10224291
申请日：2002-08-19
申请人： Luu T. Nguyen , Hau T. Nguyen , Viraj A. Patwardhan , Nikhil Kelkar , Shahram Mostafazadeh
发明人： Luu T. Nguyen , Hau T. Nguyen , Viraj A. Patwardhan , Nikhil Kelkar , Shahram Mostafazadeh
IPC分类号： H01L21/44
CPC分类号： H01L24/29 , H01L21/563 , H01L24/11 , H01L24/27 , H01L24/73 , H01L24/92 , H01L29/0657 , H01L2224/0401 , H01L2224/05557 , H01L2224/05568 , H01L2224/1131 , H01L2224/1141 , H01L2224/1147 , H01L2224/1148 , H01L2224/11849 , H01L2224/13007 , H01L2224/13023 , H01L2224/131 , H01L2224/16238 , H01L2224/2732 , H01L2224/274 , H01L2224/2747 , H01L2224/27515 , H01L2224/27849 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29388 , H01L2224/73104 , H01L2224/73204 , H01L2224/81815 , H01L2224/83191 , H01L2224/83856 , H01L2224/9211 , H01L2224/94 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/10155 , H01L2924/10157 , H01L2924/10329 , H01L2924/14 , H01L2924/351 , H01L2924/00 , H01L2924/01031 , H01L2924/3512 , H01L2224/05552 , H01L2224/27 , H01L2224/11
摘要： An apparatus and method for forming a layer of underfill adhesive on an integrated circuit in wafer form is described. In one embodiment, the layer of underfill adhesive is disposed and partially cured on the active surface of the wafer. Once the underfill adhesive has partially cured, the wafer is singulated. The individual integrated circuits or die are then mounted onto a substrate such as a printed circuit board. When the solder balls of the integrated circuit are reflowed to form joints with corresponding contact pads on the substrate, the underfill adhesive reflows and is completely cured. In an alternative embodiment, the underfill adhesive is fully cured after it is disposed onto the active surface of the wafer.
摘要翻译：描述了一种在晶片形式的集成电路上形成底层填料层的装置和方法。在一个实施例中，底层填充粘合剂层被设置并部分地固化在晶片的活性表面上。一旦底部填充粘合剂已部分固化，则晶片被切割。然后将各个集成电路或管芯安装到诸如印刷电路板的基板上。当集成电路的焊球回流以形成与基板上的相应接触焊盘的接头时，底部填充粘合剂回流并完全固化。在替代实施例中，底部填充粘合剂在其被设置在晶片的有效表面之后被完全固化。

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