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1. 发明授权

US5049201A Method of inhibiting corrosion in an electronic package 失效
标题翻译：抑制电子封装中的腐蚀的方法
公开(公告)号：US5049201A
公开(公告)日：1991-09-17
申请号：US370355
申请日：1989-06-22
申请人： Shirley Cheng , Constance J. Araps , Allen J. Arnold , Jeffrey T. Coffin , Luu T. Nguyen
发明人： Shirley Cheng , Constance J. Araps , Allen J. Arnold , Jeffrey T. Coffin , Luu T. Nguyen
IPC分类号： C11D7/50 , C23F11/12 , C23F11/14 , C23F15/00 , H01L21/304 , H01L21/306 , H05K3/26
CPC分类号： H01L21/02052 , C23F11/12 , C23F11/14 , C23F15/00
摘要： Disclosed is a method of inhibiting corrosion on an electronic component. The method includes the steps of obtaining an electronic component and then cleaning the electronic component in a solution consisting of a complexing agent and a solvent in which the complexing agent is soluble. The complexing agent is a crown compound.

2. 发明授权

US4823869A Heat sink 失效
标题翻译：散热器
公开(公告)号：US4823869A
公开(公告)日：1989-04-25
申请号：US166740
申请日：1988-03-02
申请人： Allen J. Arnold , Kerry L. Sutton
发明人： Allen J. Arnold , Kerry L. Sutton
IPC分类号： H01L23/367 , F28F7/00
CPC分类号： H01L23/3677 , H01L2924/0002
摘要： An improved heat sink is disclosed in which a plurality of heat conducting fins extends form a base of heat conductive material. The top surface of the base is peaked to reduce the dead space that would otherwise occur during vertical impingement air flow. In the preferred embodiment, the top surface is pyramidal in shape with the peak at the center. In other embodiments, the top surface can be convex or concave and have the peak located off center. Also, webs of material can be left at the bottom of the cooling fins to provide channels for improved air flow.
摘要翻译：公开了一种改进的散热器，其中多个导热翅片从导热材料的底部延伸。底座的顶部表面达到峰值，以减少在垂直冲击气流期间会发生的死空间。在优选实施例中，顶表面是金字塔形，中心具有峰。在其他实施例中，顶表面可以是凸的或凹的，并且具有偏离中心的峰。此外，材料网可以留在冷却翅片的底部以提供用于改善空气流动的通道。

3. 发明授权

US4831494A Multilayer capacitor 失效
标题翻译：多层电容器
公开(公告)号：US4831494A
公开(公告)日：1989-05-16
申请号：US212361
申请日：1988-06-27
申请人： Allen J. Arnold , Michael E. Bariether , Shin-Wu Chiang , Hormazdyar M. Dalal , Robert A. Miller , Frank A. Montegari , James M. Oberschmidt , David T. Shen
发明人： Allen J. Arnold , Michael E. Bariether , Shin-Wu Chiang , Hormazdyar M. Dalal , Robert A. Miller , Frank A. Montegari , James M. Oberschmidt , David T. Shen
IPC分类号： H01G4/12 , H01G4/30
CPC分类号： H01G4/30
摘要： Disclosed is a multilayer capacitor consisting of a plurality of laminae with each of the laminae including a conductive plate portion and a non-conductive sheet portion. The conductive plate portion has at least one tab projecting to at least one edge of the conductive plate portion with the maximum number of tabs per conductive plate portion being limited to avoid excessive lateral congestion. The laminae are divided into different groups with the laminae from each group having the same number and location of tabs and with the laminae from different groups differing by at least the location of the tabs. The laminae are interleaved so that:(a) a lamina from one group alternates with a lamina from a different group,(b) the conductive plate portion of each lamina is in contact with the non-conductive sheet portion of each adjacent lamina,(c) the tabs are at a common edge of each lamina so that the tabs of the interleaved laminae form rows of tabs, and(d) the tabs from adjacent laminae are not in registry with each other.The capacitor finally includes islands of metallurgy joining selected groups of tabs in each row such that each of the islands covers a portion of each row of tabs.

4. 发明授权

US4715430A Environmentally secure and thermally efficient heat sink assembly 失效
标题翻译：环保和热效率的散热器组件
公开(公告)号：US4715430A
公开(公告)日：1987-12-29
申请号：US923456
申请日：1986-10-27
申请人： Allen J. Arnold , Mark G. Courtney , Diane N. Kirby , Katherine H. Mis , Kerry L. Sutton
发明人： Allen J. Arnold , Mark G. Courtney , Diane N. Kirby , Katherine H. Mis , Kerry L. Sutton
IPC分类号： H01L23/36 , H01L23/367 , H01L23/40
CPC分类号： H01L23/3675 , H01L2924/0002
摘要： A heat sink is disclosed for cooling a module having a plurality of chip sites thereon. The heat sink includes a frame member which is made of a material having a coefficient of thermal expansion which is substantially that of the substrate to which it is bonded. The frame has a plurality of fins disposed around the perimeter and a support surface disposed inside the perimeter fins. An insert member made of a high thermal conductivity material rests on the support surface. The insert member has a plurality of fins disposed on one side thereof and a plurality of projections on the other side. Forced air flowing around the fins provides a mechanism for rapidly removing heat therefrom. Each of the projections is disposed above a chip site and extends almost into contact with the upper surface of a chip mounted on the module substrate. A thermal paste is used to transfer heat directly from the chip to the insert member hence a mechanism is provided for rapidly removing heat developed in each chip of the module. The insert member is bonded to the frame member with an appropriate environmentally secure bond to assure that the atmosphere within the module remains the same over the planned life of the product. The spacing between the projections advantageously provides a path for engineering wiring and component changes to be added to the module should such changes become necessary.
摘要翻译：公开了一种用于冷却其上具有多个芯片位置的模块的散热器。散热器包括框架构件，其由具有基本上与其结合的基板的热膨胀系数的材料制成。框架具有围绕周边设置的多个翅片和设置在周边翅片内部的支撑表面。由高导热性材料制成的插入件搁置在支撑表面上。插入构件具有设置在其一侧上的多个翅片和另一侧上的多个突起。围绕翅片流动的强制空气提供了一种快速从其中除去热量的机构。每个突起设置在芯片位置上方并且几乎与安装在模块基板上的芯片的上表面几乎接触。使用热膏将热量直接从芯片传递到插入部件，因此提供了用于快速去除在模块的每个芯片中产生的热量的机构。插入构件通过适当的环境牢固的结合结合到框架构件，以确保模块内的气氛在产品的计划寿命内保持相同。突起之间的间距有利地提供了一种用于工程布线和组件变化的路径，以便在需要这种变化时将其添加到模块中。

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