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11. 发明授权

US09069014B2 Wire probe assembly and forming process for die testing 有权
标题翻译：线探头组装和成型工艺用于模具测试
公开(公告)号：US09069014B2
公开(公告)日：2015-06-30
申请号：US13539391
申请日：2012-06-30
申请人： Todd P. Albertson , Michael T. Crocker , David Shia , Lothar R. Kress
发明人： Todd P. Albertson , Michael T. Crocker , David Shia , Lothar R. Kress
IPC分类号： G01R31/00 , G01R1/073 , G01R3/00 , G01R31/28 , G01R1/00 , H01L21/00
CPC分类号： G01R1/07378 , G01R1/00 , G01R1/07357 , G01R3/00 , G01R31/2889 , H01L21/00 , Y10T29/4913 , Y10T29/49144
摘要： A wire probe assembly and forming process is described. In one example, a method includes inserting a plurality of wires through a probe former and a tip retainer to contact a probe head substrate, attaching the wires to a surface of the substrate, pulling the probe former laterally with respect to the substrate surface and the tip retainer to bend the wires into test probes with a resiliency to transverse movement, and removing the tip retainer to form a test probe head.
摘要翻译：描述了线探头组件和成形过程。在一个示例中，一种方法包括：将多条电线插入穿过探针成形器和尖端保持器以接触探头头基片，将电线连接到基片的表面，相对于基片表面侧向拉动探头，尖端保持器将电线弯曲成具有弹性到横向运动的测试探针，并且移除尖端保持器以形成测试头。

12. 发明申请

US20150061713A1 ANTI-ROTATION FOR WIRE PROBES IN A PROBE HEAD OF A DIE TESTER 有权
标题翻译：电子测试仪探头中的线探头的反转动
公开(公告)号：US20150061713A1
公开(公告)日：2015-03-05
申请号：US14013422
申请日：2013-08-29
申请人： David Shia , Todd P. Albertson , Keith J. Mortin
发明人： David Shia , Todd P. Albertson , Keith J. Mortin
IPC分类号： G01R1/067 , G01R3/00
CPC分类号： G01R1/07371 , G01R1/06733 , G01R1/07357 , G01R3/00 , Y10T29/49124
摘要： Wire probes are described that resist rotation during assembly into a probe head of a die tester. One example includes probe wires with a protrusion at a pre-determined position along the length of the wire. A probe substrate with pads on one side each to attach to and electrically connect with a probe wire and a pads on the opposite side to connect to test equipment and a probe holder above the substrate with holes. Each hole holds a respective one of the probe wires against the probe substrate. Each hole also has a key to mate with a protrusion of a respective probe wire so that the protrusions engage the keys to prevent rotation of the respective wire.
摘要翻译：描述了在组装到模具测试器的探针头期间抵抗旋转的线探针。一个例子包括沿导线长度的预定位置具有突起的探针线。探针基板，其一侧具有焊盘，每个探针基板附接到探针线和相对侧上的电极，以连接到测试设备，并且在基板上方具有孔。每个孔将相应的探针线保持在探针基板上。每个孔还具有与相应探针线的突起配合的键，使得突起接合键以防止相应线的旋转。

13. 发明申请

US20140002124A1 Wire Probe Assembly and Forming Process for Die Testing 有权
标题翻译：电线探头组装和模具测试成型工艺
公开(公告)号：US20140002124A1
公开(公告)日：2014-01-02
申请号：US13539391
申请日：2012-06-30
申请人： Todd P. Albertson , Michael T. Crocker , David Shia , Lothar R. Kress
发明人： Todd P. Albertson , Michael T. Crocker , David Shia , Lothar R. Kress
IPC分类号： H05K3/34 , H05K13/00 , G01R1/04
CPC分类号： G01R1/07378 , G01R1/00 , G01R1/07357 , G01R3/00 , G01R31/2889 , H01L21/00 , Y10T29/4913 , Y10T29/49144
摘要： A wire probe assembly and forming process is described. In one example, a method includes inserting a plurality of wires through a probe former and a tip retainer to contact a probe head substrate, attaching the wires to a surface of the substrate, pulling the probe former laterally with respect to the substrate surface and the tip retainer to bend the wires into test probes with a resiliency to transverse movement, and removing the tip retainer to form a test probe head
摘要翻译：描述了线探头组件和成形过程。在一个示例中，一种方法包括：将多条电线插入穿过探针成形器和尖端保持器以接触探头头基片，将电线连接到基片的表面，相对于基片表面侧向拉动探头，尖端保持器将电线弯曲成具有弹性到横向运动的测试探针，并且移除尖端保持器以形成测试头

14. 发明申请

US20050117305A1 Integrated heat sink assembly 审中-公开
标题翻译：集成散热器总成
公开(公告)号：US20050117305A1
公开(公告)日：2005-06-02
申请号：US10725825
申请日：2003-12-01
申请人： Neal Ulen , David Shia , Sandeep Ahuja
发明人： Neal Ulen , David Shia , Sandeep Ahuja
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： Some disclosed embodiments include an integrated heat sink assembly having a standoff press disposed through the bottom of a bore in a support base of the heat sink, a screw disposed through the top of the bore in the support base of the heat sink, a spring adapted to bias the screw against the heat sink, wherein the screw and spring engage the standoff to attach the heat sink to the support base. The integrated heat sink assembly may be used to maintain contact between a heat sink and a processor on a motherboard. Other embodiments are disclosed and claimed.
摘要翻译：一些公开的实施例包括集成散热器组件，其具有穿过散热器的支撑底座中的孔的底部设置的支架压盖，穿过散热器的支撑基座中的孔的顶部设置的螺钉，适于以将所述螺钉偏置抵靠所述散热器，其中所述螺钉和弹簧接合所述支座以将所述散热器附接到所述支撑基座。集成散热器组件可用于保持散热器与主板上的处理器之间的接触。公开和要求保护其他实施例。

15. 发明授权

US06542367B2 Securing heat sinks 失效
公开(公告)号：US06542367B2
公开(公告)日：2003-04-01
申请号：US09871587
申请日：2001-05-31
申请人： David Shia , Thomas J. Wong
发明人： David Shia , Thomas J. Wong
IPC分类号： H05K720
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44026 , Y10T29/4935 , H01L2924/00
摘要： A heat sink retention frame is disposed about an electronic package, and a heat sink is disposed within the heat sink retention frame above the electronic package. A clip is mounted across a lateral edge surface of the heat sink and fastened to the heat sink retention frame. The clip can help hold the heat sink in place during normal operation and can retain the heat sink in the retention frame during mechanical shocks.

16. 发明公开

US20240133945A1 MODULAR LOW LEVEL CONTACT RESISTANCE TESTING APPARATUS FOR PROCESSOR SOCKETS 审中-公开
公开(公告)号：US20240133945A1
公开(公告)日：2024-04-25
申请号：US18401133
申请日：2023-12-29
申请人： Mohanraj Prabhugoud , David Shia , Lejie Liu , Silver Alfonso Rodriguez Estrada , Min Pei , Ralph V. Miele , Caleb Million Tessema
发明人： Mohanraj Prabhugoud , David Shia , Lejie Liu , Silver Alfonso Rodriguez Estrada , Min Pei , Ralph V. Miele , Caleb Million Tessema
IPC分类号： G01R31/28
CPC分类号： G01R31/2863 , G01R31/2808 , G01R31/2886
摘要： A low level contact resistance (LLCR) testing apparatus comprises a test board, an interface board, and a patch board. The test board comprises a processor socket. The interface board connects to both the test board and the patch board. The patch board connects to a contact resistance tester. An LLCR system comprising the LLCR testing apparatus and a contact resistance tester can be portable. The test board can accommodate thermal management solutions of varying sizes and types. Different test board designs can accommodate different socket-processor configurations and the different test boards can be easily accommodated by an LLCR testing apparatus due to its modular design.

17. 发明授权

US08797053B2 Positioning and socketing for semiconductor dice 有权
标题翻译：半导体芯片的定位和插槽
公开(公告)号：US08797053B2
公开(公告)日：2014-08-05
申请号：US13114876
申请日：2011-05-24
申请人： Michael L. Rutigliano , Eric J. M. Moret , David Shia
发明人： Michael L. Rutigliano , Eric J. M. Moret , David Shia
IPC分类号： G01R31/00 , G01R1/073
CPC分类号： G01R1/0735 , G01R31/2891
摘要： Devices and methods useful for testing bare and packaged semiconductor dice are provided. As integrated circuit chips become smaller and increasingly complex, the interface presented by a chip for connectivity with power supplies and other components of the system into which it is integrated similarly becomes smaller and more complex. Embodiments of the invention provide micron-scale accuracy alignment capabilities for fine pitch device first level interconnect areas. Embodiments of the invention employ air-bearings to effectuate the movement and alignment of a device under test with a testing interface. Additionally, testing interfaces comprising membranes supported by thermal fluids are provided.
摘要翻译：提供了用于测试裸机和封装的半导体晶片的器件和方法。随着集成电路芯片变得越来越小，并且越来越复杂，与芯片的电源和系统的其他组件的连接的接口所呈现的接口也变得越来越小，越来越复杂。本发明的实施例提供了用于细间距器件第一级互连区域的微米级精度对准能力。本发明的实施例采用空气轴承来实现被测设备的移动和对准与测试界面。另外，提供了包括由热流体支撑的膜的测试界面。

18. 发明授权

US06519153B1 Heat sink retention frame 失效
标题翻译：散热片固定架
公开(公告)号：US06519153B1
公开(公告)日：2003-02-11
申请号：US09925714
申请日：2001-08-08
申请人： David Shia , Thomas J. Wong
发明人： David Shia , Thomas J. Wong
IPC分类号： H05K720
CPC分类号： H01L23/36 , H01L23/4093 , H01L2924/0002 , Y10T24/44026 , H01L2924/00
摘要： An assembly is disclosed including a printed circuit board, a single piece heat sink retention frame secured to the printed circuit board, the frame comprising four structural members surrounding an aperture, an integrated circuit chip secured to the printed circuit board and positioned within the aperture and a heat sink secured to the frame, the heat sink positioned above the integrated circuit chip and at least partially within the aperture.
摘要翻译：公开了一种组件，其包括印刷电路板，固定到印刷电路板的单件散热器保持框架，该框架包括围绕孔的四个结构构件，固定到印刷电路板并位于孔内的集成电路芯片，以及固定到所述框架的散热器，所述散热器位于所述集成电路芯片上方并且至少部分地位于所述孔内。

19. 发明申请

US20140239995A1 TEST PROBES 有权
标题翻译：测试问题
公开(公告)号：US20140239995A1
公开(公告)日：2014-08-28
申请号：US13976448
申请日：2011-12-31
申请人： Roy E. Swart , Warren S. Crippen , Charlotte C. Kwong , David Shia
发明人： Roy E. Swart , Warren S. Crippen , Charlotte C. Kwong , David Shia
IPC分类号： G01R1/067
CPC分类号： G01R1/06711 , G01R1/07357 , G01R3/00
摘要： The formation of test probe structures is described. One test probe structure includes a tip portion and a handle portion spaced a distance away from the tip portion. The test probe structure also includes a body bend portion positioned between the tip portion and the handle portion, and an intermediate portion positioned between the body bend portion and the handle portion. The body bend portion may include a curved shape extending from the intermediate portion to the tip portion. The tip portion may be formed to be offset from a longitudinal axis defined by the intermediate portion. The test probe structure defines a length and includes a cross-sectional area that is different at a plurality of positions along the length. Other embodiments are described and claimed.
摘要翻译：描述了测试探针结构的形成。一个测试探针结构包括尖端部分和与尖端部分间隔开距离的手柄部分。测试探针结构还包括位于尖端部分和手柄部分之间的身体弯曲部分，以及位于身体弯曲部分和手柄部分之间的中间部分。身体弯曲部分可以包括从中间部分延伸到尖端部分的弯曲形状。尖端部分可以形成为从由中间部分限定的纵向轴线偏移。测试探针结构限定长度并且包括在沿着长度的多个位置处不同的横截面面积。描述和要求保护其他实施例。

20. 发明授权

US07161238B2 Structural reinforcement for electronic substrate 失效
标题翻译：电子基板结构钢筋
公开(公告)号：US07161238B2
公开(公告)日：2007-01-09
申请号：US10335092
申请日：2002-12-31
申请人： George Hsieh , David Shia , Tom E. Pearson
发明人： George Hsieh , David Shia , Tom E. Pearson
IPC分类号： H01L23/12
CPC分类号： H01L23/42 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H05K1/0271 , H05K3/301 , H05K3/3447 , H05K2201/10734 , H05K2201/2009 , H01L2224/0401
摘要： Embodiments of stiffening members in accordance with the present invention provide a mechanical support that is wave soldered to the frontside of the system substrate simultaneously with other wave soldered components. The stiffening member comprises a flat plate with a plurality of mounting pins. The number of mounting pins are predetermined to provide the plate with sufficient support to resist expected loading conditions when wave soldered in plated through holes on a system substrate. The mounting pins are adapted for insertion into plated through holes on the system substrate. The length of the mounting pins are predetermined to account for the height of the SMT component upon which it is attached, the thickness of the system substrate, and the desired amount of mounting pin protrusion from the backside of the system substrate. The stiffening members consume very little system substrate space while retaining a platform for heat dissipation.
摘要翻译：根据本发明的加强构件的实施例提供了与其它波形焊接部件同时波纹焊接到系统基板的前侧的机械支撑。加强构件包括具有多个安装销的平板。安装销的数量是预定的，以便在波形焊接在系统基板上的通孔中时，为板提供足够的支撑以抵抗预期的负载状况。安装销适于插入系统基板上的电镀通孔中。安装销的长度是预先确定的，以考虑其附接的SMT部件的高度，系统基板的厚度以及从系统基板的背面的期望的安装销突出量。加强构件消耗非常小的系统基板空间，同时保留用于散热的平台。

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